JPS5335373A - Working method of semiconductor wafers - Google Patents

Working method of semiconductor wafers

Info

Publication number
JPS5335373A
JPS5335373A JP10958976A JP10958976A JPS5335373A JP S5335373 A JPS5335373 A JP S5335373A JP 10958976 A JP10958976 A JP 10958976A JP 10958976 A JP10958976 A JP 10958976A JP S5335373 A JPS5335373 A JP S5335373A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
working method
wafers
peel
dissolving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10958976A
Other languages
Japanese (ja)
Inventor
Tsutomu Koshimura
Kazuharu Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10958976A priority Critical patent/JPS5335373A/en
Publication of JPS5335373A publication Critical patent/JPS5335373A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Abstract

PURPOSE:To peel wafers from a polishing tool and clean them by dissolving a wafer affixing agent with organic solvent vapor.
JP10958976A 1976-09-13 1976-09-13 Working method of semiconductor wafers Pending JPS5335373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10958976A JPS5335373A (en) 1976-09-13 1976-09-13 Working method of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10958976A JPS5335373A (en) 1976-09-13 1976-09-13 Working method of semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS5335373A true JPS5335373A (en) 1978-04-01

Family

ID=14514082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10958976A Pending JPS5335373A (en) 1976-09-13 1976-09-13 Working method of semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5335373A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60168703U (en) * 1984-04-18 1985-11-08 三晃金属工業株式会社 mounting bracket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60168703U (en) * 1984-04-18 1985-11-08 三晃金属工業株式会社 mounting bracket

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