JPS5332675A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5332675A JPS5332675A JP10739276A JP10739276A JPS5332675A JP S5332675 A JPS5332675 A JP S5332675A JP 10739276 A JP10739276 A JP 10739276A JP 10739276 A JP10739276 A JP 10739276A JP S5332675 A JPS5332675 A JP S5332675A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- plating
- plating process
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 238000007747 plating Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 238000013019 agitation Methods 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10739276A JPS5332675A (en) | 1976-09-07 | 1976-09-07 | Production of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10739276A JPS5332675A (en) | 1976-09-07 | 1976-09-07 | Production of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5332675A true JPS5332675A (en) | 1978-03-28 |
| JPS5653858B2 JPS5653858B2 (enrdf_load_stackoverflow) | 1981-12-22 |
Family
ID=14457960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10739276A Granted JPS5332675A (en) | 1976-09-07 | 1976-09-07 | Production of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5332675A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54162468A (en) * | 1978-06-13 | 1979-12-24 | Nec Corp | Manufacture for semiconductor device |
| US4942455A (en) * | 1986-10-13 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame |
-
1976
- 1976-09-07 JP JP10739276A patent/JPS5332675A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54162468A (en) * | 1978-06-13 | 1979-12-24 | Nec Corp | Manufacture for semiconductor device |
| US4942455A (en) * | 1986-10-13 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame |
| US5026669A (en) * | 1986-10-13 | 1991-06-25 | Mitsubishi Denki Kabushiki Kaisha | Method of eliminating burrs on a lead frame with a thin metal coating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5653858B2 (enrdf_load_stackoverflow) | 1981-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20071207 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20081207 |
|
| LAPS | Cancellation because of no payment of annual fees |