JPS5321572A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5321572A
JPS5321572A JP9585576A JP9585576A JPS5321572A JP S5321572 A JPS5321572 A JP S5321572A JP 9585576 A JP9585576 A JP 9585576A JP 9585576 A JP9585576 A JP 9585576A JP S5321572 A JPS5321572 A JP S5321572A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
subjecting
semiconductor substrate
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9585576A
Other languages
English (en)
Other versions
JPS5819125B2 (ja
Inventor
Tomoyuki Tanaka
Toshikatsu Shirasawa
Masahiro Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51095855A priority Critical patent/JPS5819125B2/ja
Priority to US05/820,698 priority patent/US4201598A/en
Priority to DE19772736250 priority patent/DE2736250A1/de
Publication of JPS5321572A publication Critical patent/JPS5321572A/ja
Publication of JPS5819125B2 publication Critical patent/JPS5819125B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/904—Charge carrier lifetime control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
  • Bipolar Transistors (AREA)
  • Glass Compositions (AREA)
JP51095855A 1976-08-11 1976-08-11 半導体装置の製造方法 Expired JPS5819125B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP51095855A JPS5819125B2 (ja) 1976-08-11 1976-08-11 半導体装置の製造方法
US05/820,698 US4201598A (en) 1976-08-11 1977-08-01 Electron irradiation process of glass passivated semiconductor devices for improved reverse characteristics
DE19772736250 DE2736250A1 (de) 1976-08-11 1977-08-11 Halbleiterelemente und verfahren zu deren herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51095855A JPS5819125B2 (ja) 1976-08-11 1976-08-11 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5321572A true JPS5321572A (en) 1978-02-28
JPS5819125B2 JPS5819125B2 (ja) 1983-04-16

Family

ID=14148971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51095855A Expired JPS5819125B2 (ja) 1976-08-11 1976-08-11 半導体装置の製造方法

Country Status (3)

Country Link
US (1) US4201598A (ja)
JP (1) JPS5819125B2 (ja)
DE (1) DE2736250A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5533020A (en) * 1978-08-28 1980-03-08 Mitsubishi Electric Corp Manufacture of semiconductor device
JP2016063220A (ja) * 2014-09-15 2016-04-25 アーベーベー・テクノロジー・アーゲー 高周波パワーダイオードおよび高周波パワーダイオードを製造するための製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5395581A (en) * 1977-02-02 1978-08-21 Hitachi Ltd Manufacture for semiconductor device
US4137099A (en) * 1977-07-11 1979-01-30 General Electric Company Method of controlling leakage currents and reverse recovery time of rectifiers by hot electron irradiation and post-annealing treatments
US4168960A (en) * 1978-04-18 1979-09-25 Westinghouse Electric Corp. Method of making a glass encapsulated diode
US4328610A (en) * 1980-04-25 1982-05-11 Burroughs Corporation Method of reducing alpha-particle induced errors in an integrated circuit
JPS61103013A (ja) * 1984-10-24 1986-05-21 Hitachi Ltd スクリユ−圧縮機のスラスト軸受外輪の固定装置
JPH0518490Y2 (ja) * 1987-09-29 1993-05-17
US5017508A (en) * 1989-06-29 1991-05-21 Ixys Corporation Method of annealing fully-fabricated, radiation damaged semiconductor devices
JPH0361470U (ja) * 1989-10-20 1991-06-17
US5284780A (en) * 1989-09-28 1994-02-08 Siemens Aktiengesellschaft Method for increasing the electric strength of a multi-layer semiconductor component
DE3940723A1 (de) * 1989-12-09 1991-06-20 Eupec Gmbh & Co Kg Verfahren zur erzeugung von ladungstraegerlebensdauerprofilen in einem halbleiter
US6355493B1 (en) 1999-07-07 2002-03-12 Silicon Wafer Technologies Inc. Method for forming IC's comprising a highly-resistive or semi-insulating semiconductor substrate having a thin, low resistance active semiconductor layer thereon
KR101753740B1 (ko) 2009-04-28 2017-07-04 삼성전자주식회사 광학 재료, 광학 부품 및 방법
KR101924080B1 (ko) 2009-11-11 2018-11-30 삼성 리서치 아메리카 인코포레이티드 양자점을 포함하는 디바이스
WO2018026402A1 (en) * 2016-08-03 2018-02-08 Ferro Corporation Passivation glasses for semiconductor devices
EP4089719A1 (en) 2021-05-11 2022-11-16 Hitachi Energy Switzerland AG Method for producing a silicon carbide substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505571A (en) * 1965-09-30 1970-04-07 Gen Electric Glass covered semiconductor device
JPS4810925B1 (ja) * 1969-09-27 1973-04-09
US3752701A (en) * 1970-07-27 1973-08-14 Gen Instrument Corp Glass for coating semiconductors, and semiconductor coated therewith
JPS5134265B2 (ja) * 1972-05-12 1976-09-25
US3881964A (en) * 1973-03-05 1975-05-06 Westinghouse Electric Corp Annealing to control gate sensitivity of gated semiconductor devices
US3933527A (en) * 1973-03-09 1976-01-20 Westinghouse Electric Corporation Fine tuning power diodes with irradiation
DE2517743C3 (de) * 1975-04-22 1980-03-06 Jenaer Glaswerk Schott & Gen., 6500 Mainz Passivierender Schutzüberzug für Siliziumhalbleiterbauelemente
US3996602A (en) * 1975-08-14 1976-12-07 General Instrument Corporation Passivated and encapsulated semiconductors and method of making same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5533020A (en) * 1978-08-28 1980-03-08 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS6152976B2 (ja) * 1978-08-28 1986-11-15 Mitsubishi Electric Corp
JP2016063220A (ja) * 2014-09-15 2016-04-25 アーベーベー・テクノロジー・アーゲー 高周波パワーダイオードおよび高周波パワーダイオードを製造するための製造方法

Also Published As

Publication number Publication date
DE2736250A1 (de) 1978-02-16
US4201598A (en) 1980-05-06
JPS5819125B2 (ja) 1983-04-16

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