JPS5315782A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5315782A
JPS5315782A JP9064076A JP9064076A JPS5315782A JP S5315782 A JPS5315782 A JP S5315782A JP 9064076 A JP9064076 A JP 9064076A JP 9064076 A JP9064076 A JP 9064076A JP S5315782 A JPS5315782 A JP S5315782A
Authority
JP
Japan
Prior art keywords
wafer
regions
stepping
semiconductor device
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9064076A
Other languages
Japanese (ja)
Other versions
JPS5917854B2 (en
Inventor
Akira Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP51090640A priority Critical patent/JPS5917854B2/en
Publication of JPS5315782A publication Critical patent/JPS5315782A/en
Publication of JPS5917854B2 publication Critical patent/JPS5917854B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To increase dielectric strength with the spaces in stepping regions and make mechanical impact does not affects on the wafer directly, by opposing the mesa shaped parts of a semiconductor wafer and the regions outward therefrom to the stepping regions of a metal electrode of an outside diameter larger than the wafer and having the stepping regions on the circumference and securing the wafer to the electrode.
COPYRIGHT: (C)1978,JPO&Japio
JP51090640A 1976-07-28 1976-07-28 semiconductor equipment Expired JPS5917854B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51090640A JPS5917854B2 (en) 1976-07-28 1976-07-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51090640A JPS5917854B2 (en) 1976-07-28 1976-07-28 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5315782A true JPS5315782A (en) 1978-02-14
JPS5917854B2 JPS5917854B2 (en) 1984-04-24

Family

ID=14004087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51090640A Expired JPS5917854B2 (en) 1976-07-28 1976-07-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5917854B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744562U (en) * 1980-08-25 1982-03-11
US20180286703A1 (en) * 2017-03-31 2018-10-04 Sansha Electric Manufacturing Co., Ltd. Laminated Member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50119573A (en) * 1974-03-02 1975-09-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50119573A (en) * 1974-03-02 1975-09-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744562U (en) * 1980-08-25 1982-03-11
US20180286703A1 (en) * 2017-03-31 2018-10-04 Sansha Electric Manufacturing Co., Ltd. Laminated Member
JP2018174280A (en) * 2017-03-31 2018-11-08 株式会社三社電機製作所 Manufacturing method of lamination member
US10515826B2 (en) 2017-03-31 2019-12-24 Sansha Electric Manufacturing Co., Ltd. Laminated member

Also Published As

Publication number Publication date
JPS5917854B2 (en) 1984-04-24

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