JPS53148967A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS53148967A
JPS53148967A JP6440977A JP6440977A JPS53148967A JP S53148967 A JPS53148967 A JP S53148967A JP 6440977 A JP6440977 A JP 6440977A JP 6440977 A JP6440977 A JP 6440977A JP S53148967 A JPS53148967 A JP S53148967A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
metal film
metal
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6440977A
Other languages
Japanese (ja)
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6440977A priority Critical patent/JPS53148967A/en
Publication of JPS53148967A publication Critical patent/JPS53148967A/en
Priority to US06/082,426 priority patent/US4293637A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE:To produce the electrodes which are attached rigidly with a uniform height by covering the aperture of the insulator film on the external lead-out electrode pattern with a metal film, forming a metal projection whose resist remains at the periphery and then etching selectively the metal film.
JP6440977A 1977-05-31 1977-05-31 Manufacture of semiconductor device Pending JPS53148967A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6440977A JPS53148967A (en) 1977-05-31 1977-05-31 Manufacture of semiconductor device
US06/082,426 US4293637A (en) 1977-05-31 1979-10-05 Method of making metal electrode of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6440977A JPS53148967A (en) 1977-05-31 1977-05-31 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53148967A true JPS53148967A (en) 1978-12-26

Family

ID=13257467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6440977A Pending JPS53148967A (en) 1977-05-31 1977-05-31 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53148967A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617043A (en) * 1979-07-20 1981-02-18 Hitachi Ltd Manufacture of salient electrode for semiconductor element
JPS5696893A (en) * 1979-12-29 1981-08-05 Nitto Electric Ind Co Method of manufacturing printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504312A (en) * 1972-12-04 1975-01-17
JPS504321A (en) * 1973-05-18 1975-01-17
JPS52670A (en) * 1975-06-13 1977-01-06 Fumio Ozawa Sonar

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504312A (en) * 1972-12-04 1975-01-17
JPS504321A (en) * 1973-05-18 1975-01-17
JPS52670A (en) * 1975-06-13 1977-01-06 Fumio Ozawa Sonar

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617043A (en) * 1979-07-20 1981-02-18 Hitachi Ltd Manufacture of salient electrode for semiconductor element
JPS5696893A (en) * 1979-12-29 1981-08-05 Nitto Electric Ind Co Method of manufacturing printed circuit board

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