JPS53119872U - - Google Patents

Info

Publication number
JPS53119872U
JPS53119872U JP1978012720U JP1272078U JPS53119872U JP S53119872 U JPS53119872 U JP S53119872U JP 1978012720 U JP1978012720 U JP 1978012720U JP 1272078 U JP1272078 U JP 1272078U JP S53119872 U JPS53119872 U JP S53119872U
Authority
JP
Japan
Prior art keywords
layer
semi
doped region
conductor
june
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1978012720U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS53119872U publication Critical patent/JPS53119872U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • H01L33/42Transparent materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12036PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)
JP1978012720U 1974-06-12 1978-02-06 Pending JPS53119872U (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7407812A NL7407812A (nl) 1974-06-12 1974-06-12 Elektroluminescerende halfgeleiderinrichting.

Publications (1)

Publication Number Publication Date
JPS53119872U true JPS53119872U (ja) 1978-09-22

Family

ID=19821526

Family Applications (2)

Application Number Title Priority Date Filing Date
JP7072075A Pending JPS5111388A (ja) 1974-06-12 1975-06-11
JP1978012720U Pending JPS53119872U (ja) 1974-06-12 1978-02-06

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP7072075A Pending JPS5111388A (ja) 1974-06-12 1975-06-11

Country Status (9)

Country Link
JP (2) JPS5111388A (ja)
AU (1) AU498171B2 (ja)
CA (1) CA1030643A (ja)
CH (1) CH588168A5 (ja)
DE (1) DE2523963A1 (ja)
FR (1) FR2275031A1 (ja)
GB (1) GB1503545A (ja)
IT (1) IT1038801B (ja)
NL (1) NL7407812A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051216A (ja) * 2001-08-07 2003-02-21 Furukawa Electric Co Ltd:The 海底布設長尺体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851873A (ja) * 1971-11-02 1973-07-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4851873A (ja) * 1971-11-02 1973-07-20

Also Published As

Publication number Publication date
AU8200975A (en) 1976-12-16
CA1030643A (en) 1978-05-02
FR2275031B1 (ja) 1978-10-27
NL7407812A (nl) 1975-12-16
AU498171B2 (en) 1979-02-15
DE2523963A1 (de) 1976-01-02
GB1503545A (en) 1978-03-15
IT1038801B (it) 1979-11-30
FR2275031A1 (fr) 1976-01-09
CH588168A5 (ja) 1977-05-31
JPS5111388A (ja) 1976-01-29

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