GB1024166A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1024166A
GB1024166A GB51338/63A GB5133863A GB1024166A GB 1024166 A GB1024166 A GB 1024166A GB 51338/63 A GB51338/63 A GB 51338/63A GB 5133863 A GB5133863 A GB 5133863A GB 1024166 A GB1024166 A GB 1024166A
Authority
GB
United Kingdom
Prior art keywords
base
silicon
emitter
relating
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB51338/63A
Inventor
Barry Page
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB51338/63A priority Critical patent/GB1024166A/en
Priority to DEST23081A priority patent/DE1293906B/en
Publication of GB1024166A publication Critical patent/GB1024166A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/486Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48617Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)

Abstract

1,024,166. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. Dec. 31, 1963, No. 51338/63. Heading H1K. A silicon planar transistor comprises interdigitated emitter and base contacts of specified dimensions and, as shown in Fig. 1, the emitter 9 and base 1 contacts consisting of aluminium applied to N and P regions respectively which have been provided by diffusion into an N-type epitaxially deposited layer of silicon on a low resistivity substrate. The PN junctions are covered with silicon oxide at the surface and a gold wire is ball bonded on to the base contact area.
GB51338/63A 1963-12-31 1963-12-31 Improvements in or relating to semiconductor devices Expired GB1024166A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB51338/63A GB1024166A (en) 1963-12-31 1963-12-31 Improvements in or relating to semiconductor devices
DEST23081A DE1293906B (en) 1963-12-31 1964-12-15 Silicon planar transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB51338/63A GB1024166A (en) 1963-12-31 1963-12-31 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1024166A true GB1024166A (en) 1966-03-30

Family

ID=10459611

Family Applications (1)

Application Number Title Priority Date Filing Date
GB51338/63A Expired GB1024166A (en) 1963-12-31 1963-12-31 Improvements in or relating to semiconductor devices

Country Status (2)

Country Link
DE (1) DE1293906B (en)
GB (1) GB1024166A (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3083441A (en) * 1959-04-13 1963-04-02 Texas Instruments Inc Method for fabricating transistors
FR1335510A (en) * 1960-09-09 1963-08-23 Texas Instruments Inc Silicon transistors for high currents
FR1301563A (en) * 1960-09-21 1962-08-17 Ass Elect Ind Improvements to dielectric devices

Also Published As

Publication number Publication date
DE1293906B (en) 1969-04-30

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