JPS5269557A - Processing method of semiconductor wafer - Google Patents

Processing method of semiconductor wafer

Info

Publication number
JPS5269557A
JPS5269557A JP14605075A JP14605075A JPS5269557A JP S5269557 A JPS5269557 A JP S5269557A JP 14605075 A JP14605075 A JP 14605075A JP 14605075 A JP14605075 A JP 14605075A JP S5269557 A JPS5269557 A JP S5269557A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
processing method
irrabiating
electro
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14605075A
Other languages
Japanese (ja)
Inventor
Masaaki Sadamori
Akio Hiruki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14605075A priority Critical patent/JPS5269557A/en
Publication of JPS5269557A publication Critical patent/JPS5269557A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

PURPOSE: To ensure quick drying processing with high throw-in efficiency and without any contamination by irrabiating electro-magnetic wave of ultra high frequency to semiconductor wafer.
COPYRIGHT: (C)1977,JPO&Japio
JP14605075A 1975-12-08 1975-12-08 Processing method of semiconductor wafer Pending JPS5269557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14605075A JPS5269557A (en) 1975-12-08 1975-12-08 Processing method of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14605075A JPS5269557A (en) 1975-12-08 1975-12-08 Processing method of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5269557A true JPS5269557A (en) 1977-06-09

Family

ID=15398953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14605075A Pending JPS5269557A (en) 1975-12-08 1975-12-08 Processing method of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5269557A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691432A (en) * 1979-12-25 1981-07-24 Fujitsu Ltd Method for drying semiconductor substrate
JPS5736833A (en) * 1980-08-15 1982-02-27 Hitachi Ltd Cleaning of wafer
JPS5954924U (en) * 1982-10-01 1984-04-10 ソニー株式会社 drying equipment
JP2009530810A (en) * 2006-03-13 2009-08-27 アール・イー・シー・スキャンウェハー・アー・エス Method for individually separating a plurality of wafers from a stack of wafers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5069972A (en) * 1973-05-29 1975-06-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5069972A (en) * 1973-05-29 1975-06-11

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691432A (en) * 1979-12-25 1981-07-24 Fujitsu Ltd Method for drying semiconductor substrate
JPS5736833A (en) * 1980-08-15 1982-02-27 Hitachi Ltd Cleaning of wafer
JPS5954924U (en) * 1982-10-01 1984-04-10 ソニー株式会社 drying equipment
JP2009530810A (en) * 2006-03-13 2009-08-27 アール・イー・シー・スキャンウェハー・アー・エス Method for individually separating a plurality of wafers from a stack of wafers

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