JPS5260070A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5260070A
JPS5260070A JP50135815A JP13581575A JPS5260070A JP S5260070 A JPS5260070 A JP S5260070A JP 50135815 A JP50135815 A JP 50135815A JP 13581575 A JP13581575 A JP 13581575A JP S5260070 A JPS5260070 A JP S5260070A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
glass coating
crazing
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50135815A
Other languages
Japanese (ja)
Inventor
Masao Aiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50135815A priority Critical patent/JPS5260070A/en
Publication of JPS5260070A publication Critical patent/JPS5260070A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To prevent the crazing of glass coating and obtain a semiconductor device of good moisture resistance, by forming a bump electrode with formation of a dense oxide film and glass coating on an Al wiring layer.
COPYRIGHT: (C)1977,JPO&Japio
JP50135815A 1975-11-12 1975-11-12 Production of semiconductor device Pending JPS5260070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50135815A JPS5260070A (en) 1975-11-12 1975-11-12 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50135815A JPS5260070A (en) 1975-11-12 1975-11-12 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5260070A true JPS5260070A (en) 1977-05-18

Family

ID=15160445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50135815A Pending JPS5260070A (en) 1975-11-12 1975-11-12 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5260070A (en)

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