JPS5251867A - Bonding wire for semiconductor device - Google Patents

Bonding wire for semiconductor device

Info

Publication number
JPS5251867A
JPS5251867A JP50127677A JP12767775A JPS5251867A JP S5251867 A JPS5251867 A JP S5251867A JP 50127677 A JP50127677 A JP 50127677A JP 12767775 A JP12767775 A JP 12767775A JP S5251867 A JPS5251867 A JP S5251867A
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding wire
bonding
prepare
material suitable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50127677A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5423796B2 (enrdf_load_stackoverflow
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50127677A priority Critical patent/JPS5251867A/ja
Publication of JPS5251867A publication Critical patent/JPS5251867A/ja
Publication of JPS5423796B2 publication Critical patent/JPS5423796B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01205—5N purity grades, i.e. 99.999%

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP50127677A 1975-10-23 1975-10-23 Bonding wire for semiconductor device Granted JPS5251867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50127677A JPS5251867A (en) 1975-10-23 1975-10-23 Bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50127677A JPS5251867A (en) 1975-10-23 1975-10-23 Bonding wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5251867A true JPS5251867A (en) 1977-04-26
JPS5423796B2 JPS5423796B2 (enrdf_load_stackoverflow) 1979-08-16

Family

ID=14965972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50127677A Granted JPS5251867A (en) 1975-10-23 1975-10-23 Bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5251867A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676556A (en) * 1979-11-28 1981-06-24 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS5688329A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5688328A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5696844A (en) * 1979-12-29 1981-08-05 Tanaka Denshi Kogyo Kk Semiconductor element
JPS56115543A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS56115544A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
DE3506264A1 (de) * 1984-02-24 1985-08-29 Hitachi, Ltd., Tokio/Tokyo Halbleitervorrichtung
JPH02215140A (ja) * 1989-02-16 1990-08-28 Mitsubishi Metal Corp 半導体素子用金合金細線及びその接合方法
US6242106B1 (en) 1998-05-13 2001-06-05 W. C. Hereaeus Gmbh & Co. Kg Fine wire made of a gold alloy, method for its production, and its use
WO2008132919A1 (ja) 2007-04-17 2008-11-06 Tanaka Denshi Kogyo K.K. 高信頼性金合金ボンディングワイヤ及び半導体装置
DE112011100491T5 (de) 2011-06-10 2013-06-13 Tanaka Denshi Kogyo K.K. Bonddraht aus Au-Legierung mit hoher Festigkeit und hoher Dehnungsrate

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676556A (en) * 1979-11-28 1981-06-24 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS5688329A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5688328A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5696844A (en) * 1979-12-29 1981-08-05 Tanaka Denshi Kogyo Kk Semiconductor element
JPS56115543A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS56115544A (en) * 1980-02-15 1981-09-10 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
DE3506264A1 (de) * 1984-02-24 1985-08-29 Hitachi, Ltd., Tokio/Tokyo Halbleitervorrichtung
JPH02215140A (ja) * 1989-02-16 1990-08-28 Mitsubishi Metal Corp 半導体素子用金合金細線及びその接合方法
US6242106B1 (en) 1998-05-13 2001-06-05 W. C. Hereaeus Gmbh & Co. Kg Fine wire made of a gold alloy, method for its production, and its use
WO2008132919A1 (ja) 2007-04-17 2008-11-06 Tanaka Denshi Kogyo K.K. 高信頼性金合金ボンディングワイヤ及び半導体装置
DE112011100491T5 (de) 2011-06-10 2013-06-13 Tanaka Denshi Kogyo K.K. Bonddraht aus Au-Legierung mit hoher Festigkeit und hoher Dehnungsrate

Also Published As

Publication number Publication date
JPS5423796B2 (enrdf_load_stackoverflow) 1979-08-16

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