JPS5218171A - Die-bonder - Google Patents

Die-bonder

Info

Publication number
JPS5218171A
JPS5218171A JP50093938A JP9393875A JPS5218171A JP S5218171 A JPS5218171 A JP S5218171A JP 50093938 A JP50093938 A JP 50093938A JP 9393875 A JP9393875 A JP 9393875A JP S5218171 A JPS5218171 A JP S5218171A
Authority
JP
Japan
Prior art keywords
die
bonder
absorving
electromagnet
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50093938A
Other languages
Japanese (ja)
Inventor
Michio Asahina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP50093938A priority Critical patent/JPS5218171A/en
Publication of JPS5218171A publication Critical patent/JPS5218171A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Abstract

PURPOSE: In order to realize the accuracy and high speed of die-bond, by means of absorving a chip with an electromagnet through making its frame with magnetic materials.
COPYRIGHT: (C)1977,JPO&Japio
JP50093938A 1975-08-01 1975-08-01 Die-bonder Pending JPS5218171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50093938A JPS5218171A (en) 1975-08-01 1975-08-01 Die-bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50093938A JPS5218171A (en) 1975-08-01 1975-08-01 Die-bonder

Publications (1)

Publication Number Publication Date
JPS5218171A true JPS5218171A (en) 1977-02-10

Family

ID=14096366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50093938A Pending JPS5218171A (en) 1975-08-01 1975-08-01 Die-bonder

Country Status (1)

Country Link
JP (1) JPS5218171A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525389U (en) * 1978-08-08 1980-02-19
DE3220035A1 (en) * 1981-05-28 1983-01-27 Kao Soap Co., Ltd., Tokyo METHOD FOR PRODUCING 2-HYDROXYALKOXYPROPYLGLYCERYLAETHER
DE3341366A1 (en) * 1982-11-16 1984-05-17 Kao Corp., Tokyo POLYOLETHER COMPOUND, METHOD FOR PRODUCING THE SAME AND COSMETIC AGENTS WITH A CONTENT THEREOF
DE3427093A1 (en) * 1983-07-25 1985-02-07 Kao Corp., Tokio/Tokyo NEW POLYOLETHER COMPOUNDS, METHOD FOR PRODUCING THE SAME AND COSMETICS WITH A CONTENT THEREOF
US4815595A (en) * 1986-12-03 1989-03-28 Sgs-Thomson Microelectronics, Inc. Uniform leadframe carrier
US5111935A (en) * 1986-12-03 1992-05-12 Sgs-Thomson Microelectronics, Inc. Universal leadframe carrier

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525389U (en) * 1978-08-08 1980-02-19
DE3220035A1 (en) * 1981-05-28 1983-01-27 Kao Soap Co., Ltd., Tokyo METHOD FOR PRODUCING 2-HYDROXYALKOXYPROPYLGLYCERYLAETHER
DE3341366A1 (en) * 1982-11-16 1984-05-17 Kao Corp., Tokyo POLYOLETHER COMPOUND, METHOD FOR PRODUCING THE SAME AND COSMETIC AGENTS WITH A CONTENT THEREOF
DE3341366C2 (en) * 1982-11-16 1993-03-25 Kao Corp., Tokio/Tokyo, Jp
DE3427093A1 (en) * 1983-07-25 1985-02-07 Kao Corp., Tokio/Tokyo NEW POLYOLETHER COMPOUNDS, METHOD FOR PRODUCING THE SAME AND COSMETICS WITH A CONTENT THEREOF
US4815595A (en) * 1986-12-03 1989-03-28 Sgs-Thomson Microelectronics, Inc. Uniform leadframe carrier
US5111935A (en) * 1986-12-03 1992-05-12 Sgs-Thomson Microelectronics, Inc. Universal leadframe carrier

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