JPS523384A - Comb teeth shaped conductor for semiconductor elements or integrated circuits - Google Patents
Comb teeth shaped conductor for semiconductor elements or integrated circuitsInfo
- Publication number
- JPS523384A JPS523384A JP7497076A JP7497076A JPS523384A JP S523384 A JPS523384 A JP S523384A JP 7497076 A JP7497076 A JP 7497076A JP 7497076 A JP7497076 A JP 7497076A JP S523384 A JPS523384 A JP S523384A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuits
- semiconductor elements
- comb teeth
- shaped conductor
- teeth shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752528119 DE2528119A1 (de) | 1975-06-24 | 1975-06-24 | Elektrisch leitendes band |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS523384A true JPS523384A (en) | 1977-01-11 |
Family
ID=5949834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7497076A Pending JPS523384A (en) | 1975-06-24 | 1976-06-24 | Comb teeth shaped conductor for semiconductor elements or integrated circuits |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS523384A (de) |
DE (1) | DE2528119A1 (de) |
FR (1) | FR2315770A1 (de) |
GB (1) | GB1511415A (de) |
IT (1) | IT1064051B (de) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5793559A (en) * | 1980-12-03 | 1982-06-10 | Nec Corp | Semiconductor device |
JPS57117265A (en) * | 1981-01-13 | 1982-07-21 | Nec Corp | Semiconductor device |
JPS57134941A (en) * | 1981-02-13 | 1982-08-20 | Nec Corp | Semiconductor device |
JPS57145356A (en) * | 1981-03-03 | 1982-09-08 | Nec Corp | Semiconductor device |
JPS59128736U (ja) * | 1984-01-17 | 1984-08-30 | 日本電気株式会社 | 半導体集積回路装置 |
JPS6359593A (ja) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | 携帯可能媒体における実装方法 |
JP2012152984A (ja) * | 2011-01-25 | 2012-08-16 | Canon Inc | 液体吐出ヘッドおよび液体吐出ヘッドの製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
AU2003216033A1 (en) * | 2003-02-24 | 2004-09-17 | Infineon Technologies Ag | A plastics leadframe and an integrated circuit package fabricated using the leadframe |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1193519A (en) * | 1967-08-31 | 1970-06-03 | Texas Instruments Ltd | Semiconductor Devices |
GB1306031A (de) * | 1971-01-01 | 1973-02-07 | ||
US3777365A (en) * | 1972-03-06 | 1973-12-11 | Honeywell Inf Systems | Circuit chips having beam leads attached by film strip process |
-
1975
- 1975-06-24 DE DE19752528119 patent/DE2528119A1/de not_active Ceased
-
1976
- 1976-04-27 GB GB1695676A patent/GB1511415A/en not_active Expired
- 1976-06-21 FR FR7618807A patent/FR2315770A1/fr active Granted
- 1976-06-22 IT IT2454076A patent/IT1064051B/it active
- 1976-06-24 JP JP7497076A patent/JPS523384A/ja active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5793559A (en) * | 1980-12-03 | 1982-06-10 | Nec Corp | Semiconductor device |
JPS6132822B2 (de) * | 1980-12-03 | 1986-07-29 | Nippon Electric Co | |
JPS57117265A (en) * | 1981-01-13 | 1982-07-21 | Nec Corp | Semiconductor device |
JPH04387B2 (de) * | 1981-01-13 | 1992-01-07 | Nippon Electric Co | |
JPS57134941A (en) * | 1981-02-13 | 1982-08-20 | Nec Corp | Semiconductor device |
JPS57145356A (en) * | 1981-03-03 | 1982-09-08 | Nec Corp | Semiconductor device |
JPS6216544B2 (de) * | 1981-03-03 | 1987-04-13 | Nippon Electric Co | |
JPS59128736U (ja) * | 1984-01-17 | 1984-08-30 | 日本電気株式会社 | 半導体集積回路装置 |
JPS6214689Y2 (de) * | 1984-01-17 | 1987-04-15 | ||
JPS6359593A (ja) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | 携帯可能媒体における実装方法 |
JP2012152984A (ja) * | 2011-01-25 | 2012-08-16 | Canon Inc | 液体吐出ヘッドおよび液体吐出ヘッドの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
IT1064051B (it) | 1985-02-18 |
GB1511415A (en) | 1978-05-17 |
DE2528119A1 (de) | 1977-01-20 |
FR2315770B1 (de) | 1982-10-22 |
FR2315770A1 (fr) | 1977-01-21 |
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