JPS52151636A - Composition for sensitizing treatment - Google Patents

Composition for sensitizing treatment

Info

Publication number
JPS52151636A
JPS52151636A JP4402677A JP4402677A JPS52151636A JP S52151636 A JPS52151636 A JP S52151636A JP 4402677 A JP4402677 A JP 4402677A JP 4402677 A JP4402677 A JP 4402677A JP S52151636 A JPS52151636 A JP S52151636A
Authority
JP
Japan
Prior art keywords
composition
sensitizing treatment
sensitizing
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4402677A
Other languages
English (en)
Other versions
JPS5726344B2 (ja
Inventor
Jiyosefu Nutsuchi Furanshisu
Porishietsuto Jiyosefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of JPS52151636A publication Critical patent/JPS52151636A/ja
Publication of JPS5726344B2 publication Critical patent/JPS5726344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Decoration Of Textiles (AREA)
JP4402677A 1971-07-29 1977-04-14 Composition for sensitizing treatment Granted JPS52151636A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16750671A 1971-07-29 1971-07-29

Publications (2)

Publication Number Publication Date
JPS52151636A true JPS52151636A (en) 1977-12-16
JPS5726344B2 JPS5726344B2 (ja) 1982-06-03

Family

ID=22607641

Family Applications (3)

Application Number Title Priority Date Filing Date
JP7641472A Pending JPS533732B1 (ja) 1971-07-29 1972-07-29
JP4402577A Granted JPS52155138A (en) 1971-07-29 1977-04-14 Production method of metallized products
JP4402677A Granted JPS52151636A (en) 1971-07-29 1977-04-14 Composition for sensitizing treatment

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP7641472A Pending JPS533732B1 (ja) 1971-07-29 1972-07-29
JP4402577A Granted JPS52155138A (en) 1971-07-29 1977-04-14 Production method of metallized products

Country Status (11)

Country Link
JP (3) JPS533732B1 (ja)
AT (1) AT316956B (ja)
AU (1) AU462961B2 (ja)
CA (1) CA968908A (ja)
CH (1) CH606204A5 (ja)
DK (1) DK145681C (ja)
FR (1) FR2147338B1 (ja)
GB (1) GB1397091A (ja)
IT (1) IT961765B (ja)
NL (1) NL174739C (ja)
SE (1) SE385129B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921749A (en) * 1986-05-30 1990-05-01 Exxon Chemical Patents Inc. Sealable films
JP2015017326A (ja) * 2013-06-28 2015-01-29 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． ５員複素環式窒素化合物を含有する無電解メタライゼーション触媒

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
JPS6079604A (ja) * 1983-10-05 1985-05-07 株式会社村田製作所 ポリアクリロニトリル導電性フイルムの製造方法
DE3417563C2 (de) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
TWI348499B (en) 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
TWI347373B (en) 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
TWI347982B (en) 2006-07-07 2011-09-01 Rohm & Haas Elect Mat Improved electroless copper compositions
KR20140019175A (ko) * 2012-08-06 2014-02-14 삼성전기주식회사 무전해 동 도금용 촉매 용액, 이의 제조방법, 및 이를 이용한 무전해 도금방법
WO2016097084A1 (en) * 2014-12-17 2016-06-23 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
JP7037580B2 (ja) 2018-01-29 2022-03-16 京セラ株式会社 被覆工具およびこれを備えた切削工具
JP7037581B2 (ja) 2018-01-29 2022-03-16 京セラ株式会社 被覆工具およびそれを備えた切削工具
CN111902230B (zh) 2018-01-29 2023-08-11 京瓷株式会社 涂层刀具和具备它的切削刀具
US11911829B2 (en) 2018-11-29 2024-02-27 Kyocera Corporation Coated tool and cutting tool including same
CN114150299A (zh) * 2021-04-27 2022-03-08 天津大学 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921749A (en) * 1986-05-30 1990-05-01 Exxon Chemical Patents Inc. Sealable films
JP2015017326A (ja) * 2013-06-28 2015-01-29 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． ５員複素環式窒素化合物を含有する無電解メタライゼーション触媒

Also Published As

Publication number Publication date
NL174739C (nl) 1984-08-01
DE2238003B2 (de) 1976-12-30
NL7210533A (ja) 1973-01-31
AU462961B2 (en) 1975-07-10
JPS52155138A (en) 1977-12-23
FR2147338B1 (ja) 1974-10-04
AU4502272A (en) 1974-01-31
AT316956B (de) 1974-08-12
GB1397091A (en) 1975-06-11
JPS533732B1 (ja) 1978-02-09
FR2147338A1 (ja) 1973-03-09
DE2238003A1 (de) 1973-02-15
SE385129B (sv) 1976-06-08
DK145681C (da) 1983-08-01
NL174739B (nl) 1984-03-01
DK145681B (da) 1983-01-24
IT961765B (it) 1973-12-10
CA968908A (en) 1975-06-10
CH606204A5 (ja) 1978-10-31
JPS564144B2 (ja) 1981-01-28
JPS5726344B2 (ja) 1982-06-03

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