IT961765B - Processo e soluzione per la sensibilizzazione di substrati per la deposizione di metallo senza elettricita - Google Patents

Processo e soluzione per la sensibilizzazione di substrati per la deposizione di metallo senza elettricita

Info

Publication number
IT961765B
IT961765B IT5185872A IT5185872A IT961765B IT 961765 B IT961765 B IT 961765B IT 5185872 A IT5185872 A IT 5185872A IT 5185872 A IT5185872 A IT 5185872A IT 961765 B IT961765 B IT 961765B
Authority
IT
Italy
Prior art keywords
sensitization
substrates
deposition
electricity
metal
Prior art date
Application number
IT5185872A
Other languages
English (en)
Italian (it)
Inventor
F Nuzzi
J Polichette
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Application granted granted Critical
Publication of IT961765B publication Critical patent/IT961765B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Decoration Of Textiles (AREA)
IT5185872A 1971-07-29 1972-07-29 Processo e soluzione per la sensibilizzazione di substrati per la deposizione di metallo senza elettricita IT961765B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16750671A 1971-07-29 1971-07-29

Publications (1)

Publication Number Publication Date
IT961765B true IT961765B (it) 1973-12-10

Family

ID=22607641

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5185872A IT961765B (it) 1971-07-29 1972-07-29 Processo e soluzione per la sensibilizzazione di substrati per la deposizione di metallo senza elettricita

Country Status (11)

Country Link
JP (3) JPS533732B1 (ja)
AT (1) AT316956B (ja)
AU (1) AU462961B2 (ja)
CA (1) CA968908A (ja)
CH (1) CH606204A5 (ja)
DK (1) DK145681C (ja)
FR (1) FR2147338B1 (ja)
GB (1) GB1397091A (ja)
IT (1) IT961765B (ja)
NL (1) NL174739C (ja)
SE (1) SE385129B (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
JPS6079604A (ja) * 1983-10-05 1985-05-07 株式会社村田製作所 ポリアクリロニトリル導電性フイルムの製造方法
DE3417563C2 (de) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen
GB8613161D0 (en) * 1986-05-30 1986-07-02 Exxon Chemical Patents Inc Sealable films
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
EP1876260B1 (en) 2006-07-07 2018-11-28 Rohm and Haas Electronic Materials LLC Improved electroless copper compositions
TWI347373B (en) 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
TWI348499B (en) 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
KR20140019175A (ko) * 2012-08-06 2014-02-14 삼성전기주식회사 무전해 동 도금용 촉매 용액, 이의 제조방법, 및 이를 이용한 무전해 도금방법
US9364822B2 (en) * 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
MY181601A (en) * 2014-12-17 2020-12-29 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
US11541468B2 (en) 2018-01-29 2023-01-03 Kyocera Corporation Coated tool and cutting tool including same
KR102492360B1 (ko) 2018-01-29 2023-01-27 교세라 가부시키가이샤 피복 공구 및 이것을 구비한 절삭 공구
WO2019146785A1 (ja) 2018-01-29 2019-08-01 京セラ株式会社 被覆工具およびそれを備えた切削工具
US11911829B2 (en) 2018-11-29 2024-02-27 Kyocera Corporation Coated tool and cutting tool including same
CN114150299A (zh) * 2021-04-27 2022-03-08 天津大学 用于超低轮廓铜箔及其覆铜板制备的化学沉积方法

Also Published As

Publication number Publication date
FR2147338B1 (ja) 1974-10-04
AT316956B (de) 1974-08-12
FR2147338A1 (ja) 1973-03-09
DE2238003A1 (de) 1973-02-15
CH606204A5 (ja) 1978-10-31
JPS52155138A (en) 1977-12-23
NL7210533A (ja) 1973-01-31
DE2238003B2 (de) 1976-12-30
JPS52151636A (en) 1977-12-16
AU4502272A (en) 1974-01-31
JPS533732B1 (ja) 1978-02-09
DK145681C (da) 1983-08-01
DK145681B (da) 1983-01-24
JPS564144B2 (ja) 1981-01-28
NL174739B (nl) 1984-03-01
NL174739C (nl) 1984-08-01
GB1397091A (en) 1975-06-11
AU462961B2 (en) 1975-07-10
JPS5726344B2 (ja) 1982-06-03
SE385129B (sv) 1976-06-08
CA968908A (en) 1975-06-10

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