JPS52144976A - Plastic seal type semiconductor device - Google Patents

Plastic seal type semiconductor device

Info

Publication number
JPS52144976A
JPS52144976A JP6117176A JP6117176A JPS52144976A JP S52144976 A JPS52144976 A JP S52144976A JP 6117176 A JP6117176 A JP 6117176A JP 6117176 A JP6117176 A JP 6117176A JP S52144976 A JPS52144976 A JP S52144976A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
seal type
plastic seal
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6117176A
Other languages
Japanese (ja)
Other versions
JPS5622379B2 (en
Inventor
Susumu Okikawa
Hiroshi Mikino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6117176A priority Critical patent/JPS52144976A/en
Priority to DE2712543A priority patent/DE2712543C2/en
Priority to US05/780,327 priority patent/US4100566A/en
Publication of JPS52144976A publication Critical patent/JPS52144976A/en
Publication of JPS5622379B2 publication Critical patent/JPS5622379B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: Application of mechanical stress on a resin sealing body and the semiconductor element within the resin sealing body is prevented by forming a gap between opposing faces other than bolt mounting parts and mounting a radiating fin to the resin body.
COPYRIGHT: (C)1977,JPO&Japio
JP6117176A 1976-03-24 1976-05-28 Plastic seal type semiconductor device Granted JPS52144976A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6117176A JPS52144976A (en) 1976-05-28 1976-05-28 Plastic seal type semiconductor device
DE2712543A DE2712543C2 (en) 1976-03-24 1977-03-22 Arrangement of a semiconductor component on a mounting plate
US05/780,327 US4100566A (en) 1976-03-24 1977-03-23 Resin-sealed type semiconductor devices and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6117176A JPS52144976A (en) 1976-05-28 1976-05-28 Plastic seal type semiconductor device

Publications (2)

Publication Number Publication Date
JPS52144976A true JPS52144976A (en) 1977-12-02
JPS5622379B2 JPS5622379B2 (en) 1981-05-25

Family

ID=13163418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6117176A Granted JPS52144976A (en) 1976-03-24 1976-05-28 Plastic seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS52144976A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913113A (en) * 1972-06-02 1974-02-05
JPS4914105U (en) * 1972-05-09 1974-02-06
JPS49144177U (en) * 1973-04-11 1974-12-12

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914105U (en) * 1972-05-09 1974-02-06
JPS4913113A (en) * 1972-06-02 1974-02-05
JPS49144177U (en) * 1973-04-11 1974-12-12

Also Published As

Publication number Publication date
JPS5622379B2 (en) 1981-05-25

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