Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP4458676ApriorityCriticalpatent/JPS52127758A/en
Publication of JPS52127758ApublicationCriticalpatent/JPS52127758A/en
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
Abstract
PURPOSE: To prevent the outflow formed by resin-seal of one part of metalic wire layer on the semiconductor supporting substrate after being covered by thin film.
COPYRIGHT: (C)1977,JPO&Japio
JP4458676A1976-04-191976-04-19Production of semiconductor unit
PendingJPS52127758A
(en)