JPS5170268A - - Google Patents

Info

Publication number
JPS5170268A
JPS5170268A JP50133932A JP13393275A JPS5170268A JP S5170268 A JPS5170268 A JP S5170268A JP 50133932 A JP50133932 A JP 50133932A JP 13393275 A JP13393275 A JP 13393275A JP S5170268 A JPS5170268 A JP S5170268A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50133932A
Other versions
JPS595616B2 (ja
Inventor
Horishetsuto Josefu
Jei Riichi Edowaado
Jii Buranigan Jon
Pii Hamondo Josefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of JPS5170268A publication Critical patent/JPS5170268A/ja
Publication of JPS595616B2 publication Critical patent/JPS595616B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
JP50133932A 1974-11-07 1975-11-05 ジユシガンユウブツシツチユウノ アナノクリ−ニングホウホウ Expired JPS595616B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52189074A 1974-11-07 1974-11-07

Publications (2)

Publication Number Publication Date
JPS5170268A true JPS5170268A (ja) 1976-06-17
JPS595616B2 JPS595616B2 (ja) 1984-02-06

Family

ID=24078571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50133932A Expired JPS595616B2 (ja) 1974-11-07 1975-11-05 ジユシガンユウブツシツチユウノ アナノクリ−ニングホウホウ

Country Status (13)

Country Link
JP (1) JPS595616B2 (ja)
AT (1) AT346957B (ja)
AU (1) AU500570B2 (ja)
CH (1) CH619823A5 (ja)
DE (1) DE2550598C3 (ja)
DK (1) DK154600C (ja)
ES (1) ES442440A1 (ja)
FR (1) FR2290822A1 (ja)
GB (1) GB1479556A (ja)
IT (1) IT1052168B (ja)
NL (1) NL180684C (ja)
SE (1) SE447045B (ja)
ZA (1) ZA756783B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286188B1 (en) 1997-09-01 2001-09-11 Maschinenfabrik Rieter Ag Regulated drawing frame

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110415C2 (de) * 1981-03-18 1983-08-18 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von Leiterplatten
US4525247A (en) * 1982-07-12 1985-06-25 Rogers Corporation Microwave circuit boards and method of manufacture thereof
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
JPS60154416U (ja) * 1984-03-23 1985-10-15 三国　慶耿 除雪機の投雪シユ−ト
US4820548A (en) * 1984-06-07 1989-04-11 Enthone, Incorporated Three step process for treating plastics with alkaline permanganate solutions
US4948630A (en) * 1984-06-07 1990-08-14 Enthone, Inc. Three step process for treating plastics with alkaline permanganate solutions
US4601783A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
US4601784A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
AT1147U1 (de) * 1996-01-10 1996-11-25 Grundmann Schliesstechnik Schliesszylinder und bzw. oder flachschlüssel
JP5330474B2 (ja) * 2011-09-22 2013-10-30 上村工業株式会社 デスミア液及びデスミア処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276927A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Smoothing of mechanically drilled holes
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3652351A (en) * 1970-05-13 1972-03-28 Carus Corp Processes for etching synthetic polymer resins with alkaline alkali metal manganate solutions
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
DE2316720A1 (de) * 1973-04-04 1974-10-31 Licentia Gmbh Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286188B1 (en) 1997-09-01 2001-09-11 Maschinenfabrik Rieter Ag Regulated drawing frame

Also Published As

Publication number Publication date
DK154600C (da) 1989-04-17
NL180684C (nl) 1987-04-01
SE447045B (sv) 1986-10-20
DE2550598B2 (de) 1978-07-13
AU500570B2 (en) 1979-05-24
SE7512335L (sv) 1976-05-08
FR2290822A1 (fr) 1976-06-04
FR2290822B1 (ja) 1978-05-12
AT346957B (de) 1978-12-11
NL180684B (nl) 1986-11-03
ES442440A1 (es) 1977-04-01
DK485175A (da) 1976-05-08
DK154600B (da) 1988-11-28
ZA756783B (en) 1976-10-27
DE2550598C3 (de) 1979-03-08
IT1052168B (it) 1981-06-20
JPS595616B2 (ja) 1984-02-06
DE2550598A1 (de) 1976-05-13
CH619823A5 (en) 1980-10-15
ATA845775A (de) 1978-04-15
GB1479556A (en) 1977-07-13
AU8632875A (en) 1977-05-12
NL7512992A (nl) 1976-05-11

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