JPS5135349B1 - - Google Patents
Info
- Publication number
- JPS5135349B1 JPS5135349B1 JP46100793A JP10079371A JPS5135349B1 JP S5135349 B1 JPS5135349 B1 JP S5135349B1 JP 46100793 A JP46100793 A JP 46100793A JP 10079371 A JP10079371 A JP 10079371A JP S5135349 B1 JPS5135349 B1 JP S5135349B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/048—
-
- H10W70/427—
-
- H10W72/5449—
-
- H10W90/756—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7018378A NL7018378A (cg-RX-API-DMAC10.html) | 1970-12-17 | 1970-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5135349B1 true JPS5135349B1 (cg-RX-API-DMAC10.html) | 1976-10-01 |
Family
ID=19811818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46100793A Pending JPS5135349B1 (cg-RX-API-DMAC10.html) | 1970-12-17 | 1971-12-14 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3842492A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS5135349B1 (cg-RX-API-DMAC10.html) |
| CA (1) | CA933673A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2159530C3 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2118154B1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1372216A (cg-RX-API-DMAC10.html) |
| IT (1) | IT943262B (cg-RX-API-DMAC10.html) |
| NL (1) | NL7018378A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059614A (ja) * | 2015-09-15 | 2017-03-23 | 株式会社東芝 | 半導体装置の製造方法、半導体装置、およびリードフレーム |
| JP2017168703A (ja) * | 2016-03-17 | 2017-09-21 | 東芝メモリ株式会社 | 半導体装置の製造方法および半導体装置 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2259133C3 (de) * | 1972-12-02 | 1982-03-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Kontaktieren einer Halbleiteranordnung und Anwendung des Verfahrens |
| JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
| DE3040676A1 (de) * | 1980-10-29 | 1982-05-27 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zum herstellen von halbleiteranordnugen |
| FR2498377A1 (fr) * | 1981-01-16 | 1982-07-23 | Thomson Csf Mat Tel | Procede de fabrication de dispositifs semiconducteurs sur bande metallique |
| US4380042A (en) * | 1981-02-23 | 1983-04-12 | Angelucci Sr Thomas L | Printed circuit lead carrier tape |
| JPS5817649A (ja) * | 1981-07-24 | 1983-02-01 | Fujitsu Ltd | 電子部品パツケ−ジ |
| EP0102988B1 (en) * | 1982-03-08 | 1988-09-21 | Motorola, Inc. | Integrated circuit lead frame |
| JPS58154241A (ja) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | 半導体装置及びその製法 |
| JPS59147448A (ja) * | 1983-02-12 | 1984-08-23 | Fujitsu Ltd | 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法 |
| US4603927A (en) * | 1984-07-12 | 1986-08-05 | Rogers Corporation | Surface mounted bussing device |
| JPS6132452A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | リ−ドフレ−ムとそれを用いた電子装置 |
| DE3430849A1 (de) * | 1984-08-22 | 1986-03-06 | Gerd 7742 St Georgen Kammerer | Verfahren zur raeumlichen ausweitung der elektrischen verbindung zwischen den anschlusskontakten hochintegrierter elektronischer bauelemente und den kontaktstellen einer elektrischen anschlussvorrichtung auf einem bauelementetraeger |
| JPS61192542A (ja) * | 1985-02-21 | 1986-08-27 | Nifco Inc | 溶着方法 |
| JPS6281738A (ja) * | 1985-10-07 | 1987-04-15 | Hitachi Micro Comput Eng Ltd | リ−ドフレ−ムおよびそれを用いた半導体装置 |
| EP0242962A1 (en) * | 1986-04-25 | 1987-10-28 | Inmos Corporation | Offset pad semiconductor lead frame |
| US5466967A (en) * | 1988-10-10 | 1995-11-14 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
| US4916519A (en) * | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package |
| US5781682A (en) * | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
| TW467401U (en) * | 1997-03-21 | 2001-12-01 | Rohm Co Ltd | Lead frame and the semiconductor device utilizing the lead frame |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3262022A (en) * | 1964-02-13 | 1966-07-19 | Gen Micro Electronics Inc | Packaged electronic device |
| US3391426A (en) * | 1965-10-22 | 1968-07-09 | Motorola Inc | Molding apparatus |
| US3482419A (en) * | 1966-01-03 | 1969-12-09 | Texas Instruments Inc | Process for fabricating hermetic glass seals |
| GB1173506A (en) * | 1966-03-16 | 1969-12-10 | Motorola Inc | Metallic Frame Member for Fabrication of Semiconductor Devices. |
| DE1539692A1 (de) * | 1966-06-23 | 1969-10-16 | Blume & Redecker Gmbh | Umklebevorrichtung fuer Spulen |
| DE1564867C3 (de) * | 1966-06-30 | 1975-04-10 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen |
| FR1504726A (fr) * | 1966-10-25 | 1967-12-08 | Radiotechnique Coprim Rtc | Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs |
| US3702954A (en) * | 1967-07-21 | 1972-11-14 | Siemens Ag | Semiconductor component and method of its production |
| US3689336A (en) * | 1971-01-04 | 1972-09-05 | Sylvania Electric Prod | Fabrication of packages for integrated circuits |
-
1970
- 1970-12-17 NL NL7018378A patent/NL7018378A/xx unknown
-
1971
- 1971-12-01 DE DE2159530A patent/DE2159530C3/de not_active Expired
- 1971-12-02 US US00204114A patent/US3842492A/en not_active Expired - Lifetime
- 1971-12-14 IT IT71091/71A patent/IT943262B/it active
- 1971-12-14 GB GB5793971A patent/GB1372216A/en not_active Expired
- 1971-12-14 JP JP46100793A patent/JPS5135349B1/ja active Pending
- 1971-12-16 CA CA130265A patent/CA933673A/en not_active Expired
- 1971-12-17 FR FR7145446A patent/FR2118154B1/fr not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059614A (ja) * | 2015-09-15 | 2017-03-23 | 株式会社東芝 | 半導体装置の製造方法、半導体装置、およびリードフレーム |
| JP2017168703A (ja) * | 2016-03-17 | 2017-09-21 | 東芝メモリ株式会社 | 半導体装置の製造方法および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2159530B2 (de) | 1980-05-29 |
| DE2159530A1 (de) | 1972-07-13 |
| NL7018378A (cg-RX-API-DMAC10.html) | 1972-06-20 |
| FR2118154A1 (cg-RX-API-DMAC10.html) | 1972-07-28 |
| GB1372216A (en) | 1974-10-30 |
| US3842492A (en) | 1974-10-22 |
| IT943262B (it) | 1973-04-02 |
| DE2159530C3 (de) | 1981-02-05 |
| CA933673A (en) | 1973-09-11 |
| FR2118154B1 (cg-RX-API-DMAC10.html) | 1976-06-04 |