JPS51121252A - Semiconductor wafer processing method - Google Patents

Semiconductor wafer processing method

Info

Publication number
JPS51121252A
JPS51121252A JP4581175A JP4581175A JPS51121252A JP S51121252 A JPS51121252 A JP S51121252A JP 4581175 A JP4581175 A JP 4581175A JP 4581175 A JP4581175 A JP 4581175A JP S51121252 A JPS51121252 A JP S51121252A
Authority
JP
Japan
Prior art keywords
processing method
semiconductor wafer
wafer processing
irregulareties
bevelling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4581175A
Other languages
Japanese (ja)
Other versions
JPS5640970B2 (en
Inventor
Shuzo Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP4581175A priority Critical patent/JPS51121252A/en
Publication of JPS51121252A publication Critical patent/JPS51121252A/en
Publication of JPS5640970B2 publication Critical patent/JPS5640970B2/ja
Granted legal-status Critical Current

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Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To provide a method of processing semiconductor wafers in which irregulareties in the processed surface are eliminated and the strength of the PN joint is ensured when bevelling the sides by the sand blast method.
COPYRIGHT: (C)1976,JPO&Japio
JP4581175A 1975-04-17 1975-04-17 Semiconductor wafer processing method Granted JPS51121252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4581175A JPS51121252A (en) 1975-04-17 1975-04-17 Semiconductor wafer processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4581175A JPS51121252A (en) 1975-04-17 1975-04-17 Semiconductor wafer processing method

Publications (2)

Publication Number Publication Date
JPS51121252A true JPS51121252A (en) 1976-10-23
JPS5640970B2 JPS5640970B2 (en) 1981-09-25

Family

ID=12729626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4581175A Granted JPS51121252A (en) 1975-04-17 1975-04-17 Semiconductor wafer processing method

Country Status (1)

Country Link
JP (1) JPS51121252A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5451397A (en) * 1977-09-29 1979-04-23 Kinsekisha Lab Ltd Method of working piezooelectric plate
JPS61159740A (en) * 1984-10-25 1986-07-19 タンデム　コンピユ−タ−ズ　インコ−ポレ−テツド Miniaturization of wafer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089174U (en) * 1983-11-22 1985-06-19 株式会社松栄パツク Packaging for recording cassette tapes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5451397A (en) * 1977-09-29 1979-04-23 Kinsekisha Lab Ltd Method of working piezooelectric plate
JPS61159740A (en) * 1984-10-25 1986-07-19 タンデム　コンピユ−タ−ズ　インコ−ポレ−テツド Miniaturization of wafer

Also Published As

Publication number Publication date
JPS5640970B2 (en) 1981-09-25

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