JPS51102566A - Shusekikairo - Google Patents

Shusekikairo

Info

Publication number
JPS51102566A
JPS51102566A JP50028456A JP2845675A JPS51102566A JP S51102566 A JPS51102566 A JP S51102566A JP 50028456 A JP50028456 A JP 50028456A JP 2845675 A JP2845675 A JP 2845675A JP S51102566 A JPS51102566 A JP S51102566A
Authority
JP
Japan
Prior art keywords
shusekikairo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50028456A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5845822B2 (ja
Inventor
Fumiaki Mukaiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP50028456A priority Critical patent/JPS5845822B2/ja
Publication of JPS51102566A publication Critical patent/JPS51102566A/ja
Publication of JPS5845822B2 publication Critical patent/JPS5845822B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP50028456A 1975-03-07 1975-03-07 シユウセキカイロ Expired JPS5845822B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50028456A JPS5845822B2 (ja) 1975-03-07 1975-03-07 シユウセキカイロ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50028456A JPS5845822B2 (ja) 1975-03-07 1975-03-07 シユウセキカイロ

Publications (2)

Publication Number Publication Date
JPS51102566A true JPS51102566A (en) 1976-09-10
JPS5845822B2 JPS5845822B2 (ja) 1983-10-12

Family

ID=12249156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50028456A Expired JPS5845822B2 (ja) 1975-03-07 1975-03-07 シユウセキカイロ

Country Status (1)

Country Link
JP (1) JPS5845822B2 (enrdf_load_html_response)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS56103455A (en) * 1980-01-22 1981-08-18 Fujitsu Ltd Semiconductor ic device
JPS56158467A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Semiconductor device
JPS5753657U (enrdf_load_html_response) * 1980-09-12 1982-03-29
JPS5780854U (enrdf_load_html_response) * 1980-10-31 1982-05-19
JPS57106229U (enrdf_load_html_response) * 1980-12-22 1982-06-30
JPS5892230A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置
JPS58154254A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS5988864A (ja) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS59117251A (ja) * 1982-12-24 1984-07-06 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6024048A (ja) * 1983-04-05 1985-02-06 ジーイーシー　―　マルコニ　リミテッド 半導体構成部品および製造方法
JPS60181060U (ja) * 1985-04-18 1985-12-02 富士通株式会社 赤外線検知装置
JPS6189657A (ja) * 1984-10-08 1986-05-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JPS6290937A (ja) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62112334A (ja) * 1985-11-11 1987-05-23 Nec Corp 高密度実装パツケ−ジ
JPH02146436U (enrdf_load_html_response) * 1989-05-17 1990-12-12
US7720453B2 (en) 2005-03-23 2010-05-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
WO2017038403A1 (ja) * 2015-09-01 2017-03-09 ソニー株式会社 積層体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280927U (enrdf_load_html_response) * 1985-11-08 1987-05-23

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS56103455A (en) * 1980-01-22 1981-08-18 Fujitsu Ltd Semiconductor ic device
JPS56158467A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Semiconductor device
JPS5753657U (enrdf_load_html_response) * 1980-09-12 1982-03-29
JPS5780854U (enrdf_load_html_response) * 1980-10-31 1982-05-19
JPS57106229U (enrdf_load_html_response) * 1980-12-22 1982-06-30
JPS5892230A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置
JPS58154254A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置
JPS5988864A (ja) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS59117251A (ja) * 1982-12-24 1984-07-06 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6024048A (ja) * 1983-04-05 1985-02-06 ジーイーシー　―　マルコニ　リミテッド 半導体構成部品および製造方法
JPS6189657A (ja) * 1984-10-08 1986-05-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JPS60181060U (ja) * 1985-04-18 1985-12-02 富士通株式会社 赤外線検知装置
JPS6290937A (ja) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62112334A (ja) * 1985-11-11 1987-05-23 Nec Corp 高密度実装パツケ−ジ
JPH02146436U (enrdf_load_html_response) * 1989-05-17 1990-12-12
US7720453B2 (en) 2005-03-23 2010-05-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
WO2017038403A1 (ja) * 2015-09-01 2017-03-09 ソニー株式会社 積層体
JPWO2017038403A1 (ja) * 2015-09-01 2018-08-16 ソニー株式会社 積層体

Also Published As

Publication number Publication date
JPS5845822B2 (ja) 1983-10-12

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