JPS57106229U - - Google Patents

Info

Publication number
JPS57106229U
JPS57106229U JP1980183157U JP18315780U JPS57106229U JP S57106229 U JPS57106229 U JP S57106229U JP 1980183157 U JP1980183157 U JP 1980183157U JP 18315780 U JP18315780 U JP 18315780U JP S57106229 U JPS57106229 U JP S57106229U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980183157U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980183157U priority Critical patent/JPS57106229U/ja
Publication of JPS57106229U publication Critical patent/JPS57106229U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP1980183157U 1980-12-22 1980-12-22 Pending JPS57106229U (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980183157U JPS57106229U (enrdf_load_html_response) 1980-12-22 1980-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980183157U JPS57106229U (enrdf_load_html_response) 1980-12-22 1980-12-22

Publications (1)

Publication Number Publication Date
JPS57106229U true JPS57106229U (enrdf_load_html_response) 1982-06-30

Family

ID=29982166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980183157U Pending JPS57106229U (enrdf_load_html_response) 1980-12-22 1980-12-22

Country Status (1)

Country Link
JP (1) JPS57106229U (enrdf_load_html_response)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102566A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk Shusekikairo

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102566A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk Shusekikairo

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