JPS51100679A - - Google Patents
Info
- Publication number
- JPS51100679A JPS51100679A JP50026333A JP2633375A JPS51100679A JP S51100679 A JPS51100679 A JP S51100679A JP 50026333 A JP50026333 A JP 50026333A JP 2633375 A JP2633375 A JP 2633375A JP S51100679 A JPS51100679 A JP S51100679A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50026333A JPS592179B2 (ja) | 1975-03-03 | 1975-03-03 | 電気的部材の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50026333A JPS592179B2 (ja) | 1975-03-03 | 1975-03-03 | 電気的部材の製造方法 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22751084A Division JPS60180132A (ja) | 1984-10-29 | 1984-10-29 | 半導体チツプの接続構造 |
JP22750984A Division JPS60191228A (ja) | 1984-10-29 | 1984-10-29 | 表示装置の接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51100679A true JPS51100679A (es) | 1976-09-06 |
JPS592179B2 JPS592179B2 (ja) | 1984-01-17 |
Family
ID=12190490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50026333A Expired JPS592179B2 (ja) | 1975-03-03 | 1975-03-03 | 電気的部材の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS592179B2 (es) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5652665U (es) * | 1979-09-29 | 1981-05-09 | ||
JPS5693337A (en) * | 1979-12-26 | 1981-07-28 | Fujitsu Ltd | Semiconductor device |
JPS5815243A (ja) * | 1981-07-20 | 1983-01-28 | Seiko Epson Corp | 半導体集積回路の実装構造 |
JPS6090864U (ja) * | 1983-11-28 | 1985-06-21 | 日立化成工業株式会社 | 透明導電異方性接着フイルム付回路板 |
JPS60191228A (ja) * | 1984-10-29 | 1985-09-28 | Seiko Epson Corp | 表示装置の接続構造 |
JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS6144494A (ja) * | 1984-08-09 | 1986-03-04 | ソニー株式会社 | 電気的接続体 |
JPS6144836U (ja) * | 1984-08-24 | 1986-03-25 | シャープ株式会社 | 半導体装置 |
JPS61123990A (ja) * | 1984-11-05 | 1986-06-11 | Casio Comput Co Ltd | Icカ−ド |
JPS61186061A (ja) * | 1985-02-13 | 1986-08-19 | Fuji Xerox Co Ltd | 異方導電性フィルム、これを用いた半導体装置およびその製造方法 |
JPS61215528A (ja) * | 1985-03-20 | 1986-09-25 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JPS6268126U (es) * | 1985-10-17 | 1987-04-28 | ||
JPS62244142A (ja) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | 半導体素子の電気的接続方法 |
JPS62244143A (ja) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | 半導体素子の電気的接続方法 |
JPS6354737A (ja) * | 1986-08-25 | 1988-03-09 | Nec Corp | 集積回路チツプの実装方法 |
JPS63250140A (ja) * | 1987-04-07 | 1988-10-18 | Matsushita Electric Ind Co Ltd | 半導体チツプの実装方法 |
US5679493A (en) * | 1994-09-30 | 1997-10-21 | Nec Corporation | Method of producing an assembly including an anisotropic conductive film |
JP2014153213A (ja) * | 2013-02-08 | 2014-08-25 | Shimadzu Corp | 放射線検出器および放射線検出器の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63106175U (es) * | 1986-12-26 | 1988-07-08 |
-
1975
- 1975-03-03 JP JP50026333A patent/JPS592179B2/ja not_active Expired
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5652665U (es) * | 1979-09-29 | 1981-05-09 | ||
JPS5940999Y2 (ja) * | 1979-09-29 | 1984-11-24 | 日立工機株式会社 | ホイルガ−ドの取付機構 |
JPS5693337A (en) * | 1979-12-26 | 1981-07-28 | Fujitsu Ltd | Semiconductor device |
JPS5815243A (ja) * | 1981-07-20 | 1983-01-28 | Seiko Epson Corp | 半導体集積回路の実装構造 |
JPS6090864U (ja) * | 1983-11-28 | 1985-06-21 | 日立化成工業株式会社 | 透明導電異方性接着フイルム付回路板 |
JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPH027180B2 (es) * | 1984-06-08 | 1990-02-15 | Matsushita Electric Ind Co Ltd | |
JPS6144494A (ja) * | 1984-08-09 | 1986-03-04 | ソニー株式会社 | 電気的接続体 |
JPH0576797B2 (es) * | 1984-08-09 | 1993-10-25 | Sony Corp | |
JPS6144836U (ja) * | 1984-08-24 | 1986-03-25 | シャープ株式会社 | 半導体装置 |
JPS60191228A (ja) * | 1984-10-29 | 1985-09-28 | Seiko Epson Corp | 表示装置の接続構造 |
JPH0454931B2 (es) * | 1984-10-29 | 1992-09-01 | Seiko Epson Corp | |
JPS61123990A (ja) * | 1984-11-05 | 1986-06-11 | Casio Comput Co Ltd | Icカ−ド |
JPS61186061A (ja) * | 1985-02-13 | 1986-08-19 | Fuji Xerox Co Ltd | 異方導電性フィルム、これを用いた半導体装置およびその製造方法 |
JPS61215528A (ja) * | 1985-03-20 | 1986-09-25 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JPS6268126U (es) * | 1985-10-17 | 1987-04-28 | ||
JPS62244143A (ja) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | 半導体素子の電気的接続方法 |
JPS62244142A (ja) * | 1986-04-16 | 1987-10-24 | Matsushita Electric Ind Co Ltd | 半導体素子の電気的接続方法 |
JPH0450745B2 (es) * | 1986-04-16 | 1992-08-17 | Matsushita Denki Sangyo Kk | |
JPS6354737A (ja) * | 1986-08-25 | 1988-03-09 | Nec Corp | 集積回路チツプの実装方法 |
JPS63250140A (ja) * | 1987-04-07 | 1988-10-18 | Matsushita Electric Ind Co Ltd | 半導体チツプの実装方法 |
US5679493A (en) * | 1994-09-30 | 1997-10-21 | Nec Corporation | Method of producing an assembly including an anisotropic conductive film |
JP2014153213A (ja) * | 2013-02-08 | 2014-08-25 | Shimadzu Corp | 放射線検出器および放射線検出器の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS592179B2 (ja) | 1984-01-17 |