JPS5064767A - - Google Patents

Info

Publication number
JPS5064767A
JPS5064767A JP11387873A JP11387873A JPS5064767A JP S5064767 A JPS5064767 A JP S5064767A JP 11387873 A JP11387873 A JP 11387873A JP 11387873 A JP11387873 A JP 11387873A JP S5064767 A JPS5064767 A JP S5064767A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11387873A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11387873A priority Critical patent/JPS5064767A/ja
Publication of JPS5064767A publication Critical patent/JPS5064767A/ja
Pending legal-status Critical Current

Links

JP11387873A 1973-10-12 1973-10-12 Pending JPS5064767A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11387873A JPS5064767A (zh) 1973-10-12 1973-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11387873A JPS5064767A (zh) 1973-10-12 1973-10-12

Publications (1)

Publication Number Publication Date
JPS5064767A true JPS5064767A (zh) 1975-06-02

Family

ID=14623368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11387873A Pending JPS5064767A (zh) 1973-10-12 1973-10-12

Country Status (1)

Country Link
JP (1) JPS5064767A (zh)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629400A (en) * 1979-08-20 1981-03-24 Nippon Electric Co Multilayer high density circuit board
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS58119694A (ja) * 1982-01-12 1983-07-16 株式会社日立製作所 配線基板の製造方法
JPS58121698A (ja) * 1982-01-12 1983-07-20 株式会社日立製作所 多層配線基板
JPS60113493A (ja) * 1983-11-25 1985-06-19 富士通株式会社 厚膜多層回路基板の製造方法
JPS61179597A (ja) * 1985-02-04 1986-08-12 沖電気工業株式会社 多層配線形成方法
JPS61179598A (ja) * 1985-02-04 1986-08-12 沖電気工業株式会社 多層配線形成方法
JPS61224398A (ja) * 1985-03-29 1986-10-06 古河電気工業株式会社 多層プリント回路基板の製造方法
JPS62102543A (ja) * 1985-10-28 1987-05-13 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 同平坦面の金属層および絶縁層の形成方法
JPH02290095A (ja) * 1989-02-20 1990-11-29 Matsushita Electric Works Ltd 多層配線板の製造方法
US5480048A (en) * 1992-09-04 1996-01-02 Hitachi, Ltd. Multilayer wiring board fabricating method
JPH08321684A (ja) * 1995-05-24 1996-12-03 Sony Corp 配線基板及び配線基板の製造方法
USRE37882E1 (en) 1993-01-15 2002-10-15 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629400A (en) * 1979-08-20 1981-03-24 Nippon Electric Co Multilayer high density circuit board
JPH0139236B2 (zh) * 1979-10-26 1989-08-18 Nippon Electric Co
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS58119694A (ja) * 1982-01-12 1983-07-16 株式会社日立製作所 配線基板の製造方法
JPS58121698A (ja) * 1982-01-12 1983-07-20 株式会社日立製作所 多層配線基板
JPH0544199B2 (zh) * 1982-01-12 1993-07-05 Hitachi Ltd
JPH0451998B2 (zh) * 1982-01-12 1992-08-20 Hitachi Ltd
JPS60113493A (ja) * 1983-11-25 1985-06-19 富士通株式会社 厚膜多層回路基板の製造方法
JPH0365032B2 (zh) * 1983-11-25 1991-10-09
JPS61179597A (ja) * 1985-02-04 1986-08-12 沖電気工業株式会社 多層配線形成方法
JPH0438157B2 (zh) * 1985-02-04 1992-06-23 Oki Electric Ind Co Ltd
JPH0438158B2 (zh) * 1985-02-04 1992-06-23 Oki Electric Ind Co Ltd
JPS61179598A (ja) * 1985-02-04 1986-08-12 沖電気工業株式会社 多層配線形成方法
JPS61224398A (ja) * 1985-03-29 1986-10-06 古河電気工業株式会社 多層プリント回路基板の製造方法
JPS62102543A (ja) * 1985-10-28 1987-05-13 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 同平坦面の金属層および絶縁層の形成方法
JPH0817831A (ja) * 1985-10-28 1996-01-19 Internatl Business Mach Corp <Ibm> 同平坦面の金属層および二酸化シリコン層の形成方法
JPH02290095A (ja) * 1989-02-20 1990-11-29 Matsushita Electric Works Ltd 多層配線板の製造方法
US5480048A (en) * 1992-09-04 1996-01-02 Hitachi, Ltd. Multilayer wiring board fabricating method
USRE37882E1 (en) 1993-01-15 2002-10-15 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method
JPH08321684A (ja) * 1995-05-24 1996-12-03 Sony Corp 配線基板及び配線基板の製造方法

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