JPS4887779A - - Google Patents

Info

Publication number
JPS4887779A
JPS4887779A JP1238173A JP1238173A JPS4887779A JP S4887779 A JPS4887779 A JP S4887779A JP 1238173 A JP1238173 A JP 1238173A JP 1238173 A JP1238173 A JP 1238173A JP S4887779 A JPS4887779 A JP S4887779A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1238173A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4887779A publication Critical patent/JPS4887779A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
JP1238173A 1972-02-01 1973-01-31 Pending JPS4887779A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2204589A DE2204589A1 (de) 1972-02-01 1972-02-01 Kuehlanordnung fuer flache halbleiterbauelemente

Publications (1)

Publication Number Publication Date
JPS4887779A true JPS4887779A (ja) 1973-11-17

Family

ID=5834649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1238173A Pending JPS4887779A (ja) 1972-02-01 1973-01-31

Country Status (4)

Country Link
US (1) US3792318A (ja)
JP (1) JPS4887779A (ja)
CA (1) CA972079A (ja)
DE (1) DE2204589A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5113578A (ja) * 1974-06-21 1976-02-03 Siemens Ag Hiragatahandotaisoshino kureisochi
JPS5195779A (ja) * 1975-01-09 1976-08-21
JPS52127771U (ja) * 1976-03-26 1977-09-28

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2341097A1 (de) * 1973-08-14 1975-02-27 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente, insbesondere fuer scheibenzellen-thyristoren
DE2417031A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule
US4009418A (en) * 1975-03-20 1977-02-22 General Electric Company Attachment of heat pipes to electrical apparatus
US3978518A (en) * 1975-11-12 1976-08-31 Rca Corporation Reinforced transcalent device
US4102637A (en) * 1976-09-16 1978-07-25 Abar Corporation Work support for vacuum electric furnaces
GB2033704B (en) * 1978-10-30 1982-09-29 Electricity Council Electron discharge heating device
FR2592988B1 (fr) * 1986-01-16 1988-03-18 Jeumont Schneider Dispositifs de refroidissement de semi-conducteurs
US4912548A (en) * 1987-01-28 1990-03-27 National Semiconductor Corporation Use of a heat pipe integrated with the IC package for improving thermal performance
IT1218075B (it) * 1988-06-15 1990-04-12 Fimac Spa Dispositivo per il raffredamento di zone con superficie di scambio termico limitata,in particolare per componenti elettronici
DE3825979A1 (de) * 1988-07-27 1990-02-01 Licentia Gmbh Anordnung zur kuehlung von verlustleistung abgebenden bauelementen
DE3825981A1 (de) * 1988-07-27 1990-02-15 Licentia Gmbh Isothermisierter kuehlkoerper
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
US5451989A (en) * 1989-07-28 1995-09-19 Canon Kabushiki Kaisha Ink jet recording apparatus with a heat pipe for temperature stabilization
US5405808A (en) * 1993-08-16 1995-04-11 Lsi Logic Corporation Fluid-filled and gas-filled semiconductor packages
US6226178B1 (en) 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
DE10017971A1 (de) * 2000-04-11 2001-10-25 Bosch Gmbh Robert Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager
US7931072B1 (en) 2002-10-02 2011-04-26 Alliant Techsystems Inc. High heat flux evaporator, heat transfer systems
US7251889B2 (en) * 2000-06-30 2007-08-07 Swales & Associates, Inc. Manufacture of a heat transfer system
US7708053B2 (en) * 2000-06-30 2010-05-04 Alliant Techsystems Inc. Heat transfer system
US8109325B2 (en) 2000-06-30 2012-02-07 Alliant Techsystems Inc. Heat transfer system
US8136580B2 (en) 2000-06-30 2012-03-20 Alliant Techsystems Inc. Evaporator for a heat transfer system
US8047268B1 (en) 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
US7549461B2 (en) 2000-06-30 2009-06-23 Alliant Techsystems Inc. Thermal management system
GB0020171D0 (en) * 2000-08-17 2000-10-04 Univ South Bank Cooling method
US6525420B2 (en) * 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
US7556086B2 (en) 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
AU2004286255B2 (en) * 2003-10-28 2010-04-08 Northrop Grumman Systems Corporation Manufacture of a heat transfer system
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
CN1840958B (zh) * 2005-03-28 2012-07-04 新灯源科技有限公司 系统构装的高功率高效率二极管灯泡
JP4556759B2 (ja) * 2005-04-28 2010-10-06 日立電線株式会社 ヒートパイプ式熱交換器及びその製造方法
TWI306381B (en) * 2005-07-14 2009-02-11 Via Tech Inc Printed circuit board with improved thermal dissipating structure and electronic device with the same
CN100513973C (zh) * 2006-04-14 2009-07-15 富准精密工业(深圳)有限公司 热管
US7494249B2 (en) * 2006-07-05 2009-02-24 Jaffe Limited Multiple-set heat-dissipating structure for LED lamp
US9267739B2 (en) * 2012-07-18 2016-02-23 Applied Materials, Inc. Pedestal with multi-zone temperature control and multiple purge capabilities
KR20170047331A (ko) * 2014-08-25 2017-05-04 실반 소스, 인크. 산업적 적용을 위한 열 포집, 전달 및 방출

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
DE1924011C3 (de) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Stromrichter mit zwei parallelen, durch Abstandsstücke getrennten Schienen
SE354943B (ja) * 1970-02-24 1973-03-26 Asea Ab
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3668506A (en) * 1971-04-16 1972-06-06 M & T Chemicals Inc Current and fluid conducting arrangements
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5113578A (ja) * 1974-06-21 1976-02-03 Siemens Ag Hiragatahandotaisoshino kureisochi
JPS583384B2 (ja) * 1974-06-21 1983-01-21 シ−メンス アクチエンゲゼルシヤフト ヒラガタハンドウタイソシノ クウレイソウチ
JPS5195779A (ja) * 1975-01-09 1976-08-21
JPS52127771U (ja) * 1976-03-26 1977-09-28

Also Published As

Publication number Publication date
CA972079A (en) 1975-07-29
US3792318A (en) 1974-02-12
DE2204589A1 (de) 1973-08-16

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