JPS5113578A - Hiragatahandotaisoshino kureisochi - Google Patents
Hiragatahandotaisoshino kureisochiInfo
- Publication number
- JPS5113578A JPS5113578A JP7363375A JP7363375A JPS5113578A JP S5113578 A JPS5113578 A JP S5113578A JP 7363375 A JP7363375 A JP 7363375A JP 7363375 A JP7363375 A JP 7363375A JP S5113578 A JPS5113578 A JP S5113578A
- Authority
- JP
- Japan
- Prior art keywords
- kureisochi
- hiragatahandotaisoshino
- hiragatahandotaisoshino kureisochi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Details Of Measuring And Other Instruments (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2429985A DE2429985A1 (de) | 1974-06-21 | 1974-06-21 | Vorrichtung zur luftkuehlung eines scheibenthyristors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5113578A true JPS5113578A (ja) | 1976-02-03 |
JPS583384B2 JPS583384B2 (ja) | 1983-01-21 |
Family
ID=5918677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50073633A Expired JPS583384B2 (ja) | 1974-06-21 | 1975-06-17 | ヒラガタハンドウタイソシノ クウレイソウチ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS583384B2 (ja) |
DE (1) | DE2429985A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56112482U (ja) * | 1980-01-31 | 1981-08-31 | ||
JPH03134453A (ja) * | 1989-10-16 | 1991-06-07 | Fujitsu Ltd | 放熱装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4212349A (en) * | 1979-01-02 | 1980-07-15 | International Business Machines Corporation | Micro bellows thermo capsule |
US4313492A (en) * | 1979-12-20 | 1982-02-02 | International Business Machines Corporation | Micro helix thermo capsule |
JPH0324946U (ja) * | 1989-07-19 | 1991-03-14 | ||
DE19628546A1 (de) * | 1996-07-16 | 1998-01-22 | Abb Patent Gmbh | Verfahren zur Herstellung eines Wärmeleitrohres |
FR2895589B1 (fr) * | 2005-12-23 | 2008-03-14 | Valeo Equip Electr Moteur | Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne. |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4887779A (ja) * | 1972-02-01 | 1973-11-17 | ||
JPS4896287A (ja) * | 1972-02-25 | 1973-12-08 |
-
1974
- 1974-06-21 DE DE2429985A patent/DE2429985A1/de active Pending
-
1975
- 1975-06-17 JP JP50073633A patent/JPS583384B2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4887779A (ja) * | 1972-02-01 | 1973-11-17 | ||
JPS4896287A (ja) * | 1972-02-25 | 1973-12-08 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56112482U (ja) * | 1980-01-31 | 1981-08-31 | ||
JPS6126781Y2 (ja) * | 1980-01-31 | 1986-08-11 | ||
JPH03134453A (ja) * | 1989-10-16 | 1991-06-07 | Fujitsu Ltd | 放熱装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS583384B2 (ja) | 1983-01-21 |
DE2429985A1 (de) | 1976-01-08 |
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