JPS48102574A - - Google Patents

Info

Publication number
JPS48102574A
JPS48102574A JP48023801A JP2380173A JPS48102574A JP S48102574 A JPS48102574 A JP S48102574A JP 48023801 A JP48023801 A JP 48023801A JP 2380173 A JP2380173 A JP 2380173A JP S48102574 A JPS48102574 A JP S48102574A
Authority
JP
Japan
Prior art keywords
semiconductor body
thermal conductivity
high thermal
external leads
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48023801A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5624376B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS48102574A publication Critical patent/JPS48102574A/ja
Publication of JPS5624376B2 publication Critical patent/JPS5624376B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/60—
    • H10W40/70—
    • H10W40/778—
    • H10W72/0198—
    • H10W74/131—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H10W72/07336—
    • H10W72/07636—
    • H10W72/926—
    • H10W74/00—
    • H10W90/766—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2380173A 1972-03-01 1973-03-01 Expired JPS5624376B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23076072A 1972-03-01 1972-03-01

Publications (2)

Publication Number Publication Date
JPS48102574A true JPS48102574A (enExample) 1973-12-22
JPS5624376B2 JPS5624376B2 (enExample) 1981-06-05

Family

ID=22866458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2380173A Expired JPS5624376B2 (enExample) 1972-03-01 1973-03-01

Country Status (4)

Country Link
US (1) US3763403A (enExample)
JP (1) JPS5624376B2 (enExample)
GB (1) GB1365658A (enExample)
IE (1) IE37284B1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080768A (enExample) * 1973-11-14 1975-07-01
JPS5146875A (en) * 1974-10-18 1976-04-21 Matsushita Electric Industrial Co Ltd Shusekikairo
WO2012120568A1 (ja) * 2011-03-09 2012-09-13 パナソニック株式会社 半導体装置

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839660A (en) * 1973-02-05 1974-10-01 Gen Motors Corp Power semiconductor device package
US3935501A (en) * 1975-02-13 1976-01-27 Digital Components Corporation Micro-miniature light source assemblage and mounting means therefor
US4067041A (en) * 1975-09-29 1978-01-03 Hutson Jearld L Semiconductor device package and method of making same
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
US4314270A (en) * 1977-12-02 1982-02-02 Mitsubishi Denki Kabushiki Kaisha Hybrid thick film integrated circuit heat dissipating and grounding assembly
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS6020943Y2 (ja) * 1979-08-29 1985-06-22 三菱電機株式会社 半導体装置
US5032898A (en) * 1979-12-10 1991-07-16 Amp Incorporated Electro-optic device assembly having integral heat sink/retention means
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
JPS58500463A (ja) * 1981-03-23 1983-03-24 モトロ−ラ・インコ−ポレ−テッド めっきのしてないパッケ−ジを含む半導体デバイス
US4495515A (en) * 1982-07-26 1985-01-22 At&T Bell Laboratories Electrically isolating two piece mounting washer arrangement
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
USH73H (en) 1983-08-25 1986-06-03 At&T Bell Laboratories Integrated circuit packages
FR2570877B1 (fr) * 1984-09-21 1987-05-22 Silicium Semiconducteur Ssc Composant semi-conducteur monte en boitier plastique et procede de montage correspondant
WO1989008325A1 (fr) * 1988-03-05 1989-09-08 Deutsche Itt Industries Gmbh Composant semi-conducteur a deux connexions, et procede et dispositif pour sa fabrication
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
US5339218A (en) * 1993-05-20 1994-08-16 Microsemi Corporation Surface mount device
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
US6727585B2 (en) 2001-05-04 2004-04-27 Ixys Corporation Power device with a plastic molded package and direct bonded substrate
JP2007505505A (ja) 2004-01-10 2007-03-08 エイチブイブイアイ・セミコンダクターズ・インコーポレイテッド パワー半導体装置およびそのための方法
EP1565045B1 (en) * 2004-02-12 2010-08-25 Askoll Holding S.r.l. Discrete electronic component and related assembling method
US8530963B2 (en) * 2005-01-06 2013-09-10 Estivation Properties Llc Power semiconductor device and method therefor
KR20110044793A (ko) * 2008-08-21 2011-04-29 에이저 시스템즈 인크 Ｓｎ-필름 내의 휘스커의 완화
CN103646927B (zh) * 2013-12-25 2016-02-24 江苏东晨电子科技有限公司 大功率方片可控硅封装结构
GB2614724B (en) 2022-01-13 2024-05-08 Mtal Gmbh Semiconductor module

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
FR1553893A (enExample) * 1967-11-28 1969-01-17
US3581387A (en) * 1967-11-29 1971-06-01 Gen Motors Corp Method of making strip mounted semiconductor device
US3469017A (en) * 1967-12-12 1969-09-23 Rca Corp Encapsulated semiconductor device having internal shielding
US3549958A (en) * 1968-05-03 1970-12-22 Unitrode Corp High power stud mounted diode
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3609471A (en) * 1969-07-22 1971-09-28 Gen Electric Semiconductor device with thermally conductive dielectric barrier
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080768A (enExample) * 1973-11-14 1975-07-01
JPS5146875A (en) * 1974-10-18 1976-04-21 Matsushita Electric Industrial Co Ltd Shusekikairo
WO2012120568A1 (ja) * 2011-03-09 2012-09-13 パナソニック株式会社 半導体装置
US9111920B2 (en) 2011-03-09 2015-08-18 Panasonic Intellectual Property Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
US3763403A (en) 1973-10-02
IE37284B1 (en) 1977-06-22
JPS5624376B2 (enExample) 1981-06-05
IE37284L (en) 1973-09-01
GB1365658A (en) 1974-09-04

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