CN103646927B - 大功率方片可控硅封装结构 - Google Patents
大功率方片可控硅封装结构 Download PDFInfo
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- CN103646927B CN103646927B CN201310724868.1A CN201310724868A CN103646927B CN 103646927 B CN103646927 B CN 103646927B CN 201310724868 A CN201310724868 A CN 201310724868A CN 103646927 B CN103646927 B CN 103646927B
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- CN
- China
- Prior art keywords
- solder layer
- external conductive
- square piece
- conductive casing
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 19
- 239000010703 silicon Substances 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 17
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000002950 deficient Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310724868.1A CN103646927B (zh) | 2013-12-25 | 2013-12-25 | 大功率方片可控硅封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310724868.1A CN103646927B (zh) | 2013-12-25 | 2013-12-25 | 大功率方片可控硅封装结构 |
Publications (2)
Publication Number | Publication Date |
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CN103646927A CN103646927A (zh) | 2014-03-19 |
CN103646927B true CN103646927B (zh) | 2016-02-24 |
Family
ID=50252125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201310724868.1A Active CN103646927B (zh) | 2013-12-25 | 2013-12-25 | 大功率方片可控硅封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN103646927B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104241122B (zh) * | 2014-09-29 | 2017-05-10 | 广安市嘉乐电子科技有限公司 | 一种片状硅粒子整流二极管的生产方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
US6287894B1 (en) * | 1999-10-04 | 2001-09-11 | Andersen Laboratories, Inc. | Acoustic device packaged at wafer level |
CN1812091A (zh) * | 2004-12-28 | 2006-08-02 | 日产自动车株式会社 | 半导体装置 |
CN202134538U (zh) * | 2011-07-14 | 2012-02-01 | 浙江华晶整流器有限公司 | 平板式可控硅 |
CN203644755U (zh) * | 2013-12-25 | 2014-06-11 | 江苏东光微电子股份有限公司 | 大功率方片可控硅封装结构 |
-
2013
- 2013-12-25 CN CN201310724868.1A patent/CN103646927B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
US6287894B1 (en) * | 1999-10-04 | 2001-09-11 | Andersen Laboratories, Inc. | Acoustic device packaged at wafer level |
CN1812091A (zh) * | 2004-12-28 | 2006-08-02 | 日产自动车株式会社 | 半导体装置 |
CN202134538U (zh) * | 2011-07-14 | 2012-02-01 | 浙江华晶整流器有限公司 | 平板式可控硅 |
CN203644755U (zh) * | 2013-12-25 | 2014-06-11 | 江苏东光微电子股份有限公司 | 大功率方片可控硅封装结构 |
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Publication number | Publication date |
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CN103646927A (zh) | 2014-03-19 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151211 Address after: 214205 Yixing New Street Lily Industrial Park, Jiangsu, Wuxi Applicant after: JIANGSU DONGCHEN ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 214205 Yixing New Street Lily Industrial Park, Jiangsu, Wuxi Applicant before: JIANGSU DONGGUANG MICRO-ELECTRONICS Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High power square thyristor packaging structure Granted publication date: 20160224 Pledgee: Wuxi rural commercial bank Limited by Share Ltd. Yixing branch Pledgor: JIANGSU DONGCHEN ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2024980004632 |