JPH1197595A - Semiconductor cooling apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for cooling plural semiconductor devices which is reduced in size and enhanced in cooling performance, by bonding each of plural radiator fins commonly to plural heat pipes, each of which is bonded to a corresponding each of plural heat receiving blocks. SOLUTION: In the heat radiator, semiconductor devices 1 and heat receiving blocks 2 of a heat pipe cooler are placed in line alternately to each other. The in-line stacked semiconductor devices 1 and the heat receiving blocks 2 are press-bunched with the spring force of two plate springs 4 each of which is placed at each end and each of which is insulated from the bunch with an insulating washer 3 at each end. Each heat-pipe 5 is bonded to a corresponding each of the heat receiving blocks 2 at its one end, and is bonded to plural heat-radiating fins 6 that are bonded commonly to all of the plural heat-pipes 5. An insulator 7 is provided to each heat pipe 5 between its heat receiving side and its heat radiating side to mutually insulate them from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor cooling device.

[0002]

2. Description of the Related Art A semiconductor device used for a control device of a railway vehicle requires some cooling device due to its own heat generation. The cooling device is selected according to the external dimensions of the entire device, the type of semiconductor element, the amount of heat generated, and the like. As such a cooling device, a heat pipe type cooler utilizing the boiling and condensing action of a refrigerant may be used.

FIG. 11 is a configuration diagram of a semiconductor cooling device, and FIG.
2 is a configuration diagram of a heat pipe type cooler. The semiconductor cooling device includes a semiconductor element 20 and a heat pipe type cooler 21.
Are alternately arranged, both ends are insulated by an insulating seat 22, and each semiconductor element 20 and the heat pipe cooler 21 are pressed and laminated by the spring force of a leaf spring 23. In order to improve the cooling of the semiconductor element 20, the heat receiving section blocks 24 are arranged on both sides of one semiconductor element 20 so as to be sandwiched therebetween.

A plurality of heat pipes 25 have one end joined to a heat receiving section block 24 having good heat conduction, and a plurality of heat radiation fins 26 attached to the other end. Further, an insulator 27 is provided to insulate the heat receiving side and the heat radiating side.

[0005] Such a heat pipe type cooler 21 comprises:
In order to enhance the cooling performance, it is necessary to increase the surface area of the radiation fin 26. However, on the other hand, since the semiconductor cooling device is installed in a place where space is limited, such as a railway vehicle, it is essential to reduce the size of the entire semiconductor cooling device. In general, in the self-cooling type in which the cooling of the radiating fins 26 is performed by natural convection, the radiating fins 26 are wider than the heat receiving unit block 24. When attempting to configure the device, the size of the semiconductor cooling device is determined by the width of the radiating fins 26. For this reason, a spacer 28 for adjusting the length determined by the radiation fins 26 to the length of the semiconductor cooling device is arranged and laminated on the laminated portion of the semiconductor element 20 and the heat receiving unit block 24.

[0006]

In such a conventional semiconductor cooling device, the width of the radiating fins is determined by the amount of self-heating of the semiconductor element pressed against both sides or one side of the heat receiving block of the heat pipe. .

[0007] Since the semiconductor elements used in the drive control device of the railway vehicle perform ignition and extinction according to the operation of the railway vehicle, the heat value of each semiconductor element is not constant. Also, since the thermal time constant of the semiconductor cooling device is relatively small,
A semiconductor cooling device having a heat radiation area capable of cooling in a region where the heat generation is large is required. Therefore, the self-heating values of a plurality of semiconductor elements may not be the same, but on the other hand, it is desirable that the heat pipe type coolers are all the same from the viewpoint of configuration and standardization. Is determined by the heat pipe type cooler which receives the largest amount of heat, so that the semiconductor device cooling device as a whole could not be configured to the required minimum dimensions.

In order to compensate for a dimensional difference between the length of the semiconductor cooling device determined by the width of the radiation fins and the length of the stacked portion of the semiconductor element and the heat receiving section block, the semiconductor device stacked portion side The length of the heat receiving unit block is increased by inserting a spacer for adjusting the length of the heat receiving part block, but this is only for adjusting the length of the semiconductor cooling device, and it increases the number of parts and mass. Connect. Furthermore, simply increasing the thickness of the heat receiving unit block increases the temperature difference due to heat conduction in the heat receiving unit block, which may lead to a decrease in cooling performance, which is a factor that hinders miniaturization and weight reduction. .

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. Even when a plurality of semiconductor elements are cooled, a plurality of radiating fins are connected to a plurality of heat-receiving block heat pipes. It is an object of the present invention to provide a semiconductor cooling device which is reduced in size and improved in cooling performance by being jointed to a semiconductor cooling device.

[0010]

In order to achieve the above object, according to the first aspect of the present invention, a plurality of heat receiving unit blocks, and a plurality of the heat receiving unit blocks and a plurality of semiconductor elements are alternately stacked. A first means, a plurality of heat pipes each having one end inserted into the plurality of heat receiving unit blocks, and the other end of each of the plurality of heat pipes inserted into the plurality of heat receiving unit blocks. And a plurality of radiation fins attached to the fin.

According to a second aspect of the present invention, a plurality of heat receiving unit blocks, a first means for alternately stacking the plurality of heat receiving unit blocks and a plurality of semiconductor elements, and a juxtaposition to the first means are provided. A second means for alternately stacking the plurality of heat receiving unit blocks and the plurality of semiconductor elements; a plurality of heat pipes each having one end inserted into the plurality of heat receiving unit blocks; It has a plurality of heat radiation fins commonly attached to the other end of each of the plurality of heat pipes inserted into the block.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the plurality of radiating fins have an uneven surface. The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein, among the plurality of radiating fins, a plurality of radiating fins on the side of the plurality of heat receiving unit blocks are provided. It is characterized by being divided into a plurality of heat receiving unit blocks.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the plurality of radiating fins are provided substantially at the center of the first or second means in the stacking direction. And dividing the plurality of heat receiving unit blocks and the plurality of semiconductor elements into the first semiconductor element so that the sum of the calorific values of the plurality of semiconductor elements is substantially the same across the substantially center.
Alternatively, lamination is performed by the second means.

According to a sixth aspect of the present invention, in the second aspect of the invention, the sum of the calorific values of the plurality of semiconductor elements stacked by the first means is stacked by the second means. A plurality of semiconductor elements are stacked by the first and second means so as to be larger than a sum of heat generation values of the plurality of semiconductor elements, and the second means is provided below the first means. Features.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, a groove is provided on a surface of the plurality of heat receiving unit blocks on which the semiconductor elements are stacked. Features.

According to an eighth aspect of the present invention, in the first aspect of the present invention, the plurality of heat pipes each have one end connected to the plurality of heat receiving unit blocks via an insulator. And the insulator is formed in a bellows shape between the other end to which the radiation fin is attached and the insulator.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a configuration diagram of a semiconductor cooling device according to a first embodiment of the present invention, and FIG.
FIG. 2 is a configuration diagram of a heat pipe type cooler in the semiconductor cooling device of FIG. 1.

In the semiconductor cooling device, a plurality of semiconductor elements 1 and a plurality of heat receiving section blocks 2 of a heat pipe type cooler are alternately arranged, both ends are insulated by an insulating seat 3, and a leaf spring 4 is provided.
Each semiconductor element 1 and the heat receiving section block 2 of the heat pipe type cooler are pressed and laminated by the spring force described above.

One end of each of the plurality of heat pipes 5 is joined to the heat receiving unit block 2 having good heat conduction, and a plurality of radiating fins 6 are commonly attached to the plurality of heat pipes 5 at the other end. . Further, an insulator 7 is provided to insulate the heat receiving side and the heat radiating side.

The semiconductor cooling device configured as described above has
The heat radiation fins 6 are installed at an angle to the heat receiving unit block 2 so as to be higher than the heat receiving unit block 2. When the semiconductor element 1 is energized and generates heat, heat from the semiconductor element 1 is transmitted to the heat receiving unit block 2, transmitted to the common radiating fins 6 via the heat pipe 5, and radiated to the atmosphere using natural convection. You. Since the radiating fins 6 are commonly attached to the plurality of heat receiving unit blocks 2 and the heat pipes 5 as described above, the radiating fins 6 around the heat pipes 5 having a small amount of received heat are separated from the heat pipes 5 having a large amount of received heat. Since the amount of heat transmitted can contribute to heat radiation, the size of the heat radiation fins 6 can be reduced overall. In addition, since an extra spacer for adjusting the length of the semiconductor element 1 on the side of the laminated portion to the length of the semiconductor cooling device determined by the width of the radiation fins 6 is not required, the size can be reduced, and the high performance can be achieved. A semiconductor cooling device can be provided. Also,
In the conventional device in which the radiation fins were divided, it was necessary to keep an interval so that adjacent radiation fins did not come into contact with each other due to vibration, etc. Therefore, a large heat radiation area can be obtained.

FIG. 3 is a configuration diagram of a semiconductor cooling device according to a second embodiment of the present invention. This figure corresponds to FIG. 1B in which the first embodiment is viewed from the side. In this embodiment, the semiconductor cooling device of the first embodiment is
Heat receiving unit blocks 2a, 2 arranged in stages and arranged one above the other
The heat radiating fins 6 are provided in common for the heat pipes 5a and 5b inserted into the heat pipes 5a and 5b. With this configuration, the first semiconductor device can be used between the upper and lower semiconductor devices.
The same effects as those of the embodiment can be obtained, and a semiconductor cooling device that can be reduced in size and weight can be provided.

FIG. 4 is a block diagram of a heat pipe type cooler showing a third embodiment of the present invention. This figure corresponds to FIG. In the present embodiment, the radiation fin 6a is formed in a corrugated shape having irregularities. Note that the radiation fins 6a formed in a wave shape may be all or a part. With this configuration, the heat radiation area of the heat radiation fins 6a can be increased without increasing the width of the cooling device as compared with the first embodiment.
A semiconductor cooling device that can be reduced in weight can be provided. Further, according to the present embodiment, it is possible to widen the interval between the heat receiving unit blocks 2 to the right and left due to the flexibility of the wave-shaped radiating fins 6a, and to insert and incorporate the semiconductor element between the adjacent heat receiving unit blocks 2 during manufacturing. It is also easy to do.

FIG. 5 is a configuration diagram of a heat pipe type cooler showing a fourth embodiment of the present invention. This figure corresponds to FIG. In the present embodiment, several radiation fins 6b on the side close to the heat receiving unit block 2 are divided for each heat receiving unit block 2. With this configuration, the same effect as that of the first embodiment can be obtained, and the restriction between the heat receiving portion block 2 due to the joining of the heat radiating fin 6b and the heat pipe 5 can be reduced. Due to the flexibility of the heat pipe 5 in the vicinity, the interval between the heat receiving unit blocks 2 can be widened to the left and right, and it becomes easy to insert and incorporate a semiconductor element between the adjacent heat receiving unit blocks 2 during manufacturing.

FIG. 6 is a configuration diagram of a semiconductor cooling device according to a fifth embodiment of the present invention. This figure corresponds to FIG. 1A in which the first embodiment is viewed from the front. In the present embodiment, the radiation fins 6c and 6d are divided into two near the axial center of the semiconductor cooling device.
That is, the heat radiating fins 5c are joined to the heat pipe 5c inserted into the heat receiving unit block 2c,
Heat radiating fins 5d are joined to the heat pipe 5d inserted into the heat pipe 5d, and are provided with insulators 7c and 7d, respectively, for the purpose of insulating the heat receiving side and the heat radiating side. At this time, the semiconductor element 1 may be arranged so that the sum of the heat values of the semiconductor element 1 is substantially the same between the two divided heat pipe coolers. With this configuration, the same effect as that of the first embodiment can be obtained, and the radiation fins 6 can be obtained.
The sizes of c and 6d are reduced to about half, making it easy to manufacture and handling.

FIGS. 7 and 8 are configuration diagrams of a semiconductor cooling apparatus showing a sixth embodiment of the present invention. FIG. 7 is a side view of the unit, and FIG. 8 is an AA perspective view of FIG. The present embodiment has a configuration in which a plurality of heat pipe type coolers 8a and 8b and other electric components 9 are unitized to be mounted under the floor of a railway vehicle. Semiconductor element 1a generating a large amount of heat
Are alternately arranged with the heat receiving block 2e, both ends are insulated by the insulating seat 3a, and each semiconductor element 1a and the heat receiving block 2e of the heat pipe type cooler 8a are pressed and laminated by the spring force of the leaf spring 4a. It is composed. In addition, the semiconductor element 1 b having a small heat generation amount is connected to the heat receiving section block 2.
and the semiconductor element 1b and the heat receiving block 2f of the heat pipe cooler 8b are insulated at both ends by an insulating seat 3b, and furthermore, by the spring force of a leaf spring 4b.
Are laminated by pressure welding.

Then, the heat pipe type cooler 8a having a large sum of heat generation is arranged above and the heat pipe type cooler 8b having a small sum of heat generation is arranged below. With this configuration, the same effect as that of the first embodiment can be obtained, and the number of radiating fins of the heat pipe type cooler 8a arranged at the upper part can be reduced by changing the number of heat fins arranged at the lower part. The number of radiating fins of the cooler 8b can be increased, and the cooling efficiency of the heat pipe cooler 8a for cooling the semiconductor element 1a generating a large amount of heat can be improved.

FIG. 9 is a detailed block diagram of a heat receiving unit block of a semiconductor cooling device according to a seventh embodiment of the present invention.
In the present embodiment, a groove 10 having a width and a depth of about 1 mm is formed on the surface of the heat receiving unit block 2g to be pressed against the semiconductor element, from the center to the end of the heat receiving unit block 2g. With this configuration, the same effect as that of the first embodiment can be obtained, and a pin for positioning the semiconductor cooling device with respect to the center of the axis of the semiconductor cooling device is attached to the semiconductor element to be stacked. Groove 1 provided in heat receiving block 2g
By sliding to 0, heat receiving block 2g
Can be easily inserted and incorporated between the adjacent heat receiving unit blocks 2g without displacing the semiconductor element.
By inserting a thermocouple into the groove 10 during a temperature test, the temperature rise of the semiconductor element can be measured.

FIG. 10 is a configuration diagram of a main part of a heat pipe type cooler according to an eighth embodiment of the present invention, and corresponds to the main part of FIG. In the present embodiment, the heat pipe 5e is formed in a flexible bell-like shape between the radiating fin 6 and the insulator 7. With this configuration, the same effects as those of the first embodiment can be obtained, and
Due to the flexibility of the bellows-shaped part of the heat pipe 5e,
Adjacent heat receiving unit blocks 2 can be expanded right and left, and a semiconductor element can be easily inserted and incorporated.

[0029]

As described above, according to the present invention, even when a plurality of semiconductor elements are cooled, a plurality of heat radiation fins are jointly connected to a plurality of heat receiving unit blocks and heat pipes. It is possible to provide a semiconductor cooling device that achieves miniaturization and improved cooling performance.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a semiconductor cooling device according to a first embodiment of the present invention, in which (a) is a front view and (b) is a side view.

FIG. 2 is a configuration diagram of the heat pipe type cooler of FIG.

FIG. 3 is a side view of a semiconductor cooling device according to a second embodiment of the present invention.

FIG. 4 is a configuration diagram of a heat pipe type cooler showing a third embodiment of the present invention.

FIG. 5 is a configuration diagram of a heat pipe type cooler showing a fourth embodiment of the present invention.

FIG. 6 is a front view of a semiconductor cooling device according to a fifth embodiment of the present invention.

FIG. 7 is a unit side view of a semiconductor cooling device according to a sixth embodiment of the present invention.

8 is an AA perspective view of FIG. 7;

FIG. 9 is a detailed configuration diagram of a heat receiving unit block of a semiconductor cooling device according to a seventh embodiment of the present invention.

FIG. 10 is a main part configuration diagram of a heat pipe type cooler showing an eighth embodiment of the present invention.

FIG. 11 is a configuration diagram of a conventional semiconductor cooling device.

FIG. 12 is a configuration diagram of a conventional heat pipe type cooler.

[Explanation of symbols]

1, 1a, 1b: semiconductor element 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g: heat receiving unit block 3, 3a, 3b: insulating seat 4, 4a, 4b: leaf spring 5, 5a, 5b, 5c , 5d, 5e: Heat pipes 6, 6a, 6b, 6c, 6d: Heat radiating fins 7, 7a, 7b, 7c, 7d: Insulators 8a, 8b: Heat pipe type cooler 9: Electric components 10: Grooves

Claims (8)

[Claims] 1. A plurality of heat receiving unit blocks, a first means for alternately stacking the plurality of heat receiving unit blocks and a plurality of semiconductor elements, and a plurality of ends each having one end inserted into each of the plurality of heat receiving unit blocks. A semiconductor cooling device comprising: a plurality of heat pipes; and a plurality of radiation fins commonly attached to the other ends of the plurality of heat pipes inserted into the plurality of heat receiving unit blocks. 2. A plurality of heat receiving unit blocks; first means for alternately stacking the plurality of heat receiving unit blocks and a plurality of semiconductor elements; and a plurality of heat receiving unit blocks provided in parallel with the first means. A second means for alternately stacking a plurality of semiconductor elements and a plurality of semiconductor elements; a plurality of heat pipes each having one end inserted into the plurality of heat receiving unit blocks; and a plurality of heat pipes inserted into the plurality of heat receiving unit blocks. A semiconductor cooling device having a plurality of heat radiation fins commonly attached to the other end of each of the heat pipes. 3. The semiconductor cooling device according to claim 1, wherein the plurality of heat radiation fins have an uneven surface. 4. The semiconductor cooling device according to claim 1, wherein, of the plurality of radiating fins, a plurality of radiating fins on the side of the plurality of heat receiving unit blocks are connected to the plurality of radiating fins. A semiconductor cooling device characterized by being divided for each heat receiving unit block. 5. The semiconductor cooling device according to claim 1, wherein at a substantially center in a stacking direction by said first or second means,
The plurality of radiation fins are divided, and the plurality of heat receiving unit blocks and the plurality of semiconductor elements are divided into a plurality of pieces so that the sum of the heat values of the plurality of semiconductor elements is substantially the same across the substantially center. A semiconductor cooling device, wherein the semiconductor cooling device is stacked by the first or second means. 6. The semiconductor cooling device according to claim 2, wherein the sum of the calorific values of the plurality of semiconductor elements stacked by the first means is equal to the sum of the plurality of semiconductor elements stacked by the second means. The first heat generation amount is set to be larger than the sum of the heat values.
And a semiconductor cooling device, wherein a plurality of semiconductor elements are stacked by the second means, and the second means is arranged below the first means. 7. The semiconductor cooling device according to claim 1, wherein a groove is provided on a surface of the plurality of heat receiving unit blocks on which the semiconductor elements are stacked. apparatus. 8. The semiconductor cooling device according to claim 1, wherein one end of each of the plurality of heat pipes is inserted into each of the plurality of heat receiving unit blocks via an insulator. A semiconductor cooling device, wherein a space between the other end to which the heat radiation fin is attached and the insulator is formed in a bellows shape.