JPH047860A - Semiconductor stack - Google Patents

Abstract

PURPOSE:To reduce the number of parts and realize a small-sized light-weight device, by arranging a heat receiving part block together with a semiconductor element on the same axis in the front and rear direction, and arranging heat dissipating fins adjacent in front and rear so as to be alternately shifted right and left. CONSTITUTION:The upper end portions of heat pipes 13 of each heat-pipe radiator 11 and heat dissipating fins 14 fixed to said portions are arranged so as to be alternately shifted right and left, and arrayed in the front and rear direction. Hence, when the front and rear width of the fin is large, the fins can be overlapped so as to be shifted right and left, so that the front and rear length in total can be reduced by the front and rear amount of the overlapping part. As a result, it is unnecessary for a spacer for adjusting length to be inserted between the adjacent heat-pipe radiators. Thereby a device is miniaturized as a whole; the number of parts can be reduced because the spacer is unnecessitated; the center alignment at the time of assembly is facilitated; the uniformity of pressing contact force can be improved; reliability can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) This invention relates to a semiconductor stack using a heat pipe type heat sink.

(Prior art) Semiconductor devices that generate a large amount of heat, such as high-current thyristors, must constantly remove the generated heat using some kind of heat dissipation means, and for this purpose, heat pipe type heat sinks have traditionally been sandwiched with the semiconductor device. Semiconductor stacks configured in an arrangement of structures have been used. 7 to 9 show the configuration of such a conventional semiconductor stack, where FIG. 7 is a side view, FIG. 8 is a plan view, and FIG. 9 is a sectional view taken along the line IX-IX in FIG. 7. It is.

This conventional semiconductor stack includes a flat semiconductor element 1,
A plurality of heat pipe type radiators 2 are stacked in a sandwich structure in the front-rear direction, and both ends are insulated by an insulating seat 3, and each part is pressed into contact with a disc spring 4 provided at one end. The structure is such that

The heat pipe type radiator 2 is arranged so that one semiconductor element 1 is sandwiched between two heat pipe type radiators 2 from the front and rear in order to cool the flat semiconductor element 1 well. The structure of the heat pipe type radiator 2 is such that one end of a plurality of heat pipes 5 is embedded in a heat receiving block 6 with good heat conduction, and a heat radiating fin 7 is provided on the other end of the heat radiating side to enhance the heat radiating effect. It has been installed. Note that an insulator 8 is provided in the middle of the heat pipe 5 for the purpose of insulating the heat receiving side and the heat radiating side.

In a conventional semiconductor stack having such a configuration, in order to improve the cooling performance of the heat pipe type heat sink 2, it is necessary to increase the surface area of the heat radiation fins 7. In order to reduce the temperature difference between the two, it is necessary to reduce the width of the heat receiving block 6 in the front-rear direction, that is, the thickness.

Therefore, in general, in the heat pipe type heat sink 2, the width of the heat radiation fins 7 in the front and back direction is larger than the thickness of the heat receiving block 6, and the plurality of semiconductor elements 1 are connected to the heat pipe type heat sink 2 in the front and rear direction. When stacking them in a sandwich structure to form one semiconductor stack, the width of the heat dissipation fins 7 determines the front and back length of the semiconductor stack. In the laminated part, a spacer 9 for length adjustment is provided between the heat receiving block 6.6 of the heat pipe type heat radiator 2.2 that is adjacent back to back, and the length of the semiconductor is determined by the width of the heat radiating fin 7. It was configured into a stack.

(Problem to be Solved by the Invention) However, in conventional semiconductor stacks, length adjustment spacers are used on the heat receiving block side to match the front and rear widths of the heat dissipation fins. In addition, as the number of stacked components increases, it becomes difficult to align the center of each component with the center of the semiconductor stack. There were problems that could lead to the destruction of the

The present invention has been made in view of these conventional problems, and it is an object of the present invention to provide a semiconductor stack that can be assembled with a reduced number of parts and that can also be made smaller and lighter.

[Structure of the Invention] (Means for Solving the Problems) A semiconductor stack of the present invention has heat receiving blocks of a plurality of heat pipe type heat radiators arranged together with semiconductor elements on the same axis in the front and back direction, while Adjacent radiation fins are arranged so as to be staggered from side to side.

The heat pipe type heat radiator may have a shape in which the heat pipe extends from the upper surface of the heat receiving block to the right or left, or extends upward from the right or left side of the heat receiving block. An L-shaped extension can be used.

(Function) In the semiconductor stack of the present invention, even if the heat receiving block of the heat pipe type radiator is arranged in a sandwich structure on the same axis in the front and back direction with the semiconductor element, the adjacent heat radiating fins are stacked alternately on the left and right. Therefore, the sum of the front and back widths of the radiation fins of the adjacent heat pipe type radiators does not equal the length in the front and back direction, but the width in the front and back direction of the heat receiving block, In other words, the length is only the sum of the thickness, and the front-to-back length of the semiconductor stack can be made sufficiently shorter than when a conventional spacer is used.

In addition, the heat pipe type radiator has a heat pipe extending from the top side of the heat receiving block to the right or left, or a heat pipe extending upward from the side surface of the heat receiving block in an L-shape. By arranging the heat pipe type heat radiators back to back, the heat receiving block can be placed on the same axis in the front and back direction between the multiple heat pipe type radiators, and the heat radiation fins can be placed on the same axis. Semiconductor stacks can be constructed with the semiconductor stacks being staggered from side to side, and the front-to-back length of the semiconductor stacks can be made shorter than that of conventional semiconductor stacks using length adjustment spacers.

(Example) Hereinafter, embodiments of the present invention will be explained in detail based on the drawings.

FIG. 1 shows a heat pipe type heat sink 11 used in one embodiment of the present invention, and FIGS. 2 to 4 show a sandwich structure in which a plurality of heat pipe type heat sinks 11 are sandwiched together with a plurality of semiconductor elements. 1 shows an example of a semiconductor stack assembled in 1.

In FIG. 1, a heat pipe type heat sink 11 includes a plurality of heat pipes 13 in a heat receiving block 12 having excellent heat conduction.
One end of each heat pipe 13 is embedded, and a large number of rectangular radiation fins 14 are horizontally attached to the other end of each heat pipe 13.

The heat pipe 13 has a bent portion 15 formed at the root portion extending from the heat receiving block 12, and the bent portion 15 is formed in the right or left direction with respect to the front-rear direction defined in FIG.
It extends from the top and is bent upward at another bend 16. Then, this bent portion 15
．． The length between 16 and 16 is the inner edge 17 of the radiation fin 14.
is set to be located slightly outside the vertical center line C of the heat receiving block 12.

In addition, the arrangement relationship between each heat radiation fin 14 and the heat pipe 13 is biased toward one side in the front and back direction with respect to the front-rear intermediate position C' of the rectangular heat radiation fin 14, as can be seen particularly clearly in FIG. The heat pipe 13 is arranged so as to penetrate at the position shown in FIG.

Note that 18 is an insulator that insulates the heat receiving boiling side and the heat dissipating side of the heat pipe 13.

Figures 2 to 4 show the heat pipe type heat radiator 11 described above.
and a plurality of flat semiconductor elements 19 are arranged in a sandwich structure to show an embodiment of the semiconductor stack, in which FIG. 2 is a side view, FIG. 3 is a plan view, and FIG. 4 is a top view. 2 shows a sectional view taken along the line ■-■ in FIG.

This semiconductor stack is assembled in the same manner as the conventional example shown in FIGS. 7 to 9, and includes a plurality of semiconductor elements 1.
9 Heat pipe type heat radiators 1 on both front and back sides for each
1 is arranged in pressure contact, and an insulating seat 20 and a disc spring 21 are placed at both ends.
A fixing plate 22 is disposed between the two, and these are assembled by tightening with bolts 23.

In assembling this semiconductor stack, the heat pipe type heat sinks 11 and 11 that are directly adjacent to each other are placed so that one side is turned over and the other side is turned over so that they are in pressure contact with each other.

This operation causes the adjacent heat pipe radiators 11.11 to
The heat pipes 13 and 13 of the heat pipes 13 and 13 are arranged to be staggered from side to side, and the radiation fins 14 and 14 of the heat pipe type radiators 11 and 11 that are adjacent in the front and back are also arranged to be staggered from side to side.

As a result, as shown in FIG. 3, the heat pipe type heat sink 11.
The dimension a of the overlapping part shifted left and right between 1 and
Heat pipe type radiators back to back 11.11
Compared to the conventional example, the length in the front-to-back direction can be saved by the sum of the dimensions of the overlapping portions shifted left and right between the two.

Note that the present invention is not limited to the above-mentioned embodiment, and an embodiment as shown in FIG. 5 is also possible. In the embodiment shown in FIG. 5, an L-shaped heat pipe 13 is used as the heat pipe type radiator 11.
3 is horizontally buried in the right or left side of the heat receiving block 12, bent so as to extend upward at the bent part 15, and the radiation fins 14 are attached to this vertically extending part. There is.

When assembling the semiconductor stack, the heat pipe type heat sinks 11 adjacent to each other are arranged so that one side is back to back to the other, and the heat sink fins 14 are staggered from side to side. In this way, there is no need for a spacer as in the conventional case where the radiation fins 14 are arranged in a row from front to back, and the length from front to back can be shortened.

FIG. 6 shows still another embodiment, in which the heat receiving block 12 is made into a disk shape in order to eliminate the directionality, the boiling part of the straight heat pipe 13 is embedded in this, and the other end is It has a configuration in which heat dissipation fins 14 are attached.

In this embodiment, when assembling such a heat pipe type heat sink 11 with the semiconductor element 19 in a sandwich structure, the heat pipe type heat sinks 1 adjacent to each other in front and back are
1.11, rotate the heat receiving block 12.12 in opposite directions on the left and right to connect each heat pipe 13,1.
3 are assembled in a state where they are tilted in opposite directions, and by this operation, the radiation fins 14.14 are shifted left and right alternately between the heat pipe type radiators 11.11 that are adjacent in the front and back. This makes it possible to eliminate the need for spacers and save front-to-back length compared to the conventional example.

[Effects of the Invention] As described above, according to the present invention, when assembling a plurality of heat pipe heat sinks and semiconductor elements into a sandwich structure, the upper end of the heat pipe of each heat pipe heat sink and the heat pipe attached thereto are The heat dissipation fins are arranged in a staggered arrangement in the front-rear direction, so even if the front-rear width of the heat-dissipation fins is large, they can be shifted left and right and overlapped, so only the front-rear long direction of the overlapping part is possible. The overall front and back length can be saved, and there is no need to insert a spacer for adjusting the length between adjacent heat pipe type heat sinks as in the past, making the overall size smaller and eliminating the need for spacers. This reduces the number of parts, facilitates center alignment during assembly, improves the uniformity of pressure contact, and improves reliability.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a heat pipe type radiator used in an embodiment of the present invention, and FIG. 2 is a side view of an embodiment of the present invention.
3 is a plan view of the above embodiment, FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2, FIG. 5 is a sectional view of another embodiment of the invention, and FIG. 6 is a further embodiment of the invention. FIG. 7 is a side view of the conventional example, FIG. 8 is a plan view of the conventional example,
FIG. 9 is a sectional view taken along the line IX-IX in FIG. 7. 11... Heat pipe type radiator 12... Heat receiving block 13... Heat pipe 1
4...Radiating fin 15.16...Bending part 19
・・・Semiconductor element

Claims (2)

[Claims] (1) One end of the heat pipe is embedded in the heat receiving block, and a plurality of heat pipe type heat sinks with heat dissipation fins attached to the other end are stacked in the front-back direction to form a sandwich structure. In a semiconductor stack in which each flat semiconductor element is cooled by a heat pipe type heat radiator, the heat receiving block of the plurality of heat pipe type radiators is arranged on the same axis in the front and rear direction together with the semiconductor element, and one , a semiconductor stack characterized in that adjacent heat dissipation fins are arranged in a staggered manner to the left and right. (2) The heat pipe type radiator has a shape in which the heat pipe extends from the upper surface of the heat receiving block to the right or left, or extends upward from the right or left side of the heat receiving block. 2. The semiconductor stack according to claim 1, wherein heat pipe type heat radiators having an L-shape extending toward each other are used and are arranged back to back between adjacent heat pipe type heat radiators.