JPH1197391A - 半導体ウエハー配線電解メッキ方法 - Google Patents
半導体ウエハー配線電解メッキ方法Info
- Publication number
- JPH1197391A JPH1197391A JP26933797A JP26933797A JPH1197391A JP H1197391 A JPH1197391 A JP H1197391A JP 26933797 A JP26933797 A JP 26933797A JP 26933797 A JP26933797 A JP 26933797A JP H1197391 A JPH1197391 A JP H1197391A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wiring
- electrolytic plating
- plating
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 66
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000243 solution Substances 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000007864 aqueous solution Substances 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 45
- 239000000654 additive Substances 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 abstract description 10
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 230000006866 deterioration Effects 0.000 abstract description 3
- 229910003556 H2 SO4 Inorganic materials 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 abstract 1
- 239000008151 electrolyte solution Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26933797A JPH1197391A (ja) | 1997-09-16 | 1997-09-16 | 半導体ウエハー配線電解メッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26933797A JPH1197391A (ja) | 1997-09-16 | 1997-09-16 | 半導体ウエハー配線電解メッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1197391A true JPH1197391A (ja) | 1999-04-09 |
| JPH1197391A5 JPH1197391A5 (OSRAM) | 2004-09-30 |
Family
ID=17470971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26933797A Pending JPH1197391A (ja) | 1997-09-16 | 1997-09-16 | 半導体ウエハー配線電解メッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1197391A (OSRAM) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238704A (ja) * | 1998-02-23 | 1999-08-31 | Ideya:Kk | 半導体基板の配線溝メッキ方法およびメッキ装置 |
| JP2000174025A (ja) * | 1998-12-02 | 2000-06-23 | Internatl Business Mach Corp <Ibm> | エレクトロマイグレ―ション抵抗力を有する微細構造及びその製造方法 |
| JP2000353675A (ja) * | 1999-05-03 | 2000-12-19 | Motorola Inc | 半導体ウェハ上に銅層を形成する方法 |
| WO2001007687A1 (fr) * | 1999-07-26 | 2001-02-01 | Tokyo Electron Limited | Dispositif, procede et systeme de plaquage |
| JP2001152387A (ja) * | 1999-09-16 | 2001-06-05 | Ishihara Chem Co Ltd | ボイドフリー銅メッキ方法 |
| KR20030095005A (ko) * | 2002-06-11 | 2003-12-18 | 김재정 | 반도체 배선용 금속막 형성 방법 |
| US7229916B2 (en) | 2003-07-18 | 2007-06-12 | Nec Electronics Corporation | Method of manufacturing a semiconductor device |
| WO2009055989A1 (en) * | 2007-10-30 | 2009-05-07 | Acm Research (Shanghai) Inc. | Method and apparatus to prewet wafer surface for metallization from electrolyte solution |
| JP2012132058A (ja) * | 2010-12-21 | 2012-07-12 | Ebara Corp | 電気めっき方法 |
| JP2013033893A (ja) * | 2011-06-28 | 2013-02-14 | Sharp Corp | 光半導体素子および光半導体素子の製造方法 |
| US9295167B2 (en) | 2007-10-30 | 2016-03-22 | Acm Research (Shanghai) Inc. | Method to prewet wafer surface |
| JP2018093034A (ja) * | 2016-12-01 | 2018-06-14 | 株式会社カネカ | 太陽電池の製造方法、および電極形成用めっき装置 |
| US10329683B2 (en) | 2016-11-03 | 2019-06-25 | Lam Research Corporation | Process for optimizing cobalt electrofill using sacrificial oxidants |
| JPWO2019130859A1 (ja) * | 2017-12-27 | 2020-12-17 | 株式会社カネカ | 光電変換素子の製造方法及びめっき用治具、めっき装置 |
-
1997
- 1997-09-16 JP JP26933797A patent/JPH1197391A/ja active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238704A (ja) * | 1998-02-23 | 1999-08-31 | Ideya:Kk | 半導体基板の配線溝メッキ方法およびメッキ装置 |
| JP2000174025A (ja) * | 1998-12-02 | 2000-06-23 | Internatl Business Mach Corp <Ibm> | エレクトロマイグレ―ション抵抗力を有する微細構造及びその製造方法 |
| JP2000353675A (ja) * | 1999-05-03 | 2000-12-19 | Motorola Inc | 半導体ウェハ上に銅層を形成する方法 |
| WO2001007687A1 (fr) * | 1999-07-26 | 2001-02-01 | Tokyo Electron Limited | Dispositif, procede et systeme de plaquage |
| US6607650B1 (en) | 1999-07-26 | 2003-08-19 | Tokyo Electron Ltd. | Method of forming a plated layer to a predetermined thickness |
| JP2001152387A (ja) * | 1999-09-16 | 2001-06-05 | Ishihara Chem Co Ltd | ボイドフリー銅メッキ方法 |
| KR20030095005A (ko) * | 2002-06-11 | 2003-12-18 | 김재정 | 반도체 배선용 금속막 형성 방법 |
| US7229916B2 (en) | 2003-07-18 | 2007-06-12 | Nec Electronics Corporation | Method of manufacturing a semiconductor device |
| WO2009055989A1 (en) * | 2007-10-30 | 2009-05-07 | Acm Research (Shanghai) Inc. | Method and apparatus to prewet wafer surface for metallization from electrolyte solution |
| KR101487708B1 (ko) * | 2007-10-30 | 2015-01-29 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 전해질 용액으로부터 금속배선 형성을 위해 웨이퍼 표면을 프리웨팅하는 방법 및 장치 |
| US9295167B2 (en) | 2007-10-30 | 2016-03-22 | Acm Research (Shanghai) Inc. | Method to prewet wafer surface |
| JP2012132058A (ja) * | 2010-12-21 | 2012-07-12 | Ebara Corp | 電気めっき方法 |
| US9376758B2 (en) | 2010-12-21 | 2016-06-28 | Ebara Corporation | Electroplating method |
| JP2013033893A (ja) * | 2011-06-28 | 2013-02-14 | Sharp Corp | 光半導体素子および光半導体素子の製造方法 |
| US10329683B2 (en) | 2016-11-03 | 2019-06-25 | Lam Research Corporation | Process for optimizing cobalt electrofill using sacrificial oxidants |
| US11078591B2 (en) | 2016-11-03 | 2021-08-03 | Lam Research Corporation | Process for optimizing cobalt electrofill using sacrificial oxidants |
| JP2018093034A (ja) * | 2016-12-01 | 2018-06-14 | 株式会社カネカ | 太陽電池の製造方法、および電極形成用めっき装置 |
| JPWO2019130859A1 (ja) * | 2017-12-27 | 2020-12-17 | 株式会社カネカ | 光電変換素子の製造方法及びめっき用治具、めっき装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20050420 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20070508 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20071113 |