JPH1197391A5 - - Google Patents

Info

Publication number
JPH1197391A5
JPH1197391A5 JP1997269337A JP26933797A JPH1197391A5 JP H1197391 A5 JPH1197391 A5 JP H1197391A5 JP 1997269337 A JP1997269337 A JP 1997269337A JP 26933797 A JP26933797 A JP 26933797A JP H1197391 A5 JPH1197391 A5 JP H1197391A5
Authority
JP
Japan
Prior art keywords
wiring
plating
semiconductor wafer
electroplating
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997269337A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1197391A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP26933797A priority Critical patent/JPH1197391A/ja
Priority claimed from JP26933797A external-priority patent/JPH1197391A/ja
Publication of JPH1197391A publication Critical patent/JPH1197391A/ja
Publication of JPH1197391A5 publication Critical patent/JPH1197391A5/ja
Pending legal-status Critical Current

Links

JP26933797A 1997-09-16 1997-09-16 半導体ウエハー配線電解メッキ方法 Pending JPH1197391A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26933797A JPH1197391A (ja) 1997-09-16 1997-09-16 半導体ウエハー配線電解メッキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26933797A JPH1197391A (ja) 1997-09-16 1997-09-16 半導体ウエハー配線電解メッキ方法

Publications (2)

Publication Number Publication Date
JPH1197391A JPH1197391A (ja) 1999-04-09
JPH1197391A5 true JPH1197391A5 (OSRAM) 2004-09-30

Family

ID=17470971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26933797A Pending JPH1197391A (ja) 1997-09-16 1997-09-16 半導体ウエハー配線電解メッキ方法

Country Status (1)

Country Link
JP (1) JPH1197391A (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11238704A (ja) * 1998-02-23 1999-08-31 Ideya:Kk 半導体基板の配線溝メッキ方法およびメッキ装置
US6123825A (en) * 1998-12-02 2000-09-26 International Business Machines Corporation Electromigration-resistant copper microstructure and process of making
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
TW466729B (en) * 1999-07-26 2001-12-01 Tokyo Electron Ltd Plating method and device, and plating system
JP3498306B2 (ja) * 1999-09-16 2004-02-16 石原薬品株式会社 ボイドフリー銅メッキ方法
KR20030095005A (ko) * 2002-06-11 2003-12-18 김재정 반도체 배선용 금속막 형성 방법
JP2005039142A (ja) 2003-07-18 2005-02-10 Nec Electronics Corp 半導体装置の製造方法
KR101487708B1 (ko) * 2007-10-30 2015-01-29 에이씨엠 리서치 (상하이) 인코포레이티드 전해질 용액으로부터 금속배선 형성을 위해 웨이퍼 표면을 프리웨팅하는 방법 및 장치
US9295167B2 (en) 2007-10-30 2016-03-22 Acm Research (Shanghai) Inc. Method to prewet wafer surface
JP5504147B2 (ja) 2010-12-21 2014-05-28 株式会社荏原製作所 電気めっき方法
JP5394461B2 (ja) * 2011-06-28 2014-01-22 シャープ株式会社 光半導体素子の製造方法
US10329683B2 (en) 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
JP6899649B2 (ja) * 2016-12-01 2021-07-07 株式会社カネカ 太陽電池の製造方法、および電極形成用めっき装置
WO2019130859A1 (ja) * 2017-12-27 2019-07-04 株式会社カネカ 光電変換素子の製造方法及びめっき用治具、めっき装置

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