JPH1187899A - 実装基板 - Google Patents
実装基板Info
- Publication number
- JPH1187899A JPH1187899A JP24405097A JP24405097A JPH1187899A JP H1187899 A JPH1187899 A JP H1187899A JP 24405097 A JP24405097 A JP 24405097A JP 24405097 A JP24405097 A JP 24405097A JP H1187899 A JPH1187899 A JP H1187899A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- mounting board
- land
- opening
- solder land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24405097A JPH1187899A (ja) | 1997-09-09 | 1997-09-09 | 実装基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24405097A JPH1187899A (ja) | 1997-09-09 | 1997-09-09 | 実装基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1187899A true JPH1187899A (ja) | 1999-03-30 |
| JPH1187899A5 JPH1187899A5 (enExample) | 2005-03-17 |
Family
ID=17112989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24405097A Abandoned JPH1187899A (ja) | 1997-09-09 | 1997-09-09 | 実装基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1187899A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431867B (zh) | 2007-11-05 | 2011-03-09 | 松下电器产业株式会社 | 安装结构体 |
-
1997
- 1997-09-09 JP JP24405097A patent/JPH1187899A/ja not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431867B (zh) | 2007-11-05 | 2011-03-09 | 松下电器产业株式会社 | 安装结构体 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20040416 Free format text: JAPANESE INTERMEDIATE CODE: A821 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040416 |
|
| A621 | Written request for application examination |
Effective date: 20040416 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| RD02 | Notification of acceptance of power of attorney |
Effective date: 20040416 Free format text: JAPANESE INTERMEDIATE CODE: A7422 |
|
| RD04 | Notification of resignation of power of attorney |
Effective date: 20060316 Free format text: JAPANESE INTERMEDIATE CODE: A7424 |
|
| A762 | Written abandonment of application |
Effective date: 20060814 Free format text: JAPANESE INTERMEDIATE CODE: A762 |