JPH1176956A - 流水式洗浄装置における加圧式給液・整流機構 - Google Patents

流水式洗浄装置における加圧式給液・整流機構

Info

Publication number
JPH1176956A
JPH1176956A JP9252704A JP25270497A JPH1176956A JP H1176956 A JPH1176956 A JP H1176956A JP 9252704 A JP9252704 A JP 9252704A JP 25270497 A JP25270497 A JP 25270497A JP H1176956 A JPH1176956 A JP H1176956A
Authority
JP
Japan
Prior art keywords
liquid
liquid supply
rectification
flow
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9252704A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1176956A5 (enExample
Inventor
Masashi Fujii
井 正 志 藤
Yoshinobu Terui
井 善 信 照
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUPIIDE FUAMU CLEAN SYST KK
Original Assignee
SUPIIDE FUAMU CLEAN SYST KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUPIIDE FUAMU CLEAN SYST KK filed Critical SUPIIDE FUAMU CLEAN SYST KK
Priority to JP9252704A priority Critical patent/JPH1176956A/ja
Priority to US09/136,508 priority patent/US6058950A/en
Publication of JPH1176956A publication Critical patent/JPH1176956A/ja
Publication of JPH1176956A5 publication Critical patent/JPH1176956A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP9252704A 1997-09-02 1997-09-02 流水式洗浄装置における加圧式給液・整流機構 Pending JPH1176956A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9252704A JPH1176956A (ja) 1997-09-02 1997-09-02 流水式洗浄装置における加圧式給液・整流機構
US09/136,508 US6058950A (en) 1997-09-02 1998-08-19 Pressurized liquid-supply and straightening mechanism in a water-flow washing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9252704A JPH1176956A (ja) 1997-09-02 1997-09-02 流水式洗浄装置における加圧式給液・整流機構

Publications (2)

Publication Number Publication Date
JPH1176956A true JPH1176956A (ja) 1999-03-23
JPH1176956A5 JPH1176956A5 (enExample) 2005-06-02

Family

ID=17241096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9252704A Pending JPH1176956A (ja) 1997-09-02 1997-09-02 流水式洗浄装置における加圧式給液・整流機構

Country Status (2)

Country Link
US (1) US6058950A (enExample)
JP (1) JPH1176956A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007275723A (ja) * 2006-04-04 2007-10-25 Hitachi Global Storage Technologies Netherlands Bv 洗浄装置及び洗浄方法
JP2011529395A (ja) * 2008-07-31 2011-12-08 インベンプロ（エム）エスデーエヌ・ビーエイチデー ワークピースの洗浄装置
KR20130001222U (ko) * 2011-08-08 2013-02-25 도쿄엘렉트론가부시키가이샤 공기 청정용 필터 장치

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19934300C2 (de) * 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
TWI233763B (en) * 1999-12-17 2005-06-01 Matsushita Electric Industrial Co Ltd Method of manufacturing a circuit board
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6471566B1 (en) * 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US8707971B2 (en) * 2008-05-16 2014-04-29 Xyratex Corporation Laminated walls for uniform fluid flow
KR102538179B1 (ko) 2018-09-04 2023-06-01 삼성전자주식회사 습식 식각 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014957B2 (ja) * 1996-02-14 2000-02-28 スピードファムクリーンシステム株式会社 流水式洗浄装置
US5836325A (en) * 1996-02-20 1998-11-17 Speedfam Clean System Co., Ltd. Running water type washing machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007275723A (ja) * 2006-04-04 2007-10-25 Hitachi Global Storage Technologies Netherlands Bv 洗浄装置及び洗浄方法
JP2011529395A (ja) * 2008-07-31 2011-12-08 インベンプロ（エム）エスデーエヌ・ビーエイチデー ワークピースの洗浄装置
KR20130001222U (ko) * 2011-08-08 2013-02-25 도쿄엘렉트론가부시키가이샤 공기 청정용 필터 장치

Also Published As

Publication number Publication date
US6058950A (en) 2000-05-09

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