JPH1139898A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH1139898A
JPH1139898A JP9188405A JP18840597A JPH1139898A JP H1139898 A JPH1139898 A JP H1139898A JP 9188405 A JP9188405 A JP 9188405A JP 18840597 A JP18840597 A JP 18840597A JP H1139898 A JPH1139898 A JP H1139898A
Authority
JP
Japan
Prior art keywords
pad
semiconductor device
pads
contact check
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9188405A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1139898A5 (enExample
Inventor
Susumu Tanida
進 谷田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9188405A priority Critical patent/JPH1139898A/ja
Priority to TW086119873A priority patent/TW366492B/zh
Priority to DE19801557A priority patent/DE19801557B4/de
Priority to US09/017,810 priority patent/US5962868A/en
Priority to CNB981040934A priority patent/CN1153068C/zh
Priority to KR1019980011453A priority patent/KR100280024B1/ko
Publication of JPH1139898A publication Critical patent/JPH1139898A/ja
Publication of JPH1139898A5 publication Critical patent/JPH1139898A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/26—Functional testing
    • G06F11/273—Tester hardware, i.e. output processing circuits
    • G06F11/2733—Test interface between tester and unit under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Dram (AREA)
JP9188405A 1997-07-14 1997-07-14 半導体装置 Pending JPH1139898A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP9188405A JPH1139898A (ja) 1997-07-14 1997-07-14 半導体装置
TW086119873A TW366492B (en) 1997-07-14 1997-12-27 Semiconductor having contact checking circuits
DE19801557A DE19801557B4 (de) 1997-07-14 1998-01-16 Kontakt-Prüfschaltung in einer Halbleitereinrichtung
US09/017,810 US5962868A (en) 1997-07-14 1998-02-03 Semiconductor device having contact check circuit
CNB981040934A CN1153068C (zh) 1997-07-14 1998-02-04 具有接触检查电路的半导体装置
KR1019980011453A KR100280024B1 (ko) 1997-07-14 1998-04-01 콘택트 체크 회로를 구비한 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9188405A JPH1139898A (ja) 1997-07-14 1997-07-14 半導体装置

Publications (2)

Publication Number Publication Date
JPH1139898A true JPH1139898A (ja) 1999-02-12
JPH1139898A5 JPH1139898A5 (enExample) 2005-05-12

Family

ID=16223080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9188405A Pending JPH1139898A (ja) 1997-07-14 1997-07-14 半導体装置

Country Status (6)

Country Link
US (1) US5962868A (enExample)
JP (1) JPH1139898A (enExample)
KR (1) KR100280024B1 (enExample)
CN (1) CN1153068C (enExample)
DE (1) DE19801557B4 (enExample)
TW (1) TW366492B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011196813A (ja) * 2010-03-19 2011-10-06 Toshiba Corp 半導体集積回路のテスト方法、および、テストシステム
US8278935B2 (en) 2007-04-05 2012-10-02 Renesas Electronics Corporation Probe resistance measurement method and semiconductor device with pads for probe resistance measurement
KR101274208B1 (ko) * 2007-08-07 2013-06-17 삼성전자주식회사 접촉 불량 검출회로를 구비하는 반도체 장치

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6150669A (en) * 1998-12-18 2000-11-21 Texas Instruments Incorporated Combination test structures for in-situ measurements during fabrication of semiconductor devices
DE19924315C2 (de) * 1999-05-27 2003-10-09 Rohde & Schwarz Verfahren zum Überwachen der Kontaktierungssicherheit eines Netzwerkanalysators
US6115305A (en) * 1999-06-15 2000-09-05 Atmel Corporation Method and apparatus for testing a video display chip
JP2001083217A (ja) * 1999-09-16 2001-03-30 Oki Micro Design Co Ltd 集積回路
JP2004510165A (ja) 2000-09-28 2004-04-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 接点を検査する装置
GB0030346D0 (en) * 2000-12-13 2001-01-24 Mitel Semiconductor Ltd Integrated circuit test structure
US6503765B1 (en) * 2001-07-31 2003-01-07 Xilinx, Inc. Testing vias and contacts in integrated circuit fabrication
EP1446328B1 (en) * 2001-10-16 2017-05-31 Medical Instill Technologies, Inc. DISPENSER WITH SEALED CHAMBER AND ONE−WAY VALVE FOR PROVIDING METERED AMOUNTS OF SUBSTANCES
JP2004085247A (ja) * 2002-08-23 2004-03-18 Mitsubishi Electric Corp プローブカード
FI20050982A0 (fi) * 2005-09-30 2005-09-30 Microsalo Oy Menetelmä, piirilevy ja testauslaite juotosliitosten testaamiseksi
JP4726679B2 (ja) * 2006-03-31 2011-07-20 ルネサスエレクトロニクス株式会社 半導体試験方法および半導体装置
US7776728B2 (en) * 2007-03-02 2010-08-17 United Microelectronics Corp. Rapid thermal process method and rapid thermal process device
KR101438575B1 (ko) * 2008-01-24 2014-09-12 엘지이노텍 주식회사 튜너
US9575114B2 (en) * 2013-07-10 2017-02-21 Elite Semiconductor Memory Technology Inc. Test system and device
JP6339834B2 (ja) * 2014-03-27 2018-06-06 東京エレクトロン株式会社 基板検査装置
TWI639206B (zh) 2018-01-16 2018-10-21 中美矽晶製品股份有限公司 用以檢測半導體元件之通孔電極的導通狀態之檢測系統及檢測方法
CN111273198B (zh) * 2020-02-26 2023-01-24 深圳市元征科技股份有限公司 一种sim检测卡以及检测sim卡座瞬断的方法
US11892521B2 (en) 2021-08-19 2024-02-06 Elite Semiconductor Microelectronics Technology Inc. Semiconductor device with contact check circuitry

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781683A (en) * 1971-03-30 1973-12-25 Ibm Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration
US4801869A (en) * 1987-04-27 1989-01-31 International Business Machines Corporation Semiconductor defect monitor for diagnosing processing-induced defects
JPH04147637A (ja) * 1990-10-09 1992-05-21 Mitsubishi Electric Corp 半導体集積回路のテストプログラムによる試験方法
JPH04333252A (ja) * 1991-05-09 1992-11-20 Nec Corp 半導体論理集積回路
JP2715936B2 (ja) * 1994-09-30 1998-02-18 日本電気株式会社 薄膜トランジスタ型液晶表示装置とその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8278935B2 (en) 2007-04-05 2012-10-02 Renesas Electronics Corporation Probe resistance measurement method and semiconductor device with pads for probe resistance measurement
US9217770B2 (en) 2007-04-05 2015-12-22 Renesas Electronics Corporation Probe resistance measurement method and semiconductor device with pads for probe resistance measurement
KR101274208B1 (ko) * 2007-08-07 2013-06-17 삼성전자주식회사 접촉 불량 검출회로를 구비하는 반도체 장치
JP2011196813A (ja) * 2010-03-19 2011-10-06 Toshiba Corp 半導体集積回路のテスト方法、および、テストシステム

Also Published As

Publication number Publication date
CN1205522A (zh) 1999-01-20
TW366492B (en) 1999-08-11
DE19801557A1 (de) 1999-02-11
DE19801557B4 (de) 2004-08-05
US5962868A (en) 1999-10-05
KR100280024B1 (ko) 2001-03-02
CN1153068C (zh) 2004-06-09
KR19990013347A (ko) 1999-02-25

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