JPH11345900A5 - - Google Patents

Info

Publication number
JPH11345900A5
JPH11345900A5 JP1998149511A JP14951198A JPH11345900A5 JP H11345900 A5 JPH11345900 A5 JP H11345900A5 JP 1998149511 A JP1998149511 A JP 1998149511A JP 14951198 A JP14951198 A JP 14951198A JP H11345900 A5 JPH11345900 A5 JP H11345900A5
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
wiring board
recess
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998149511A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11345900A (ja
JP3834424B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP14951198A priority Critical patent/JP3834424B2/ja
Priority claimed from JP14951198A external-priority patent/JP3834424B2/ja
Priority to US09/322,741 priority patent/US6111309A/en
Publication of JPH11345900A publication Critical patent/JPH11345900A/ja
Publication of JPH11345900A5 publication Critical patent/JPH11345900A5/ja
Application granted granted Critical
Publication of JP3834424B2 publication Critical patent/JP3834424B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP14951198A 1998-05-29 1998-05-29 半導体装置 Expired - Fee Related JP3834424B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP14951198A JP3834424B2 (ja) 1998-05-29 1998-05-29 半導体装置
US09/322,741 US6111309A (en) 1998-05-29 1999-05-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14951198A JP3834424B2 (ja) 1998-05-29 1998-05-29 半導体装置

Publications (3)

Publication Number Publication Date
JPH11345900A JPH11345900A (ja) 1999-12-14
JPH11345900A5 true JPH11345900A5 (enExample) 2005-04-14
JP3834424B2 JP3834424B2 (ja) 2006-10-18

Family

ID=15476750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14951198A Expired - Fee Related JP3834424B2 (ja) 1998-05-29 1998-05-29 半導体装置

Country Status (2)

Country Link
US (1) US6111309A (enExample)
JP (1) JP3834424B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326701B1 (en) * 1999-02-24 2001-12-04 Sanyo Electric Co., Ltd. Chip size package and manufacturing method thereof
DE10025774A1 (de) * 2000-05-26 2001-12-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Oberflächenmetallisierung
DE10037821A1 (de) * 2000-08-03 2002-02-21 Bosch Gmbh Robert Baugruppe, insbesondere Wafer-Baugruppe
DE10145348C1 (de) * 2001-09-14 2003-03-27 Siemens Dematic Ag Zwischenträger für elektronische Bauelemente und Verfahren zur Lötkontaktierung eines derartigen Zwischenträgers
KR100444163B1 (ko) * 2001-12-27 2004-08-11 동부전자 주식회사 솔더조인트 강성 보강장치
US7015590B2 (en) 2003-01-10 2006-03-21 Samsung Electronics Co., Ltd. Reinforced solder bump structure and method for forming a reinforced solder bump
US7719391B2 (en) * 2006-06-21 2010-05-18 Cobham Defense Electronic Systems Corporation Dielectric resonator circuits
CN107481987B (zh) * 2017-06-30 2019-12-06 华为技术有限公司 一种集成电子装置、集成电子装置的生产方法及电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5550408A (en) * 1992-11-18 1996-08-27 Matsushita Electronics Corporation Semiconductor device
EP0645805B1 (en) * 1993-09-29 2000-11-29 Matsushita Electric Industrial Co., Ltd. Method for mounting a semiconductor device on a circuit board, and a circuit board with a semiconductor device mounted thereon
JP3176542B2 (ja) * 1995-10-25 2001-06-18 シャープ株式会社 半導体装置及びその製造方法
JPH09260552A (ja) * 1996-03-22 1997-10-03 Nec Corp 半導体チップの実装構造
US5894167A (en) * 1996-05-08 1999-04-13 Micron Technology, Inc. Encapsulant dam standoff for shell-enclosed die assemblies

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