JPH1134291A - 印刷方法および印刷装置 - Google Patents

印刷方法および印刷装置

Info

Publication number
JPH1134291A
JPH1134291A JP9197348A JP19734897A JPH1134291A JP H1134291 A JPH1134291 A JP H1134291A JP 9197348 A JP9197348 A JP 9197348A JP 19734897 A JP19734897 A JP 19734897A JP H1134291 A JPH1134291 A JP H1134291A
Authority
JP
Japan
Prior art keywords
printing
opening
mask
cream solder
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9197348A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1134291A5 (enExample
Inventor
Katsue Okanoue
佳津江 岡上
Toshiaki Yamauchi
敏明 山内
Toshinori Mimura
敏則 三村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9197348A priority Critical patent/JPH1134291A/ja
Publication of JPH1134291A publication Critical patent/JPH1134291A/ja
Publication of JPH1134291A5 publication Critical patent/JPH1134291A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9197348A 1997-07-23 1997-07-23 印刷方法および印刷装置 Pending JPH1134291A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9197348A JPH1134291A (ja) 1997-07-23 1997-07-23 印刷方法および印刷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9197348A JPH1134291A (ja) 1997-07-23 1997-07-23 印刷方法および印刷装置

Publications (2)

Publication Number Publication Date
JPH1134291A true JPH1134291A (ja) 1999-02-09
JPH1134291A5 JPH1134291A5 (enExample) 2005-05-26

Family

ID=16372996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9197348A Pending JPH1134291A (ja) 1997-07-23 1997-07-23 印刷方法および印刷装置

Country Status (1)

Country Link
JP (1) JPH1134291A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251581A (ja) * 2009-04-17 2010-11-04 Denso Corp 印刷基板の製造方法
JP2010541208A (ja) * 2007-09-20 2010-12-24 フライズ・メタルズ・インコーポレイテッド 太陽電池表側のメタライズのための電気鋳造されたステンシル
WO2011158913A1 (ja) * 2010-06-16 2011-12-22 株式会社コベルコ科研 スクリーン印刷用メッシュ部材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010541208A (ja) * 2007-09-20 2010-12-24 フライズ・メタルズ・インコーポレイテッド 太陽電池表側のメタライズのための電気鋳造されたステンシル
JP2010251581A (ja) * 2009-04-17 2010-11-04 Denso Corp 印刷基板の製造方法
WO2011158913A1 (ja) * 2010-06-16 2011-12-22 株式会社コベルコ科研 スクリーン印刷用メッシュ部材
JP2012000845A (ja) * 2010-06-16 2012-01-05 Kobelco Kaken:Kk スクリーン印刷用メッシュ部材

Similar Documents

Publication Publication Date Title
US5478700A (en) Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
US5197655A (en) Fine pitch solder application
US6158650A (en) Process for fine and coarse pitch solder deposits on printed circuit boards
US5695109A (en) Solder paste inter-layer alignment apparatus for area-array on-board rework
CN111201840B (zh) 用于产生带有热敷镀通孔的电路板的方法以及电路板
JP2001130160A (ja) スクリーン印刷方法とその装置及びそれらに用いるスクリーンマスクと回路基板
US6838372B2 (en) Via interconnect forming process and electronic component product thereof
JPH0480991A (ja) プリント配線板の製造方法
US6047637A (en) Method of paste printing using stencil and masking layer
JP2002307653A (ja) 導電性インクの印刷方法
JP3896696B2 (ja) 電子部品の実装方法
TWI879837B (zh) 印刷基板的製造方法及印刷基板之填充劑印刷用之密封薄膜
CN101026108A (zh) 覆晶封装方法及其电路基板的预焊料的形成方法
JPH0732579A (ja) 半田ペースト印刷装置
JPH1140936A (ja) ソルダーバンプ形成法
JPH11321146A (ja) はんだ印刷用マスク及びその作製方法
JPH1134291A5 (enExample)
JPH0229396A (ja) 電子部品の実装方法及び装置
JPH0722557A (ja) Ｉｃリードフレーム及びその部分めっき方法
JP2000071422A (ja) スキージ及びスクリーン印刷装置並びにスクリーン印刷方法
JP2710187B2 (ja) セラミック多層配線基板のスルーホール形成方法
JPH09307223A (ja) リフローはんだ付け方法
JPH05283834A (ja) 印刷配線板及びその製造方法
JP2004209934A (ja) スクリーン印刷用メタルマスク及びその製造方法及び印刷方法
JP2006245190A (ja) 半田バンプの形成方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040723

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040723

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051220

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060217

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060322