JPH11307904A - 成形回路部品およびその製造方法 - Google Patents

成形回路部品およびその製造方法

Info

Publication number
JPH11307904A
JPH11307904A JP11205798A JP11205798A JPH11307904A JP H11307904 A JPH11307904 A JP H11307904A JP 11205798 A JP11205798 A JP 11205798A JP 11205798 A JP11205798 A JP 11205798A JP H11307904 A JPH11307904 A JP H11307904A
Authority
JP
Japan
Prior art keywords
molded
liquid crystal
crystal polymer
circuit component
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11205798A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11307904A5 (enExample
Inventor
Atsuo Yoshikawa
淳夫 吉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
Original Assignee
Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Priority to JP11205798A priority Critical patent/JPH11307904A/ja
Publication of JPH11307904A publication Critical patent/JPH11307904A/ja
Publication of JPH11307904A5 publication Critical patent/JPH11307904A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP11205798A 1998-04-22 1998-04-22 成形回路部品およびその製造方法 Pending JPH11307904A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11205798A JPH11307904A (ja) 1998-04-22 1998-04-22 成形回路部品およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11205798A JPH11307904A (ja) 1998-04-22 1998-04-22 成形回路部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPH11307904A true JPH11307904A (ja) 1999-11-05
JPH11307904A5 JPH11307904A5 (enExample) 2005-03-17

Family

ID=14576970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11205798A Pending JPH11307904A (ja) 1998-04-22 1998-04-22 成形回路部品およびその製造方法

Country Status (1)

Country Link
JP (1) JPH11307904A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081237A (ja) * 2005-09-15 2007-03-29 Japan Gore Tex Inc 回路基板、および薄膜太陽電池とその製造方法
CN100459191C (zh) * 2004-03-17 2009-02-04 日本奥亚特克斯股份有限公司 发光体用电路基板的制造方法、发光体用电路基板前体及发光体用电路基板以及发光体
JP2011176318A (ja) * 2004-11-12 2011-09-08 Harris Corp 多機能構造回路
EP2436243A1 (en) * 2009-05-27 2012-04-04 Raytheon Company Method and apparatus for building multilayer circuits
JP6100976B1 (ja) * 2015-06-24 2017-03-22 株式会社メイコー 立体配線基板、及び立体配線基板の製造方法
CN114555319A (zh) * 2019-10-18 2022-05-27 Ｎｉｓｓｈａ株式会社 成型品、电气产品以及成型品的制造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100459191C (zh) * 2004-03-17 2009-02-04 日本奥亚特克斯股份有限公司 发光体用电路基板的制造方法、发光体用电路基板前体及发光体用电路基板以及发光体
JP2011176318A (ja) * 2004-11-12 2011-09-08 Harris Corp 多機能構造回路
JP2007081237A (ja) * 2005-09-15 2007-03-29 Japan Gore Tex Inc 回路基板、および薄膜太陽電池とその製造方法
EP2436243A1 (en) * 2009-05-27 2012-04-04 Raytheon Company Method and apparatus for building multilayer circuits
JP6100976B1 (ja) * 2015-06-24 2017-03-22 株式会社メイコー 立体配線基板、及び立体配線基板の製造方法
CN114555319A (zh) * 2019-10-18 2022-05-27 Ｎｉｓｓｈａ株式会社 成型品、电气产品以及成型品的制造方法
CN114555319B (zh) * 2019-10-18 2024-03-15 Ｎｉｓｓｈａ株式会社 成型品、电气产品以及成型品的制造方法

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