JPH11288927A5 - - Google Patents

Info

Publication number
JPH11288927A5
JPH11288927A5 JP1998093235A JP9323598A JPH11288927A5 JP H11288927 A5 JPH11288927 A5 JP H11288927A5 JP 1998093235 A JP1998093235 A JP 1998093235A JP 9323598 A JP9323598 A JP 9323598A JP H11288927 A5 JPH11288927 A5 JP H11288927A5
Authority
JP
Japan
Prior art keywords
heaters
pipe
pair
manufacturing apparatus
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998093235A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11288927A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9323598A priority Critical patent/JPH11288927A/ja
Priority claimed from JP9323598A external-priority patent/JPH11288927A/ja
Publication of JPH11288927A publication Critical patent/JPH11288927A/ja
Publication of JPH11288927A5 publication Critical patent/JPH11288927A5/ja
Pending legal-status Critical Current

Links

JP9323598A 1998-04-06 1998-04-06 排気配管加熱用手段を備えた半導体製造装置 Pending JPH11288927A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9323598A JPH11288927A (ja) 1998-04-06 1998-04-06 排気配管加熱用手段を備えた半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9323598A JPH11288927A (ja) 1998-04-06 1998-04-06 排気配管加熱用手段を備えた半導体製造装置

Publications (2)

Publication Number Publication Date
JPH11288927A JPH11288927A (ja) 1999-10-19
JPH11288927A5 true JPH11288927A5 (https=) 2005-09-22

Family

ID=14076878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9323598A Pending JPH11288927A (ja) 1998-04-06 1998-04-06 排気配管加熱用手段を備えた半導体製造装置

Country Status (1)

Country Link
JP (1) JPH11288927A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176942A (ja) * 2008-01-24 2009-08-06 Hitachi Kokusai Electric Inc 基板処理装置
KR100904025B1 (ko) * 2008-11-24 2009-06-22 문제운 반도체 설비의 가스배출관 냉각용 자켓 및 그 제조방법
CN113430644B (zh) * 2021-06-22 2023-09-08 北京北方华创微电子装备有限公司 排气装置及半导体设备
CN117501417A (zh) * 2021-07-21 2024-02-02 株式会社国际电气 加热器组件、基板处理装置以及半导体装置的制造方法

Similar Documents

Publication Publication Date Title
CN101490491B (zh) 用以加热半导体处理腔室的设备和方法
JPH0652722B2 (ja) ヒータ組立体及び基板の加熱方法
CA2312790A1 (en) Growth of very uniform silicon carbide epitaxial layers
KR920700468A (ko) 기판상의 층 용착 방법 및 그 처리 시스템
TW200411960A (en) Variable heater element for low to high temperature ranges
TW350879B (en) Substrate processing apparatus
JPH11288927A5 (https=)
JPS5737848A (en) Heating apparatus for wafer
JP2579809Y2 (ja) 枚葉式ｃｖｄ装置
KR102109972B1 (ko) 반도체공정용 히터 재킷
JP2023167897A5 (https=)
KR100972679B1 (ko) 반도체 설비의 가스관 가스정제용 면상 발열체 및 그제조방법
JPH03185715A (ja) 半導体製造装置
TWI891393B (zh) 包覆材料結構
JPH11102872A (ja) 反応炉
JPH09152279A (ja) 熱処理炉
US11127607B2 (en) Heat processing system
JPS57167138A (en) Heat treatment device for film formed with pellicle
JPS5574838A (en) Manufacturing of composite sheet
RU94005242A (ru) Способ изготовления полупроводникового датчика газов
JPH0212910A (ja) 半導体素子の製造装置
KR20050114460A (ko) 기판 가열로 및 이를 포함하는 화학 기상 증착 장치
JPS551130A (en) Furnace core pipe for manufacturing semiconductor
KR20220104347A (ko) 정온 가열기능을 향상한 반도체설비의 밸브 가열장치
TWM591699U (zh) 半導體製程用之爐管裝置