JPS5737848A - Heating apparatus for wafer - Google Patents

Heating apparatus for wafer

Info

Publication number
JPS5737848A
JPS5737848A JP11371580A JP11371580A JPS5737848A JP S5737848 A JPS5737848 A JP S5737848A JP 11371580 A JP11371580 A JP 11371580A JP 11371580 A JP11371580 A JP 11371580A JP S5737848 A JPS5737848 A JP S5737848A
Authority
JP
Japan
Prior art keywords
wafer
heat
section
hps
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11371580A
Other languages
Japanese (ja)
Inventor
Keiichi Kawate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11371580A priority Critical patent/JPS5737848A/en
Publication of JPS5737848A publication Critical patent/JPS5737848A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To heat the wafer with radiant heat, and to improve the uniformity and reproducibility of a temperature by mounting a heat radiation section, heat radiation efficiency thereof is increased, onto a heat generating section through a heat-transfer section and supporting the wafer while forming a clearance between the wafer and the surface of the heat radiation section by a spacer. CONSTITUTION:The heat-transfer section HT is shaped on the heat generating section HS into which heater blocks HB are buried, and the wafer mounting section HP, which is coated with carbon, etc. and the heat radiation of the surface section HPS thereof is improved, is formed on the heat-transfer section HT. The cylindrical spacers S consisting of a material having low thermal conductivity such as a nichrome wire are fitted onto the HPS in order to form the clearance between the wafer and the HPS, and arranged so as to support the wafer W by several minute contact areas. Accordingly, the wafer can be heated without extremely damaging thermal efficiency, and the generation of the unevenness of the temperature due to the deformation and repeated use of the wafer can be prevented.
JP11371580A 1980-08-19 1980-08-19 Heating apparatus for wafer Pending JPS5737848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11371580A JPS5737848A (en) 1980-08-19 1980-08-19 Heating apparatus for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11371580A JPS5737848A (en) 1980-08-19 1980-08-19 Heating apparatus for wafer

Publications (1)

Publication Number Publication Date
JPS5737848A true JPS5737848A (en) 1982-03-02

Family

ID=14619307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11371580A Pending JPS5737848A (en) 1980-08-19 1980-08-19 Heating apparatus for wafer

Country Status (1)

Country Link
JP (1) JPS5737848A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6044018U (en) * 1983-09-05 1985-03-28 オリンパス光学工業株式会社 Fixed structure of the stage of an inverted microscope
JPS61165719A (en) * 1985-12-26 1986-07-26 Olympus Optical Co Ltd Inverted microscope
JPS61165720A (en) * 1985-12-26 1986-07-26 Olympus Optical Co Ltd Inverted microscope
JPS62201932U (en) * 1986-06-14 1987-12-23
JPS6379636U (en) * 1986-11-13 1988-05-26
US4919614A (en) * 1987-05-30 1990-04-24 Dainippon Screen Mfg. Co., Ltd. Apparatus for heat treatment of a substrate
JPH0436231U (en) * 1990-07-20 1992-03-26
US5241157A (en) * 1990-04-27 1993-08-31 Georg Fischer Ag Arrangement for butt-welding plastic material components
JPH0677239U (en) * 1994-05-10 1994-10-28 大日本スクリーン製造株式会社 Substrate heat treatment equipment
US6771416B2 (en) 2000-09-20 2004-08-03 Olympus Optical Co., Ltd. Inverted microscope
US6813071B2 (en) 2001-03-23 2004-11-02 Olympus Optical Co., Ltd. Inverted microscope
DE10209844B4 (en) * 2001-03-09 2010-04-08 Olympus Corporation Inverse microscope system

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0355934Y2 (en) * 1983-09-05 1991-12-13
JPS6044018U (en) * 1983-09-05 1985-03-28 オリンパス光学工業株式会社 Fixed structure of the stage of an inverted microscope
JPS61165719A (en) * 1985-12-26 1986-07-26 Olympus Optical Co Ltd Inverted microscope
JPS61165720A (en) * 1985-12-26 1986-07-26 Olympus Optical Co Ltd Inverted microscope
JPH055330B2 (en) * 1985-12-26 1993-01-22 Olympus Optical Co
JPS62201932U (en) * 1986-06-14 1987-12-23
JPH0521875Y2 (en) * 1986-06-14 1993-06-04
JPS6379636U (en) * 1986-11-13 1988-05-26
US4919614A (en) * 1987-05-30 1990-04-24 Dainippon Screen Mfg. Co., Ltd. Apparatus for heat treatment of a substrate
US5241157A (en) * 1990-04-27 1993-08-31 Georg Fischer Ag Arrangement for butt-welding plastic material components
JPH0436231U (en) * 1990-07-20 1992-03-26
JPH0677239U (en) * 1994-05-10 1994-10-28 大日本スクリーン製造株式会社 Substrate heat treatment equipment
US6771416B2 (en) 2000-09-20 2004-08-03 Olympus Optical Co., Ltd. Inverted microscope
DE10209844B4 (en) * 2001-03-09 2010-04-08 Olympus Corporation Inverse microscope system
US6813071B2 (en) 2001-03-23 2004-11-02 Olympus Optical Co., Ltd. Inverted microscope

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