JPH11256255A - High strength and high conductivity copper alloy excellent in shearing workability - Google Patents
High strength and high conductivity copper alloy excellent in shearing workabilityInfo
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- JPH11256255A JPH11256255A JP7360698A JP7360698A JPH11256255A JP H11256255 A JPH11256255 A JP H11256255A JP 7360698 A JP7360698 A JP 7360698A JP 7360698 A JP7360698 A JP 7360698A JP H11256255 A JPH11256255 A JP H11256255A
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- copper alloy
- content
- strength
- shearing
- workability
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、リードフレー
ム、端子、コネクタ、ばねなど電気、電子部品に用いら
れる高強度、高導電性銅合金に関し、特に、打抜き加工
等の剪断加工性に優れた、具体的には「ばり」、「だ
れ」及び残留応力が少なく、打抜き金型の摩耗が少な
い、高強度、高導電性銅合金に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-strength, high-conductivity copper alloy used for electric and electronic parts such as lead frames, terminals, connectors, and springs. More specifically, the present invention relates to a high-strength, highly-conductive copper alloy having a small amount of "burr", "burr" and residual stress, and having little wear of a punching die.
【０００２】[0002]
【従来の技術】従来、上記の各種電気、電子部品には、
一般に強度、伸び、ばね性、導電性、耐熱性、Ａｇめっ
き性及びはんだの耐熱剥離性などの特徴を具備すること
が要求されていることから、これらの特性をもった、例
えばＣ１５１００（Ｃｕ−０．１ｗｔ％Ｚｒ）やＣ１８
９９０（Ｃｕ−２ｗｔ％Ｓｎ−０．１５ｗｔ％Ｃｒ）を
はじめ、その他多くの銅合金がその製造に用いられてい
る。2. Description of the Related Art Conventionally, the above various electric and electronic parts include:
Generally, it is required to have characteristics such as strength, elongation, spring property, conductivity, heat resistance, Ag plating property, and heat-peeling resistance of solder. Therefore, for example, C15100 (Cu- 0.1 wt% Zr) or C18
Many other copper alloys, including 990 (Cu-2 wt% Sn-0.15 wt% Cr), have been used in their manufacture.
【０００３】最近の各種電気電子機器の軽薄短小化及び
実装密度の向上要求に対して、使用部品の小形化、リー
ド間距離の縮小などが加速している。そして、例えばＩ
Ｃの組立作業において、樹脂モールド後にリード間には
み出した樹脂を除去するが、リードの「ばり」、「だ
れ」が大きくなるとはみ出す樹脂の量が多くなり、除去
作業に手間がかかるようになる。従って、寸法精度の要
求だけでなく打抜いた断面形状が矩形に近い、つまり
「ばり」及び「だれ」の小さいことが望まれている。ま
た、打抜き後の平坦性確保のために残留応力が小さく、
さらに打抜き加工の生産性向上のため、打抜き加工に用
いられる金型の摩耗が小さく金型寿命が長いことも求め
られている。しかし、上記の従来の銅合金を打抜き加工
して各種電気電子部品を製造した場合、「ばり」及び
「だれ」の量が大きく、残留応力も比較的大きいため要
求を満足することが難しくなっている。また、金型寿命
についても、打抜き金型の摩耗が比較的大きく、従って
使用寿命が短くなる。[0003] In response to recent demands for reductions in the size, weight, and size of various electric and electronic devices and improvements in packaging density, the use of smaller parts and a shorter distance between leads have been accelerated. And, for example, I
In the assembling operation C, the resin that has protruded between the leads after the resin molding is removed. However, when the “burrs” and “blunts” of the leads increase, the amount of the protruding resin increases, and the removal operation becomes troublesome. Therefore, it is desired that not only the dimensional accuracy is required but also the punched cross-sectional shape is close to a rectangle, that is, the “burrs” and the “shapes” are small. In addition, residual stress is small to ensure flatness after punching,
Furthermore, in order to improve the productivity of the punching process, it is also required that the die used for the punching process has a small wear and a long mold life. However, when various electric and electronic parts are manufactured by punching the above-described conventional copper alloy, it is difficult to satisfy the requirements because the amount of “burrs” and “blunts” is large and the residual stress is relatively large. I have. In addition, the die life is relatively large for the punching die, so that the service life is shortened.
【０００４】また最近では、特開平１−１３９７３６号
公報では、Ｃｕ母相中にＦｅ−Ｐ及びＦｅ−Ｎｉ化合物
を分散析出させることにより高強度及び高導電性を得る
とともに、Ｓｉ−Ｎｉ化合物により伸びの改善を行った
銅合金が提案されている。また、特開平９−１０４９５
６号公報では、Ｆｅ−Ｎｉ−Ｐ系化合物をＣｕマトリッ
クス中に均一微細に析出することによって硬度、引張強
さ、導電性、曲げ加工性、めっき密着性を向上させた銅
合金が提案されている。これらで提案された合金は、強
度、伸び、導電性、曲げ加工性、めっき密着性といった
特性を良好とするためにＦｅ−Ｐ、Ｆｅ−Ｎｉ、Ｓｉ−
Ｎｉ、Ｆｅ−Ｎｉ−Ｐといった化合物の析出を利用し、
これらの析出物を均一微細に析出することで目的とする
特性を得ている。しかしながら、化合物を均一微細に析
出することだけでは、打ち抜き加工時の「ばり」及び
「だれ」が小さく、打抜き後の平坦性確保のために残留
応力を小さくするには不十分である。In recent years, Japanese Patent Application Laid-Open No. 1-139736 discloses that Fe-P and Fe-Ni compounds are dispersed and precipitated in a Cu matrix to obtain high strength and high conductivity. Copper alloys with improved elongation have been proposed. Also, JP-A-9-10495
No. 6 proposes a copper alloy in which hardness, tensile strength, conductivity, bending workability, and plating adhesion are improved by uniformly and finely depositing a Fe—Ni—P-based compound in a Cu matrix. I have. These proposed alloys are made of Fe-P, Fe-Ni, Si- to improve properties such as strength, elongation, conductivity, bending workability and plating adhesion.
Utilizing the precipitation of compounds such as Ni and Fe-Ni-P,
The desired properties are obtained by depositing these precipitates uniformly and finely. However, simply depositing the compound uniformly and finely results in small "burrs" and "sags" at the time of punching, and is insufficient to reduce residual stress for securing flatness after punching.
【０００５】[0005]
【発明が解決しようとする課題】本発明はリードフレー
ム、端子、コネクタなど電気・電子部品用銅合金として
要求される強度、導電性、はんだ付け性、めっき性など
の特性を通常の銅合金以上に維持しながら、その剪断加
工性を向上させる、具体的には打抜き加工によって発生
する「ばり」、「だれ」及び残留応力を小さくし、打抜
き金型の摩耗を抑制し金型寿命を伸ばすことを目的とす
る。SUMMARY OF THE INVENTION The present invention provides a copper alloy for electrical and electronic parts such as lead frames, terminals, connectors, etc., which has properties such as strength, conductivity, solderability and plating properties which are higher than those of ordinary copper alloys. To improve the shearing processability, while reducing the "burrs", "burrs" and residual stresses generated by the punching process, to suppress the wear of the punching die and prolong the life of the die. With the goal.
【０００６】[0006]
【課題を解決するための手段】本発明に係る剪断加工性
に優れる高強度、高導電性銅合金は、Ｆｅ又はＣｏのう
ち１種又はその両方を合計で０．０５〜１．０ｗｔ％、
Ｐ：０．０１〜０．４ｗｔ％、Ｎｉ：０．００５〜０．
５ｗｔ％を含有し、Ｓｉ：０．０１ｗｔ％未満、Ｏ：１
００ｐｐｍ以下、Ｈ：１０ｐｐｍ以下であり、残部が実
質的にＣｕと不可避不純物であることを特徴とする。こ
の銅合金は、さらにＺｎ：０．０５〜５．０ｗｔ％、
Ｍｇ、Ｓｎの１種又はその両方を合計で０．０１〜
１．０ｗｔ％、のいずれか又は両方を含有することがで
きる。また、上記の銅合金において、Ｍｎ、Ｃａ、Ｚ
ｒ、Ａｇ、Ｃｒ、Ｃｄ、Ｂｅ、Ｔｉ、Ａｕ、Ｐｔ、Ｈ
ｆ、Ｔｈ、Ｌｉ、Ｎａ、Ｋ、Ｓｒ、Ｐｄ、Ｗ、Ｓ、Ｃ、
Ｎｂ、Ａｌ、Ｖ、Ｙ、Ｍｏ、Ｐｂ、Ｉｎ、Ｇａ、Ｇｅ、
Ａｓ、Ｓｂ、Ｂｉ、Ｔｅ、Ｂ、Ｓｅ、ミッシュメタルが
合計で０．０１ｗｔ％以下であるのが望ましい。The high-strength, high-conductivity copper alloy according to the present invention, which is excellent in shearability, comprises one or both of Fe and Co in a total amount of 0.05 to 1.0 wt%.
P: 0.01 to 0.4 wt%, Ni: 0.005 to 0.
5 wt%, Si: less than 0.01 wt%, O: 1
H is 10 ppm or less and H is 10 ppm or less, and the balance is substantially Cu and inevitable impurities. This copper alloy further contains Zn: 0.05 to 5.0 wt%,
One or both of Mg and Sn are used in a total amount of 0.01 to
1.0 wt%, or both. In the above copper alloy, Mn, Ca, Z
r, Ag, Cr, Cd, Be, Ti, Au, Pt, H
f, Th, Li, Na, K, Sr, Pd, W, S, C,
Nb, Al, V, Y, Mo, Pb, In, Ga, Ge,
It is desirable that the total content of As, Sb, Bi, Te, B, Se, and misch metal is 0.01% by weight or less.
【０００７】[0007]
【発明の実施の形態】本発明に係る銅合金において、成
分を上記の通りに限定した理由を以下に説明する。 （Ｆｅ、Ｃｏ量）Ｆｅ及びＣｏには、Ｐとの化合物を形
成し合金中に析出することで、合金の強度及び耐熱性を
確保する作用がある。しかし、その含有量が０．０５ｗ
ｔ％未満であると所望の強度及び耐熱性が得られず、一
方１．０ｗｔ％を越える割合で含有させると熱間圧延時
の加工性が低下するとともに、製品の曲げ加工性及び導
電率の低下が著しくなり、好ましくない。従って、Ｆｅ
又はＣｏのうち１種又はその両方の合計の含有量は０．
０５〜１．０ｗｔ％とする。BEST MODE FOR CARRYING OUT THE INVENTION The reasons for limiting the components in the copper alloy according to the present invention as described above will be described below. (Amounts of Fe and Co) Fe and Co have an effect of securing the strength and heat resistance of the alloy by forming a compound with P and precipitating in the alloy. However, its content is 0.05w
If the content is less than t%, desired strength and heat resistance cannot be obtained. On the other hand, if the content exceeds 1.0% by weight, the workability during hot rolling is reduced, and the bending workability and electrical conductivity of the product are reduced. The decrease is remarkable, which is not preferable. Therefore, Fe
Alternatively, the total content of one or both of Co and CO is 0.1%.
It is set to be from 0.5 to 1.0 wt%.
【０００８】（Ｐ量）Ｐは、Ｆｅ及びＣｏとの化合物を
生成し合金中に析出して強度及び耐熱性を向上させる。
また、後述するＮｉとの化合物も生成し合金中に析出し
て剪断加工性を向上させる。Ｐの含有量が０．０１ｗｔ
％未満の場合は、化合物の析出が不十分であるため、所
望の強度、耐熱性及び剪断加工性が得られない。一方、
Ｐの含有率が０．４ｗｔ％を越える場合には、熱間加工
時の加工性が低下するとともに導電率の低下が生じるた
め、好ましくない。従って、Ｐの含有量は０．０１〜
０．４ｗｔ％とする。特に０．０５％を越えて添加され
るのが剪断加工性を向上させる意味でさらに好ましい。(P content) P forms a compound with Fe and Co and precipitates in the alloy to improve the strength and heat resistance.
In addition, a compound with Ni, which will be described later, is formed and precipitates in the alloy to improve the shearability. P content is 0.01wt
%, The desired strength, heat resistance and shearing property cannot be obtained because of insufficient compound precipitation. on the other hand,
If the content of P exceeds 0.4 wt%, the workability during hot working is lowered and the conductivity is lowered, which is not preferable. Therefore, the content of P is 0.01 to
0.4 wt%. In particular, it is more preferable to add more than 0.05% from the viewpoint of improving the shearability.
【０００９】（Ｎｉ量）Ｎｉは、Ｐとの粗大な化合物を
生成し合金中に析出して剪断加工性を向上させる。この
粗大化合物が合金中に分散されていると、母材との金属
学的な連続性がないため、剪断加工時に応力を集中的に
受けてミクロクラックの発生源となり、剪断加工性を著
しく向上させる。Ｎｉの含有量が０．００５ｗｔ％未満
の場合は、Ｎｉ−Ｐ化合物が微細に析出するようにな
り、所望の剪断加工性が得られない。ただし、ここでの
微細な析出とは、Ｆｅ−Ｐ及びＣｏ−Ｐ化合物よりも小
さなサイズで析出した場合をいう。一方、Ｎｉの含有量
が０．５ｗｔ％を越える場合には、Ｎｉ−Ｐの粗大化合
物が多くなり、ＰがＮｉ−Ｐの化合物形成にとられてし
まい、結果、Ｆｅ−Ｐ及びＣｏ−Ｐの化合物の析出を阻
害し所望の強度及び耐熱性を得られないばかりでなく、
析出できなかったＦｅ及びＣｏにより導電率の低下が生
じるため、好ましくない。従って、Ｎｉの含有量は０．
００５〜０．５ｗｔ％とする。(Ni content) Ni forms a coarse compound with P and precipitates in the alloy to improve the shearing property. If this coarse compound is dispersed in the alloy, there is no metallurgical continuity with the base material, so stress will be concentrated during shearing and it will be a source of microcracks, significantly improving shearing workability. Let it. If the content of Ni is less than 0.005 wt%, the Ni-P compound will precipitate finely, and the desired shear workability cannot be obtained. Here, the term “fine precipitation” refers to a case where the precipitate is smaller in size than the Fe—P and Co—P compounds. On the other hand, when the content of Ni exceeds 0.5 wt%, the amount of Ni-P coarse compounds increases, and P is taken for the formation of Ni-P compounds. As a result, Fe-P and Co-P In addition to not only preventing the precipitation of the compound of the desired strength and heat resistance,
Fe and Co that could not be deposited are not preferred because the conductivity is reduced. Therefore, the content of Ni is 0.1.
005 to 0.5 wt%.
【００１０】（Ｓｉ量）Ｓｉは、Ｎｉとの化合物を生成
し合金中に析出する。しかしながら、Ｓｉの含有量が
０．０１ｗｔ％を越えた場合、ＮｉはＳｉとの化合物を
形成するのに使用され、Ｎｉ−Ｐの粗大な化合物の形成
を阻害してしまう。結果、Ｎｉ−Ｐの粗大化合物によっ
て得られるはずの剪断加工性を阻害する。また、導電率
の低下も激しいため好ましくない。従って、Ｓｉの含有
量は０．０１ｗｔ％未満とする。(Si content) Si forms a compound with Ni and precipitates in the alloy. However, when the content of Si exceeds 0.01 wt%, Ni is used to form a compound with Si, and inhibits formation of a coarse compound of Ni-P. As a result, the shearing property that would be obtained by the coarse compound of Ni-P is impaired. In addition, the electric conductivity is drastically reduced, which is not preferable. Therefore, the content of Si is set to less than 0.01 wt%.
【００１１】（Ｏ量）Ｏは、Ｐと反応しやすい。Ｏが１
００ｐｐｍを越えた場合、反応したＰは上述したＮｉと
の粗大化合物を形成できなくなる。結果、剪断加工性向
上の効果が得られない。従って、Ｏの含有量は１００ｐ
ｐｍ以下とする。 （Ｈ量）Ｈは、Ｏが１０ｐｐｍ以上含有されている場
合、Ｈ量が１０ｐｐｍを越えてくると、鋳造時の冷却過
程でＯと結びついて水蒸気となり、この水蒸気が鋳塊中
にブローホール欠陥を生じてしまう。従って、Ｈの含有
量は１０ｐｐｍ以下、好ましくは４ｐｐｍ以下、さらに
好ましくは２ｐｐｍ以下とする。なお、Ｏ量、Ｈ量の低
減は、原材料の十分な乾燥、溶解鋳造工程における雰囲
気制御等により可能である。(O content) O easily reacts with P. O is 1
If it exceeds 00 ppm, the reacted P cannot form the above-mentioned coarse compound with Ni. As a result, the effect of improving the shearability cannot be obtained. Therefore, the content of O is 100 p
pm or less. (H amount) When H is contained in an amount of 10 ppm or more, when the H amount exceeds 10 ppm, H is combined with O in a cooling process during casting to form water vapor, and this water vapor causes blowhole defects in the ingot. Will occur. Therefore, the content of H is 10 ppm or less, preferably 4 ppm or less, and more preferably 2 ppm or less. The amount of O and the amount of H can be reduced by sufficiently drying the raw materials and controlling the atmosphere in the melting and casting process.
【００１２】（Ｚｎ量）Ｚｎは銅合金のはんだ及びＳｎ
めっきの耐熱剥離性を改善する。しかし、含有量が０．
０５ｗｔ％未満の場合、所望の効果が得られない。一
方、その含有量が５．０ｗｔ％を越えるとはんだ濡れ性
が低下する。また、導電率の低下も激しくなる。従っ
て、Ｚｎの含有量は０．０５〜５．０ｗｔ％とする。 （Ｍｇ、Ｓｎ量）Ｍｇ、Ｓｎは銅合金の強度向上に寄与
する。しかし、Ｍｇ、Ｓｎの１種又はその両方の合計で
０．０１ｗｔ％未満の場合、所望の効果が得られない。
一方、その含有量が合計で１．０ｗｔ％を越えてくると
導電率の低下が激しくなる。従って、これらの元素の含
有量は総量で０．０１〜１．０ｗｔ％とする。(Zn content) Zn is a copper alloy solder and Sn
Improves heat-resistant peeling of plating. However, when the content is 0.
If it is less than 05 wt%, the desired effect cannot be obtained. On the other hand, if the content exceeds 5.0% by weight, the solder wettability decreases. In addition, the decrease in conductivity also becomes severe. Therefore, the content of Zn is set to 0.05 to 5.0 wt%. (Amount of Mg and Sn) Mg and Sn contribute to the improvement of the strength of the copper alloy. However, if the total amount of one or both of Mg and Sn is less than 0.01 wt%, the desired effect cannot be obtained.
On the other hand, if the total content exceeds 1.0 wt%, the decrease in conductivity becomes severe. Therefore, the content of these elements is set to 0.01 to 1.0 wt% in total.
【００１３】（Ｍｎ等の不純物）Ｍｎ、Ｃａ、Ｚｒ、Ａ
ｇ、Ｃｒ、Ｃｄ、Ｂｅ、Ｔｉ、Ａｕ、Ｐｔ、Ｈｆ、Ｔ
ｈ、Ｌｉ、Ｎａ、Ｋ、Ｓｒ、Ｐｄ、Ｗ、Ｓ、Ｃ、Ｎｂ、
Ａｌ、Ｖ、Ｙ、Ｍｏ、Ｐｂ、Ｉｎ、Ｇａ、Ｇｅ、Ａｓ、
Ｓｂ、Ｂｉ、Ｔｅ、Ｂ、Ｓｅ、ミッシュメタルの含有量
が合計で０．０１ｗｔ％を越えた場合、上述したＮｉ−
Ｐの粗大化合物の形成を阻害し、ひいては剪断加工性の
向上効果を妨げる。従って、これらの元素の含有量は合
計で０．０１ｗｔ％以下に規制される。(Impurities such as Mn) Mn, Ca, Zr, A
g, Cr, Cd, Be, Ti, Au, Pt, Hf, T
h, Li, Na, K, Sr, Pd, W, S, C, Nb,
Al, V, Y, Mo, Pb, In, Ga, Ge, As,
When the total content of Sb, Bi, Te, B, Se, and misch metal exceeds 0.01 wt%, the Ni-
It inhibits the formation of coarse compounds of P, and thus hinders the effect of improving the shearability. Therefore, the content of these elements is restricted to 0.01 wt% or less in total.
【００１４】[0014]
【実施例】本発明に係る高強度、高導電性銅合金の実施
例について、その比較例及び従来例とともに説明する。
表１及び表２に示す含有成分及び含有割合の銅合金をク
リプトル炉にて木炭被覆下で大気溶解し、ブックモール
ドに鋳造し５０ｍｍ×８０ｍｍ×２００ｍｍの鋳塊を作
製した。この鋳塊を約８５０℃にて熱間圧延し、直ちに
水中急冷し、厚さ１５ｍｍの熱延材を作製した。この熱
延材の表面の酸化スケールを除去するため、軽く表面切
削した後、冷間圧延−熱処理−冷間圧延を行い厚さ０．
２５ｍｍ、幅２０ｍｍの条を作製した。EXAMPLES Examples of the high-strength, high-conductivity copper alloy according to the present invention will be described together with comparative examples and conventional examples.
Copper alloys having the components and content ratios shown in Tables 1 and 2 were melted in the air under a charcoal coating in a kryptor furnace, and cast into a book mold to produce a 50 mm × 80 mm × 200 mm ingot. The ingot was hot-rolled at about 850 ° C. and immediately quenched in water to produce a hot-rolled material having a thickness of 15 mm. In order to remove the oxide scale on the surface of the hot-rolled material, the surface is lightly cut, and then cold-rolled, heat-treated and cold-rolled to a thickness of 0.1 mm.
A strip having a width of 25 mm and a width of 20 mm was prepared.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【表２】 [Table 2]
【００１７】得られた条について強度、導電率、耐熱温
度、はんだ耐熱剥離性、剪断加工性について下記要領に
て測定した。結果は表３に示す通りである。強度は、条
からＪＩＳ５号試験片を加工して引張強さを測定し、導
電率は、ＪＩＳＨ０５０５に規定されている方法に基づ
きダブルブリッジを用いて測定した。はんだ耐熱剥離性
は、６Ｓｎ／４Ｐｂはんだを２４５±５℃×５秒にては
んだ付けした後、１５０℃のオーブンで１０００Ｈｒま
で加熱した。この試験片を１８０゜曲げ戻しにて加工を
加え加工部のはんだが剥離するか観察した。耐熱温度
は、５分間加熱してＨｖの低下量が加熱前のＨｖで１０
％の時の温度のことであり、剪断加工性は、プレスによ
り長さ２０ｍｍ、幅０．３ｍｍのリードの「ばり」及び
「だれ」量を測定して表した。The obtained strip was measured for strength, electrical conductivity, heat resistance temperature, solder heat resistance peeling property and shearing workability in the following manner. The results are as shown in Table 3. The strength was measured by processing a JIS No. 5 test piece from the strip and measuring the tensile strength, and the conductivity was measured using a double bridge based on the method specified in JIS H0505. Solder heat peelability was determined by soldering 6Sn / 4Pb solder at 245 ± 5 ° C. × 5 seconds, and then heating to 1000 hr in a 150 ° C. oven. This test piece was processed by bending it back by 180 °, and it was observed whether the solder in the processed portion was peeled off. Heat resistant temperature is 5 minutes after heating, Hv reduction is 10% Hv before heating.
%, And the shearing workability was expressed by measuring the amount of "burr" and "sag" of a lead having a length of 20 mm and a width of 0.3 mm by a press.
【００１８】[0018]
【表３】 [Table 3]
【００１９】表３より、本発明合金Ｎｏ．１〜１０は、
強度、導電率、耐熱温度など電気電子部品が要求する特
性を具備した上で、剪断加工性が共に優れており、比較
例Ｎｏ．１１〜２４は材料調整ができていないか、いず
れかの性能が低いことがわかる。なお、Ｎｏ．１３はＰ
含有量が少なく、Ｎｏ．１５はＮｉ含有量が少なく、Ｎ
ｏ．１７はＳｉ含有量が多く、Ｎｏ．２１はＣｒ等の含
有量が多く、Ｎｏ．２２はＯ含有量が多いため、剪断加
工性が劣っている。From Table 3, it can be seen that the alloy No. 1 to 10
In addition to the properties required for electric and electronic components such as strength, electrical conductivity, and heat resistance, they also have excellent shearing workability. 11 to 24 indicate that the material adjustment was not performed or that any of the performances was low. In addition, No. 13 is P
The content is low. No. 15 has a low Ni content and N
o. No. 17 has a large Si content. No. 21 has a large content of Cr and the like. 22 has a large O content, and thus has poor shearing workability.
【００２０】[0020]
【発明の効果】本発明の銅合金は電気電子部品用銅合金
として要求される特性を具備した上で、例えば半導体装
置のリード材や、端子及びコネクタなどの各種の電気電
子部品を剪断加工（打抜き加工など）により製造する
と、「ばり」、「だれ」並びに残留応力が小さいためそ
の寸法精度が良い。さらに、打抜き金型の摩耗を抑制
し、打抜き金型の使用寿命を長くする。従って、各種電
気電子機器の微細化による寸法精度に対する厳しい要求
に対応が可能となる。また、打抜き金型の使用寿命が長
くなるので、スタンピングの生産性も向上する。The copper alloy of the present invention has the characteristics required for a copper alloy for electric and electronic parts, and then, for example, shears various electric and electronic parts such as lead materials of semiconductor devices, terminals and connectors. When manufactured by stamping, etc., the dimensional accuracy is good due to the small "burrs", "blunts" and residual stress. Further, wear of the punching die is suppressed, and the service life of the punching die is extended. Therefore, it is possible to meet strict requirements for dimensional accuracy due to miniaturization of various electric and electronic devices. Further, since the service life of the punching die is prolonged, the productivity of stamping is also improved.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１１年７月５日[Submission date] July 5, 1999
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１５[Correction target item name] 0015
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１５】[0015]
【表１】 [Table 1]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１６[Correction target item name] 0016
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１６】[0016]
【表２】 [Table 2]
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１７[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１７】得られた条について強度、導電率、耐熱温
度、はんだ耐熱剥離性、剪断加工性について下記要領に
て測定した。結果は表３に示す通りである。強度は、条
からＪＩＳ５号試験片を加工して引張強さを測定し、導
電率は、ＪＩＳＨ０５０５に規定されている方法に基づ
きダブルブリッジを用いて測定した。はんだ耐熱剥離性
は、６Ｓｎ／４Ｐｂはんだを２４５±５℃×５秒にては
んだ付けした後、１５０℃のオーブンで１０００Ｈｒま
で加熱した。この試験片を１８０゜曲げ戻しにて加工を
加え加工部のはんだが剥離するか観察した。耐熱温度
は、５分間加熱してＨｖの低下量が加熱前のＨｖで１０
％の時の温度のことであり、剪断加工性は、プレスによ
り長さ２０ｍｍ、幅０．３ｍｍのリードを打ち抜き、打
ち抜いたリードの「ばり」及び「だれ」量を測定して表
した。The obtained strip was measured for strength, electrical conductivity, heat resistance temperature, solder heat resistance peeling property and shearing workability in the following manner. The results are as shown in Table 3. The strength was measured by processing a JIS No. 5 test piece from the strip and measuring the tensile strength, and the conductivity was measured using a double bridge based on the method specified in JIS H0505. Solder heat peelability was determined by soldering 6Sn / 4Pb solder at 245 ± 5 ° C. × 5 seconds, and then heating to 1000 hr in a 150 ° C. oven. This test piece was processed by bending it back by 180 °, and it was observed whether the solder in the processed portion was peeled off. Heat resistant temperature is 5 minutes after heating, Hv reduction is 10% Hv before heating.
%, And the shearing workability is as follows: A lead having a length of 20 mm and a width of 0.3 mm is punched out by a press.
The “burrs” and “drows” of the extracted leads were measured and expressed.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１８[Correction target item name] 0018
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１８】[0018]
【表３】 [Table 3]
【手続補正５】[Procedure amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１９[Correction target item name] 0019
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１９】表３より、本発明合金Ｎｏ．１〜９は、強
度、導電率、耐熱温度など電気電子部品が要求する特性
を具備した上で、剪断加工性が共に優れており、比較例
Ｎｏ．１０〜２１は材料調整ができていないか、いずれ
かの性能が低いことがわかる。なお、Ｎｏ．１２はＰ含
有量が少なく、Ｎｏ．１３はＮｉ含有量が少なく、Ｎ
ｏ．１５はＳｉ含有量が多く、Ｎｏ．１９はＣｒ等の含
有量が多く、Ｎｏ．２０はＯ含有量が多いため、剪断加
工性が劣っている。From Table 3, it can be seen that the alloy No. Comparative Examples Nos. 1 to 9 have excellent properties such as strength, electrical conductivity, and heat resistance, which are required for electric and electronic parts, and also have excellent shearing workability. 10 to 21 indicate that the material adjustment was not performed or that any of the performances was low. In addition, No. No. 12 has a low P content, No. 13 has a low Ni content and N
o. No. 15 has a large Si content. No. 19 has a large content of Cr and the like. No. 20 has a large O content, and thus has poor shear workability.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ２２Ｆ 1/08 Ｃ２２Ｆ 1/08 Ｂ Ｈ０１Ｂ 1/02 Ｈ０１Ｂ 1/02 Ａ Ｈ０１Ｌ 23/48 Ｈ０１Ｌ 23/48 Ｖ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI C22F 1/08 C22F 1/08 B H01B 1/02 H01B 1/02 A H01L 23/48 H01L 23/48 V
Claims (4)
合計で０．０５〜１．０ｗｔ％、Ｐ：０．０１〜０．４
ｗｔ％、Ｎｉ：０．００５〜０．５ｗｔ％を含有し、Ｓ
ｉ：０．０１ｗｔ％未満、Ｏ：１００ｐｐｍ以下、Ｈ：
１０ｐｐｍ以下であり、残部が実質的にＣｕと不可避不
純物であることを特徴とする剪断加工性に優れる高強
度、高導電性銅合金。1. A total of 0.05 or 1.0 wt% of one or both of Fe and Co, and P: 0.01 to 0.4.
wt%, Ni: 0.005 to 0.5 wt%,
i: less than 0.01 wt%, O: 100 ppm or less, H:
A high-strength, high-conductivity copper alloy excellent in shearability, characterized in that the content is 10 ppm or less and the balance is substantially Cu and inevitable impurities.
有することを特徴とする請求項１に記載された剪断加工
性に優れる高強度、高導電性銅合金。2. The high-strength, highly-conductive copper alloy according to claim 1, further comprising 0.05 to 5.0 wt% of Zn.
合計で０．０１〜１．０ｗｔ％含有することを特徴とす
る請求項１又は２に記載された剪断加工性に優れる高強
度、高導電性銅合金。3. The high strength excellent in shearing processability according to claim 1 or 2, further comprising a total of 0.01 to 1.0 wt% of one or both of Mg and Sn. Highly conductive copper alloy.
Ｂｅ、Ｔｉ、Ａｕ、Ｐｔ、Ｈｆ、Ｔｈ、Ｌｉ、Ｎａ、
Ｋ、Ｓｒ、Ｐｄ、Ｗ、Ｓ、Ｃ、Ｎｂ、Ａｌ、Ｖ、Ｙ、Ｍ
ｏ、Ｐｂ、Ｉｎ、Ｇａ、Ｇｅ、Ａｓ、Ｓｂ、Ｂｉ、Ｔ
ｅ、Ｂ、Ｓｅ、ミッシュメタルが合計で０．０１ｗｔ％
以下であることを特徴とする請求項１〜３のいずれかに
記載された剪断加工性に優れる高強度、高導電性銅合
金。4. Mn, Ca, Zr, Ag, Cr, Cd,
Be, Ti, Au, Pt, Hf, Th, Li, Na,
K, Sr, Pd, W, S, C, Nb, Al, V, Y, M
o, Pb, In, Ga, Ge, As, Sb, Bi, T
e, B, Se, misch metal total 0.01wt%
The high-strength, high-conductivity copper alloy excellent in shearing workability according to any one of claims 1 to 3, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07360698A JP3957391B2 (en) | 1998-03-06 | 1998-03-06 | High strength, high conductivity copper alloy with excellent shear processability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07360698A JP3957391B2 (en) | 1998-03-06 | 1998-03-06 | High strength, high conductivity copper alloy with excellent shear processability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11256255A true JPH11256255A (en) | 1999-09-21 |
| JP3957391B2 JP3957391B2 (en) | 2007-08-15 |
Family
ID=13523173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07360698A Expired - Lifetime JP3957391B2 (en) | 1998-03-06 | 1998-03-06 | High strength, high conductivity copper alloy with excellent shear processability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3957391B2 (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2809419A1 (en) * | 2000-05-25 | 2001-11-30 | Kobe Steel Ltd | COPPER ALLOY FOR USE IN ELECTRICAL AND ELECTRONIC PARTS |
| WO2004087975A1 (en) * | 2003-04-03 | 2004-10-14 | Outokumpu Copper Products Oy | Substrate material of a copper-magnesium alloy |
| WO2004087976A1 (en) * | 2003-04-03 | 2004-10-14 | Outokumpu Copper Products Oy | Oxygen-free copper alloy and method for its manufacture and use of copper alloy |
| WO2004087973A1 (en) * | 2003-04-03 | 2004-10-14 | Outokumpu Oyj | Copper alloy containing phosphides and having a low oxygen content |
| EP1630240A1 (en) * | 2003-03-03 | 2006-03-01 | Sambo Copper Alloy Co., Ltd | Heat-resisting copper alloy materials |
| JP2007291518A (en) * | 2006-03-30 | 2007-11-08 | Dowa Metaltech Kk | Cu-Fe-P-Mg BASED COPPER ALLOY, ITS PRODUCTION METHOD, AND CONDUCTIVE COMPONENT |
| CN101979689A (en) * | 2010-11-16 | 2011-02-23 | 蔡元华 | Bonding copper wire and preparation method thereof |
| EP2388347A1 (en) * | 2006-10-02 | 2011-11-23 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet for electric and electronic parts |
| US8986471B2 (en) | 2007-12-21 | 2015-03-24 | Mitsubishi Shindoh Co., Ltd. | High strength and high thermal conductivity copper alloy tube and method for producing the same |
| US9163300B2 (en) | 2008-03-28 | 2015-10-20 | Mitsubishi Shindoh Co., Ltd. | High strength and high conductivity copper alloy pipe, rod, or wire |
| US9455058B2 (en) | 2009-01-09 | 2016-09-27 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
| US9512506B2 (en) | 2008-02-26 | 2016-12-06 | Mitsubishi Shindoh Co., Ltd. | High strength and high conductivity copper alloy rod or wire |
| US10311991B2 (en) | 2009-01-09 | 2019-06-04 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
-
1998
- 1998-03-06 JP JP07360698A patent/JP3957391B2/en not_active Expired - Lifetime
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2809419A1 (en) * | 2000-05-25 | 2001-11-30 | Kobe Steel Ltd | COPPER ALLOY FOR USE IN ELECTRICAL AND ELECTRONIC PARTS |
| EP1630240A1 (en) * | 2003-03-03 | 2006-03-01 | Sambo Copper Alloy Co., Ltd | Heat-resisting copper alloy materials |
| EP1630240A4 (en) * | 2003-03-03 | 2007-06-20 | Sambo Copper Alloy Co Ltd | Heat-resisting copper alloy materials |
| US7608157B2 (en) | 2003-03-03 | 2009-10-27 | Mitsubishi Shindoh Co., Ltd. | Heat resistance copper alloy materials |
| US10266917B2 (en) | 2003-03-03 | 2019-04-23 | Mitsubishi Shindoh Co., Ltd. | Heat resistance copper alloy materials |
| WO2004087975A1 (en) * | 2003-04-03 | 2004-10-14 | Outokumpu Copper Products Oy | Substrate material of a copper-magnesium alloy |
| WO2004087976A1 (en) * | 2003-04-03 | 2004-10-14 | Outokumpu Copper Products Oy | Oxygen-free copper alloy and method for its manufacture and use of copper alloy |
| WO2004087973A1 (en) * | 2003-04-03 | 2004-10-14 | Outokumpu Oyj | Copper alloy containing phosphides and having a low oxygen content |
| JP2007291518A (en) * | 2006-03-30 | 2007-11-08 | Dowa Metaltech Kk | Cu-Fe-P-Mg BASED COPPER ALLOY, ITS PRODUCTION METHOD, AND CONDUCTIVE COMPONENT |
| EP2388349A1 (en) * | 2006-10-02 | 2011-11-23 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet for electric and electronic parts |
| EP2388347A1 (en) * | 2006-10-02 | 2011-11-23 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet for electric and electronic parts |
| US20120039742A1 (en) * | 2006-10-02 | 2012-02-16 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd) | Copper alloy sheet for electric and electronic parts |
| US20120039741A1 (en) * | 2006-10-02 | 2012-02-16 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet for electric and electronic parts |
| US20120039743A1 (en) * | 2006-10-02 | 2012-02-16 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet for electric and electronic parts |
| US8986471B2 (en) | 2007-12-21 | 2015-03-24 | Mitsubishi Shindoh Co., Ltd. | High strength and high thermal conductivity copper alloy tube and method for producing the same |
| US9512506B2 (en) | 2008-02-26 | 2016-12-06 | Mitsubishi Shindoh Co., Ltd. | High strength and high conductivity copper alloy rod or wire |
| US10163539B2 (en) | 2008-02-26 | 2018-12-25 | Mitsubishi Shindoh Co., Ltd. | High strength and high conductivity copper alloy rod or wire |
| US9163300B2 (en) | 2008-03-28 | 2015-10-20 | Mitsubishi Shindoh Co., Ltd. | High strength and high conductivity copper alloy pipe, rod, or wire |
| US9455058B2 (en) | 2009-01-09 | 2016-09-27 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
| US10311991B2 (en) | 2009-01-09 | 2019-06-04 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
| CN101979689A (en) * | 2010-11-16 | 2011-02-23 | 蔡元华 | Bonding copper wire and preparation method thereof |
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