JP2001152303A - Copper or copper-base alloy, excellent in press workability, and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a copper-base alloy excellent in press workability, which is blanked into prescribed shape by high speed press forming and used for small-sized connector, switch, relay, etc., and its manufacturing method. SOLUTION: The copper-base alloy excellent in press workability, in which, as to the X-ray diffraction intensity of the cross section of the material, the sum of the diffraction intensity of 111} and that of 222} becomes two or more times that of 200}, and its manufacturing method are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to copper or a copper-based alloy excellent in press workability and a method for producing the same, and more particularly to a product for consumer use, for example, a base plate of a lead frame for semiconductors, a narrow pitch connector for information and communication. The present invention relates to a copper-based alloy having excellent press workability, which constitutes an original plate of a small relay and a small relay, and a method for producing the same.

[0002]

2. Description of the Related Art Along with high-density mounting of home electric appliances, information communication equipment, and automobile parts, connectors, switches, relays, and the like have been miniaturized, and the materials constituting these tend to be thinner and thinner. . These parts are usually punched by a high-speed press using a mold.In the press working, after the material undergoes shear deformation by the punch of the mold, cracks are generated from the cutting edge, The sheet is punched into a predetermined shape by breaking deformation.

[0003] However, as the number of press shots increases, the wear of the cutting edge of the die punch increases, and as a result, cracks are unevenly generated from the cutting edge, and the fracture shape is disturbed. The step between the band and the rupture band becomes large, large burrs are generated, or large scum of the material generated by the rupture is generated, so that a predetermined product shape cannot be maintained.

[0004] Conventionally, as a measure to improve the life of the mold,
This has been addressed by improving the material of the punch, improving the lubricity of the press lubricating oil, and setting a clearance suitable for each copper-based alloy. However, no epoch-making improvement was realized.

[0005]

The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems of the prior art. As a result, a small-sized connector punched into a predetermined shape by high-speed press molding using a mold. In the materials for switches, relays, etc., it was found that the excellent press workability is an important problem in terms of properties to solve the problems. That is, it has been found that by controlling the crystal orientation of the material, a copper-based alloy excellent in press workability can be obtained, and the present invention proposes the alloy and a method for manufacturing the same.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a copper or copper-based alloy material, particularly to an RD surface (a cross section perpendicular to the rolling direction of a sheet material; hereinafter, referred to as an RD surface) and a TD surface (rolling of a sheet material). X-ray diffraction focusing on a cross section parallel to the direction (hereinafter referred to as a TD plane), and controlling the strength of a specific direction among the obtained crystal orientations, thereby improving the press-workability of the copper-based alloy. A material and a method for manufacturing the same are provided. Here, the X-ray diffraction intensity indicates, for example, the integrated intensity of the crystal orientation of the material measured by the X-ray diffraction method.

That is, the present invention provides: 1. A copper or copper-based alloy excellent in press workability, characterized in that the X-ray diffraction intensity of the cross section of the material is S ≧ 2. However,

(Equation 5) I {111} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}.

2. _SRD ≧ 2 in the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material and S _TD ≧ 4 in the X-ray diffraction intensity of the cross section parallel to the processing direction of the material, and S _RD × S
Copper or copper-based alloy excellent in press workability, wherein _TD ≧ 16. However

(Equation 6) Here, S _RD is a value measured for an X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, S _TD is a value measured for an X-ray diffraction intensity of a cross section parallel to the processing direction of the material, and I {111} is {111}.回 折, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}.

3. Sn, Ni, P, Si, Zn, Fe,
X-ray diffraction intensity of a cross-section perpendicular to the processing direction of the material, which is a copper-based alloy containing 0.01 to 35 wt% in total of one or more selected from Mg and Al, the balance being Cu and unavoidable impurities. Copper or copper excellent in press workability, wherein S _RD ≧ 2 and X _TD diffraction intensity of a cross section parallel to the processing direction of the material is S _TD ≧ 4 and S _RD × S _TD ≧ 16 Base alloy. However,

(Equation 7) Here, S _RD is a value measured for an X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, S _TD is a value measured for an X-ray diffraction intensity of a cross section parallel to the processing direction of the material, and I {111} is {111}.回 折, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}.

4. Sn, Ni, P, Si, Zn, Fe,
Predetermined by rolling one or two or more kinds selected from Mg and Al in a total amount of 0.01 to 35 wt%, and rolling an ingot of a copper-based alloy comprising the balance of Cu and unavoidable impurities, or repeating hot rolling and heat treatment. Is subjected to a heat treatment at a temperature of 350 to 750 ° C., and the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material is 1 ≦ S _RD ≦
3 and X-ray diffraction intensity of a cross section parallel to the material processing direction is 1
By setting ≦ S _TD ≦ 3, a combination of cold rolling at a rolling reduction ratio of 30% or more or 50% or more and low-temperature annealing at a temperature lower than the recrystallization temperature is performed, whereby an X-ray of a cross section perpendicular to the processing direction of the material is obtained. a S _TD ≧ 4 in X-ray diffraction intensity of the cross section parallel to the working direction of the S _RD ≧ 2 and material in the diffraction intensity, excellent press formability, characterized in that the S _{R D} × S _TD ≧ 16 Copper or copper-based alloy. However,

(Equation 8) Here, S _RD is a value measured for an X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, S _TD is a value measured for an X-ray diffraction intensity of a cross section parallel to the processing direction of the material, and I {111} is {111}.回 折, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}.

[0011]

The contents of the present invention will be specifically described below. The present invention focuses on a cross section parallel to a cross section perpendicular to a processing direction of a material, particularly for copper or a copper-based alloy, and performs X-ray diffraction to control the intensity of a specific direction among the obtained crystal directions. This is to improve press workability.

First, in press working, it is important to align the crystal orientation in a certain direction in order to make cracks from the cutting edge uniform when shear deformation of the material occurs. If the crystal orientation is aligned with {111}, the shape of the pressed section is better. on the other hand,
If there are many other planes in the cross section, especially the {200} plane, the extension direction of the cracks generated when the shear deformation occurs becomes an angle of 20 ° or more to the direction of the press,
As a result, abrasion of the cutting edge is promoted, and large scum of the material generated by the breakage adheres to the cutting edge, thereby promoting the wear of the cutting edge. Therefore, {200}
The smaller the surface, the better the shape of the cross section of the press, and the wear of the cutting edge can be suppressed.

A cross section perpendicular to the material processing direction is referred to as an RD plane, and a cross section parallel to the processing direction is referred to as a TD plane. X of RD plane and TD plane
Line diffraction, diffraction intensity of {111} I {111},
Measure the diffraction intensity of {222} I {222}, the diffraction intensity of {200} I {200},

(Equation 9) In becomes the parameter S was introduced, the S measured for RD surface _S RD, when the S was measured TD surface and _{S TD, S RD} ≧ 2 and S _TD ≧ 4, and S _{R D} × S
_{When TD} ≧ 16, the shape of the terminal punched by the press was good.

On the other hand, when S _RD ≧ 2 and S _TD ≧ 4 and S _RD × S _TD <16, S _RD ≧ 2 and S
_{When TD} <4 and S _RD × S _TD <16, S _RD
≧ 2 and S _TD <4 and S _RD × S _TD ≧ 16, S _RD <2 and S _TD ≧ 4 and S _RD × S
_{When TD} <16, when S _RD <2 and S _TD ≧ 4 and when S _RD × S _TD ≧ 16, S _RD <2 and S
_{When TD} <4 and _SRD × _STD <16, as the number of shots of the press increased, the wear of the cutting edge progressed, and the shape of the punched terminal deteriorated.

The material of the present invention can be produced through the following steps. That is, the first step is a step of mixing and dissolving each component in a predetermined amount and casting an ingot of a predetermined composition from the obtained liquid. This step can be applied to a dissolution method in the air, a dissolution method in a reducing atmosphere, or a dissolution method in a vacuum.

The second step is a step of subjecting the obtained ingot to a heat treatment. This step is a step of reducing the segregation generated at the time of casting by heat treatment at a temperature of 700 ° C. or more. This is an important step for achieving uniformity.

The third step is a rough rolling step, and it is desirable that the rolling rate is 50% or more. This step is
In the next important step for performing the recrystallization treatment in the fifth step, when the rolling reduction ratio is less than 50%, the recrystallized grains become non-uniform, and as a result, the crystal orientation becomes non-uniform, In this step, it is difficult to orient the crystal orientation of the material cross section to {111}. This step can be applied to both cold rolling and warm rolling.

The fourth step is a heat treatment step in which the crystal grain size of the material is made uniform and fine. In the fifth and subsequent steps, once the crystal orientation of the cross section of the material is oriented to {111}. This is a process for making the omnidirectional state. The heat treatment temperature is 350 to 750 ° C. When the temperature is lower than 350 ° C., the above heat treatment effect cannot be sufficiently exhibited,
If the temperature exceeds 750 ° C., the crystal grain size becomes coarse,
No matter how the subsequent steps are devised, the desired press workability cannot be obtained. In particular, it is necessary that 1 ≦ S _RD <3 and 1 ≦ S _TD <3.

The fifth step is a cold rolling step, and the sixth step is a low-temperature annealing step. The important thing in the fifth step is
In the case where this step is the final rolling step, it means that the rolling rate is 30% or more. In this step, the degree of aggregation of the crystal orientation {111} of the material cross section is increased, and the degree of aggregation of the crystal orientation {200} of the material cross section is suppressed. If the rolling ratio is less than 30%, it is difficult to orient the crystal orientation of the material cross section to {111} because the applied processing strain is small. It is preferably at least 50%, more preferably at least 80%.

The sixth step is a step of removing excessive processing strain generated in the fifth step by the heat treatment, and can improve bending workability of the material. The heat treatment temperature in this step is lower than the recrystallization temperature of each material, and preferably the heat treatment temperature is 200 to 400 ° C. As the copper-based alloy according to the present invention, for example, a Cu-Ni-Sn-P-based alloy, Cu-
Sn-P alloy, Cu-Ni-Si alloy, Cu-Mg
And copper-based alloys such as a -P-based alloy and a Cu-Zn-Sn-Fe-based alloy.

The component range of the copper-based alloy according to the present invention is represented by S
One or more selected from n, Ni, P, Si, Zn, Fe, Mg, and Al in a total amount of 0.01 to 35 wt.
%, And the balance is defined to be composed of Cu and unavoidable impurities in order to maintain the balance of conductivity, tensile strength, spring limit value, and bending workability of the material, and also to improve press workability.

Sn, Ni, P, Si, Zn, Fe, M
When the total amount of one or more selected from g and Al is less than 0.01 wt%, the electrical conductivity increases, but the properties such as tensile strength, spring limit value, press workability, heat resistance and the like increase. It is difficult to obtain. Further, when the rolling ratio is increased to improve the tensile strength, the spring limit value, and the press workability, the bending workability deteriorates. On the other hand, Sn, Ni, P, Si, Z
one or two selected from n, Fe, Mg, and Al
When the total amount of the species exceeds 35 wt%, the tensile strength and the spring limit value increase, but the electrical conductivity decreases and the bending workability further deteriorates.

Therefore, regarding the component range of the copper-based alloy according to the present invention, Sn, Ni, P, Si, Zn, Fe, M
One or two or more selected from g and Al are contained in a total amount of 0.01 to 35 wt%, and the balance is defined as a copper-based alloy including Cu and unavoidable impurities. Note that elements other than the additional elements specified in the present invention, for example, Ag, Au, Bi, C
o, Cr, In, Mn, La, Pd, Pb, Sb, S
1 selected from elements e, Te, Ti, Y, and Zr
If the total amount of the species or two or more species is 5 wt% or less, the effect obtained even when added to the additive element specified in the present invention is not impaired.

Next, embodiments of the present invention will be described with reference to examples.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Example 1 Table 1 shows a copper-based alloy No.
1 to 16 were melted in an Ar atmosphere using a high-frequency melting furnace,
It was cast into an ingot of 40 × 40 × 150 (mm).
From the obtained ingots Nos. 1 to 16, 10 ^t × 40 ^w
A test piece of × 40 ^l (mm) was cut out and heated at 850 ° C. for 1 hour.
After performing the homogenization heat treatment (second step),
Nos. 3, 9 and 10 were rolled from 10 mm to 2.0 mm in thickness by cold rolling, and Nos. 4 to 8 and 11 to 16 were rolled from 10 mm to 5 mm in thickness by hot rolling. Rolling was performed from a thickness of 5 mm to 2.0 mm by cold rolling (third step).

[0025]

[Table 1]

Next, of the test pieces Nos. 1 to 16 obtained, Nos. 1 to 11 and No. 13 were 500 ° C. × 1.
h, a heat treatment of No. 12, No. 14 to 16 was performed at 600 ° C. × 1 h (fourth step). X-ray diffraction was performed on the RD plane and TD plane of the obtained test piece, and S _RD and S _TD were measured. The measurement conditions of the X-ray diffraction intensity are as follows. Tube: Cu, tube voltage: 40 KV, tube current: 30 mA, sampling width: 0.002 ° using a chromometer, sample holder: AL As a result, for Nos. 1 to 11 and No. 13, 1 ≦ S _RD <
3, 1 ≦ S _TD <3, but No. 12, No. 1
Nos. 4 to 16 did not satisfy 1 ≦ S _RD <3 and 1 ≦ S _TD <3. Note that the X-ray diffraction measurement conditions are not limited to the above conditions, but are appropriately changed according to the type of the sample.

Cold rolling (fifth step) and, if necessary, heat treatment (fourth step) were performed on Nos. 1 to 16 thus obtained. Means that the rolling rate after the heat treatment (the fourth step) is 30%
As described above, for Nos. 9 to 11 and Nos. 13 to 16, the rolling reduction rate after the heat treatment (the fourth step) was 30%.
Rolling was carried out so that the thickness was less than 0.20 mm.

Finally, a heat treatment (sixth step) of 300 ° C. × 1 h was performed to obtain a sample for evaluation. For the sample obtained in this way, S _RD , S _TD , S
_RD × _STD was measured. Furthermore, continuous press working of the terminal shape was performed on these samples, and the press working was stopped when the burr height of the material exceeded 25 μm, and the number of shots up to this point was taken as the maximum number of shots.

From the results in Table 1, the following is clear. The alloys of Nos. 1 to 8 according to the present invention satisfy S _RD ≧ 2 and S _TD ≧ 4 and S _RD × S _TD ≧ 16, and exceed 2,000,000 shots in the maximum number of press shots. It is a copper-based alloy material with excellent properties.

On the other hand, in the fourth step, 1 ≦ S _RD <3,1
No. 12 which did not satisfy ≦ S _TD <3 did not satisfy S _TD ≧ 2 and S _RD × S _TD ≧ 16, and when 1.5 million shots were exceeded, burr on the RD surface became 30 μm. Fifth
No. 9-1 whose rolling reduction rate is less than 30% in the step of
Among Nos. 1 and 13, Nos. 9 and 10 have S _TD ≧ 4 and S
_RD × _{S T D} ≧ 16 does not satisfy the burr of TD surface exceeds the maximum number of shots over a 25 [mu] m, No.1
1,13 _{is, S RD ≧ 2, S TD} ≧ 4, S RD × S TD
All of ≧ 16 were not satisfied, and burrs on the RD and TD surfaces exceeded 25 μm before the number of shots reached 1,000,000.

In the fourth step, 1 ≦ S _RD <3 and 1 ≦ S
No. 14 out of Nos. 14 to 16 which did not satisfy _RD <3 and had a rolling reduction ratio of less than 30% in the fifth step,
And No. 15 did not satisfy S _TD ≧ 2 and S _RD × S _TD ≧ 16, and when 1 million shots were reached, the burr on the RD surface exceeded 25 μm. No. 16 is S
_TD ≧ 4 is not satisfied, and T
The burrs on the D side exceeded 25 μm, and material residue adhered between the punch and the die, making it impossible to continue pressing.

Example 2 The alloy No. 4 of the present invention shown in Table 1 of Example 1 and a commercially available phosphor bronze alloy (C5191 temper H: 6.5 wt% Sn, 0.2
wt% P, balance Cu) and copper base alloy (C7025 temper H: 3.2wt% NI, 0.70wt% SI, 0.15wt% Mg, balance Cu), Vickers hardness, tensile strength, spring limit, conductivity The rate, press workability and bending workability were evaluated.

Vickers hardness, tensile strength, spring limit,
Conductivity was measured according to JIS Z2244, JIS
Z 2241, JIS H 3130, JIS H 0
505. The press workability was evaluated by measuring the maximum number of press shots in the same manner as in Example 1. The bending workability was measured by a 90 ° W bending test (JIS H31).
10), the inner bending radius R was 0.08 mm, and the ratio R / t of the bending radius R to the plate thickness t was 0.4. Is evaluated as △, and those with cracks are evaluated as x. Table 2 shows the results.

[0034]

[Table 2]

From the results shown in Table 2, the copper-based alloy of the present invention shows a higher Vickers hardness, a higher tensile strength, and a lower spring strength than those of the conventional copper-based alloys C5191 and C7025 for connectors, switches and relays. It can be seen that the balance between the limit value, conductivity, press workability, and bending workability is excellent. As described above, the present invention has obtained a copper or copper-based alloy for connectors, switches, and relays excellent in press workability,
Copper or copper-based alloys that can significantly reduce costs by reducing the thickness and thickness of materials and increasing the life of press dies accompanying the high-density packaging of home appliances, information and communication equipment, and automotive parts in recent years To provide.

[0036]

As described above, according to the present invention, it is possible to obtain a copper-based alloy excellent in press workability for connectors, switches, relays, etc., and has recently been used for home electric appliances, information communication equipment and automobiles. Thinner materials due to high-density mounting of components,
By reducing the thickness of the wire and improving the service life of the press, the cost can be significantly reduced.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C22F 1/00 694 C22F 1/00 694B

Claims (4)

[Claims] 1. An X-ray diffraction intensity of a cross section of a material, S ≧
2. A copper or copper-based alloy excellent in press workability, characterized in that: Where: I {111} is the diffraction intensity of {111}, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}. 2. X-ray diffraction of a cross section perpendicular to the processing direction of the material
S in strength_RD≧ 2 and parallel to the material processing direction
X-ray diffraction intensity of cross section_TD≧ 4 and S _RD× S
_TDExcellent press formability characterized by ≧ 16
Copper or copper-based alloy. Where:Where S_RDIs an X-ray beam with a cross section perpendicular to the material processing direction.
Regarding the folding strength, S_TDIs a cross section parallel to the material processing direction
I {111} is a value measured for the X-ray diffraction intensity of
{111} diffraction intensity, I {222} is {222} times
The folding intensity, I {200}, is the diffraction intensity of {200}. 3. Sn, Ni, P, Si, Zn, Fe, M
g, total amount of one or more selected from Al
0.01 to 35 wt%, with the balance being Cu and inevitable impurities
Copper-based alloy consisting of
X-ray diffraction intensity of the surface_RD≧ 2 and material processing
X-ray diffraction intensity of a cross section parallel to the _TD≧ 4,
S_RD× S_TDPress processing characterized by ≧ 16
Copper or copper-based alloy with excellent workability. However,Where S_RDIs an X-ray beam with a cross section perpendicular to the material processing direction.
Regarding the folding strength, S_TDIs a cross section parallel to the material processing direction
I {111} is a value measured for the X-ray diffraction intensity of
{111} diffraction intensity, I {222} is {222} times
The folding intensity, I {200}, is the diffraction intensity of {200}. 4. Sn, Ni, P, Si, Zn, Fe, M
g or Al, one or more selected from the group consisting of 0.01 to 35 wt% in total, and a predetermined amount obtained by rolling an ingot of a copper-based alloy comprising the balance of Cu and unavoidable impurities, or repeating hot rolling and heat treatment. Material with thickness of 3
A heat treatment is performed at a temperature of 50 to 750 ° C., and the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material is 1 ≦ S _RD ≦ 3.
And the X-ray diffraction intensity of the cross section parallel to the processing direction of the material is 1 ≦
Assuming that S _TD ≦ 3, by combining cold rolling with a rolling reduction ratio of 30% or more or 50% or more and low-temperature annealing below the recrystallization temperature, the X-ray diffraction intensity of the cross section perpendicular to the processing direction of the material is obtained. S _RD ≧ 2 and the X-ray diffraction intensity of the cross section parallel to the processing direction of the material is S _TD ≧ 4,
Copper or copper-based alloy excellent in press workability, wherein _RD × S _TD ≧ 16. However, Here, S _RD is a value measured for an X-ray diffraction intensity of a cross section perpendicular to the processing direction of the material, S _TD is a value measured for an X-ray diffraction intensity of a cross section parallel to the processing direction of the material, and I {111} is {111}.回 折, I {222} is the diffraction intensity of {222}, and I {200} is the diffraction intensity of {200}.