JPH11186707A - はんだ付け装置とはんだ付け方法 - Google Patents
はんだ付け装置とはんだ付け方法Info
- Publication number
- JPH11186707A JPH11186707A JP35101897A JP35101897A JPH11186707A JP H11186707 A JPH11186707 A JP H11186707A JP 35101897 A JP35101897 A JP 35101897A JP 35101897 A JP35101897 A JP 35101897A JP H11186707 A JPH11186707 A JP H11186707A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- soldering
- air
- cooling
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35101897A JPH11186707A (ja) | 1997-12-19 | 1997-12-19 | はんだ付け装置とはんだ付け方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35101897A JPH11186707A (ja) | 1997-12-19 | 1997-12-19 | はんだ付け装置とはんだ付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11186707A true JPH11186707A (ja) | 1999-07-09 |
| JPH11186707A5 JPH11186707A5 (enExample) | 2005-03-10 |
Family
ID=18414488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35101897A Pending JPH11186707A (ja) | 1997-12-19 | 1997-12-19 | はんだ付け装置とはんだ付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11186707A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003098982A1 (fr) * | 2002-05-16 | 2003-11-27 | Yokota Technica Limited Company | Dispositif de soudage par refusion |
-
1997
- 1997-12-19 JP JP35101897A patent/JPH11186707A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003098982A1 (fr) * | 2002-05-16 | 2003-11-27 | Yokota Technica Limited Company | Dispositif de soudage par refusion |
| CN100459827C (zh) * | 2002-05-16 | 2009-02-04 | 横田技术有限公司 | 回流焊接装置 |
| KR100883732B1 (ko) * | 2002-05-16 | 2009-02-13 | 유겐가이샤 요코타테쿠니카 | 리플로우 납땜장치 |
| US7690550B2 (en) * | 2002-05-16 | 2010-04-06 | Yokota Technica Limited Company | Reflow soldering apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100702544B1 (ko) | 회로 기판의 배치 및 납땜 방법과, 이러한 방법을 위한 회로 기판 및 리플로우 오븐 | |
| KR100524841B1 (ko) | 리플로우방법 및 리플로우장치 | |
| JP2924888B2 (ja) | 電子ユニットの半田付け装置 | |
| JP5158288B2 (ja) | 加熱装置及び冷却装置 | |
| JPH11307927A (ja) | はんだ付け装置とはんだ付け方法 | |
| US10237926B2 (en) | Inductive heater for area array rework system and soldering handpieces | |
| JPH11186707A (ja) | はんだ付け装置とはんだ付け方法 | |
| JP4043694B2 (ja) | リフロー装置 | |
| JP3186215B2 (ja) | チッソリフロー装置 | |
| JP2001144428A (ja) | ハンダ付け装置及びハンダ付け方法 | |
| JP3454621B2 (ja) | 不活性ガス雰囲気炉 | |
| JP2000059020A (ja) | 半田付け用片面リフロー炉の冷却装置 | |
| JPH10200254A (ja) | 熱風加熱装置および加熱方法 | |
| JP2502826B2 (ja) | プリント基板のリフロ−はんだ付け方法 | |
| JP3109689B2 (ja) | リフロー半田装置 | |
| JPH11279790A (ja) | リフロー装置 | |
| JP2001320163A (ja) | リフロー装置およびその基板加熱方法 | |
| JP3944438B2 (ja) | リフロー装置 | |
| JP2000165032A (ja) | はんだ付け装置とはんだ付け方法 | |
| JPH09214123A (ja) | リフロー装置 | |
| JP3070271B2 (ja) | リフロー装置 | |
| JP2002158433A (ja) | リフローはんだ付け装置およびリフローはんだ付け方法 | |
| JP2004358542A (ja) | リフロー炉およびリフロー炉の温度制御方法 | |
| JPH05152733A (ja) | 表面実装用プリント配線基板 | |
| KR20030059704A (ko) | 무연 솔더의 리플로우 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040406 |
|
| A621 | Written request for application examination |
Effective date: 20040406 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20061024 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070306 |