JPH11186707A - Apparatus and method for soldering - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and method for soldering components, wherein solder zones on a board can be efficiently heated with adequately cooling non heat-resistant components mounted on the board. SOLUTION: This apparatus heats soldering parts of non heat-resistant components 101-104 for electrically connecting them to a board P and has a means 20 for heating the soldering parts of the non heat-resistant components 101-104 on the board P with hot air fed to the entire first plane 310 and a means 22 for cooling a second plane 320 of the non heat-resistant components 101-104. The cooling means 22 is provided with an air flow rate regulator mechanism for adjusting the air flow rate for cooling the non heat-resistant components 101-104 by controlling the opening area for taking air from the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus and a soldering method for heating a soldering portion of a board in order to electrically connect components of the board and solder.

[0002]

2. Description of the Related Art Electronic devices for forming various circuits are mounted on a substrate on which various circuits of the electronic device are formed, for example, a printed circuit board (also referred to as a printed wiring board). Examples of the mounting format of this type of electronic component include insertion mounting (lead component, etc.) and surface mounting (chip component, etc.).
There is. The mounted electronic components are electrically connected to the wiring part of the printed circuit board by soldering. As such a soldering method, a flow soldering method and a reflow soldering method are known. . The flow soldering method is a method in which a substrate is passed through a solder bath in which solder is melted. The reflow soldering method is a method in which cream solder or the like is applied to a predetermined portion of a printed board, and then the soldered portion of the printed board is heated in a reflow furnace.

However, the size of components to be mounted has been reduced, and it has been required to increase the mounting density of electronic components with respect to the mounting area of a printed circuit board. For this reason, the interval between the connection terminals derived from the mounting components on the printed circuit board is naturally narrow. When the above-mentioned flow soldering method is employed, a bridge of solder is easily formed between connection terminals having a small interval. For this reason, when soldering is performed on a printed circuit board on which high-density electronic components are mounted, a reflow soldering method is mainly employed.

By the way, on one printed circuit board,
Various components with various heat resistance standards are mounted, but it is necessary to solder the mounted components to one printed circuit board by the flow soldering method and the soldering of the mounted components unless it is the reflow soldering method There may be parts that cannot be done. That is, it is necessary to use the flow soldering method and the reflow soldering method properly according to the type of electronic component to be mounted on one printed circuit board. For example, non-heat-resistant lead components (for example, transformers, semi-fixed volumes, air-core coils, chemical capacitors, etc.) are soldered to a printed circuit board by flow soldering, and air-core coils, ICs (integrated circuits)
A heat-resistant component such as a chip component such as a package is soldered to a printed circuit board by reflow soldering.

FIG. 11 shows an example of a conventional spot type reflow furnace. Non-heat-resistant lead components 1001 to 100 are provided on the upper surface 1000 side of the printed circuit board P.
4 are already mounted, and these lead components 100
The connection terminals 1 to 1004 correspond to the back surface 10 of the printed circuit board P.
05 side. The hot air 1008 of the hot air generator 1006 in the reflow furnace 1007 blows out from the nozzle 1009 to positions corresponding to the connection terminals of each of the lead components 1001 to 1004 so as to heat the solder 1010 located at those connection terminals. Has become. Thus, each nozzle 1009 of the conventional reflow furnace 1007 needs to be set in advance at a position corresponding to the solder 1010 of each connection terminal of the lead components 1001 to 1004 of the printed circuit board P.

FIG. 12 shows an example of a step of performing soldering by the reflow furnace shown in FIG. FIG.
5A, the surface 1005 of the printed circuit board P is already a heat-resistant component such as the transistor 1011 or the IC 101.
2 is attached using cream solder or the like. A cream solder is applied to the lead land using a multi-dispenser (nozzle) on the substrate. FIG. 12 (B), FIG.
This printed board P is inverted as shown in FIG.
Lead component 10 which is a non-heat-resistant component for upper surface 1000
01, 1002, etc. are mounted.

[0007] Next, as shown in FIG.
Using the nozzle 1009 of the reflow furnace 1007 as shown in FIG.
Hot air is blown out to the solder 1021 of the connection terminal 1020 of 002 to melt and solder the solder.
In this way, non-heat-resistant electronic components such as lead components and heat-resistant electronic components such as transistors and ICs are mounted on a single printed circuit board because, for example, a high-frequency component for a television receiver is used. The circuit of the device portion (for example, a tuner circuit and an IF circuit) is realized by one printed circuit board to improve productivity and reduce the size. In other words, a single printed circuit board is now required, which previously required two printed boards, a printed circuit board mounted with heat-resistant electronic components and a printed circuit board mounted with heat-resistant electronic components. .

However, the use of the spot type reflow furnace as described above has the following problems. As described above, the nozzle 1009 shown in FIG. 11 corresponds to the nozzle panel 10 corresponding to the arrangement of the connection terminals of the lead components on the printed circuit board P.
09A, the nozzle panel (reflow panel) 10 if the type of the printed circuit board P is different.
09A must be remade. If the type of the printed circuit board P is different, such a nozzle panel 1009A must be removed from the reflow furnace 1007 and replaced with a new nozzle panel 1009A. However, since the temperature is high, there is a problem in work. When hot air must be supplied to the solder of the connection terminals of each lead component under the same temperature conditions, it is difficult to set such conditions, it takes a lot of man-hours to set the conditions, and the temperature conditions are not well established Requires replacement of the nozzle panel 1009A. Since the nozzle 1009 is located near the solder of the connection terminal, the solder drops into the hole of the nozzle and becomes clogged, and the reflow temperature is partially lowered, so that inspection and maintenance management are very troublesome. It is.

[0009]

By the way, in the above-mentioned reflow furnace, it is necessary to heat the lower surface 1005 shown in FIG. 11 with hot air and to cool the upper surface 1000 having the lead component which is a non-heat-resistant component. is there. At this time,
The number of lead components that are non-heat-resistant components mounted on the upper surface 1000 of the printed circuit board P,
It is necessary to efficiently cool the lead components on the upper surface 1000 side depending on the temperature condition of the hot air from Step 7 and the like. Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a soldering apparatus and a soldering method capable of efficiently heating a soldered portion of a board while efficiently cooling a non-heat-resistant component mounted on the board. I have.

[0010]

According to the present invention, there is provided a soldering apparatus for heating a soldering portion of a non-heat-resistant component in order to electrically connect the non-heat-resistant component of a substrate. A heating means for supplying hot air to the entire first surface side of the non-heat-resistant component of the board on the side of the soldering portion to heat it, and a second means for mounting the non-heat-resistant component of the board. Cooling means for cooling the surface side, wherein the cooling means has an air amount adjusting mechanism for adjusting the amount of air for cooling the non-heat-resistant parts taken in from the outside with an opening area. This is achieved by a suitable soldering device.

[0011] The object of the present invention is to provide a method for heating a soldered portion of a non-heat-resistant component in order to electrically connect the non-heat-resistant component of the substrate. When the hot air is supplied to the entire first surface side and heated, and when the second surface side of the board on which the non-heat-resistant components are mounted is cooled, the non-heat-resistant components to be taken in from the outside are cooled. This is achieved by a soldering method characterized in that the amount of air for cooling is adjusted by the opening area.

According to the present invention, when the soldering portion of the substrate is heated to electrically connect the non-heat-resistant parts of the substrate, the heating means is provided on the entire surface of the first soldering portion of the substrate. Hot air is supplied for heating. When the soldering part is heated by such a heating means, the cooling means cools the second surface of the substrate on which the non-heat-resistant component is mounted. This cooling means has an air amount adjusting mechanism capable of adjusting the amount of air for cooling the non-heat-resistant parts taken in from the outside by the opening area. Thereby, when the heating means completely efficiently heats the first surface on the side of the soldering portion with hot air to melt the solder, the air amount adjusting mechanism of the cooling means reduces the amount of cooling air taken in from the outside. By adjusting the opening area, the non-heat-resistant component can be efficiently cooled according to conditions such as the number of mounted non-heat-resistant components.

In the present invention, the cooling means preferably has an exhaust means for supplying the external cooling air to the second surface side of the substrate by exhausting the inside of the casing. Thus, the exhaust means can take in the cooling air into the casing according to the opening area adjusted by the air amount adjusting mechanism. In the present invention, preferably, if the heating means includes a panel having a large number of holes, it is possible to uniformly heat the first surface of the non-heat-resistant component of the board on the soldering portion side by hot air. it can. By operating the fan device to pass air through the heater, hot air can be uniformly supplied to the first surface side of the substrate through the holes of the panel.

In the present invention, preferably, the heater is the first
If the heater and the second heater are provided, the heating capability of the air can be increased. In the present invention, preferably, the opening area of the air amount adjusting mechanism of the cooling means can be adjusted by moving the heat-resistant shielding plate. This shielding plate is preferably made of heat-resistant glass, so that heat from the heating means is less likely to be given to non-heat-resistant components as radiant heat than a metal shielding plate.

[0015]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows a preferred embodiment of a soldering apparatus according to the present invention, which can be preferably used as a reflow furnace. The soldering apparatus shown in FIG.
2, a cooling unit 14, a conveyor 16 and the like. As shown in FIGS. 2 and 9D, predetermined various components are mounted on the printed circuit board P in advance. This printed circuit board P
From the introduction section 11 of the conveyor 16 to the preheating section 1
0, and is discharged in the direction of arrow T via the reflow unit 12 and the cooling unit 14. That is, along the flow direction of the conveyor 16,
The preheating unit 10, the reflow unit 12, and the cooling unit 14 are sequentially arranged.

First, the preheating section 10 will be described.
The preheating section 10 is a section for preheating the printed circuit board P. The preheating section 10 includes a first preheating section 10A, a second preheating section 10B, and a third preheating section 1.
0C. The first preheating units 10A to 10C of the preheating unit 10 can heat the printed circuit board P to be introduced while gradually increasing from room temperature to a predetermined temperature over three stages. That is, the pre-heating unit 10 is mounted on the printed board P or the printed board P
The activation of the reflow solder is performed at the same time without applying stress to the electronic components mounted on the substrate.

The first preheating section 10A includes heaters H1,
H2 and a circulation fan F1. The second preheating section 10B has heaters H3, H4 and a circulation fan F2. The third preheating unit 10C includes one heater H
5 and a circulation fan F3. Heaters H1, H3
Is located above the conveyor 16 and the heater H
2, H4 and H5 are located below the conveyor 16. The circulation fans F1, F2, and F3 supply air to each heater to circulate hot air. However, the heater corresponding to the fan F3 is only the heater H5.
After the printed circuit board P is gradually raised from room temperature to a predetermined temperature by the conveyor 16 from the introduction section 11 through the first preheating section 10A to the third preheating section 10C of the preheating section 10, the printed circuit board P is Reflow unit 1
Reach 2.

Next, the structure of the reflow unit 12 will be described. The reflow section 12 is provided with a heating means 2 as shown in FIG.
0 and cooling means 22. Heating means 20
Is located below the printed circuit board P, and the cooling means 22 is located above the printed circuit board P. Here, before explaining the reflow unit 12, referring to FIG. 9, the printed circuit board P mounted on the introduction unit 11 of the conveyor 16 in FIG.
A configuration example will be described.

FIGS. 9A to 9D show, for example, the lead components 101 and 1 which are non-heat-resistant components on the printed circuit board P.
The procedure for mounting 02, 103 and 104 is simply shown. First, in the solder application step of FIG.
On the first surface 310 of the printed circuit board P, heat-resistant components such as the IC package 201 and the transistor 202 are provided.
Etc. are already implemented. The cream solder 300 is supplied from the nozzle 301 to a predetermined position on the first surface 310.

Next, as shown in FIG. 9B, the printed circuit board P is inverted so that the first surface 320 is located on the lower side and the second surface 320 is located on the upper side. In this state, the IC package 201 and the transistor 202, which are heat-resistant components, are located on the lower side, and the cream solder 300 is also located on the lower side.

Next, as shown in FIG. 9C, the connection terminals 150 of the lead components 101, 102, 103, and 104, which are non-heat-resistant components, are inserted into holes of the printed circuit board P. Each connection terminal 150 is connected to the cream solder 30.
0 corresponds to the application position. In such a state, FIG.
As shown in (D), the printed circuit board P is
2 between the heating means 20 and the cooling means 22.

Next, the cooling means 2 of the reflow unit 12 shown in FIG.
2 will be described. Cooling means 22 for reflow section 12
Has a structure as shown in FIGS. As shown in FIG. 2, a casing 30, an exhaust means 32, and an air amount adjusting mechanism 34 are provided.

As shown in FIGS. 2, 1 and 4, etc., the casing 30 is located above the conveyor 16, and the exhaust means 32 includes an exhaust blower 32 for exhausting the air in the casing 30. Have. When the exhaust blower 32 operates, the air in the casing 30 is exhausted from the opening 36 to the exhaust blower 32 through arrows R1 and R2. In other words, as shown in FIG. 2, cooling air for cooling the lead components 101, 102, 103, and 104, which are non-heat-resistant components on the second surface 320 side of the printed circuit board P, is supplied from the opening 36 in the R1 direction. The air that has been sucked in and cooled down can be guided to, for example, a factory exhaust facility 32A as shown in FIG. 6 by operating the exhaust blower 32 along the R2 direction. Opening 36 in FIG.
Is an opening for sucking outside air into the casing 30 as described above.
6, the opening area 36A can be adjusted.

The air amount adjusting mechanism 34 shown in FIG. 2 and FIG.
Is provided on the upper part of the casing 30 and has heat-resistant shielding plates 40 and 42 and guides 44 and 46.
The shielding plates 40 and 42 are preferably made of, for example, heat-resistant glass. It is preferable to use a heat-resistant material such as heat-resistant glass or ceramic rather than metal for the shielding plates 40 and 42 for the following reasons.

In FIG. 2, hot air HW
Is not supplied to the printed circuit board P, the heat of the hot air HW reaches the shielding plates 40 and 42. Shielding plates 40, 4
2 is made of a metal such as iron, the shielding plates 40 and 42 are immediately heated due to the good thermal conductivity, and the next time the printed circuit board P is supplied, its metallic properties Radiation heat is generated from the shielding plate, and the lead components 101 to 104, which are non-heat-resistant components, are heated by the radiation heat. Moreover, the radiant heat also lowers the cooling efficiency of the lead component due to the cool air taken in from the opening 36. For this reason, the shielding plates 40 and 42 can be made of, for example, heat-resistant glass having low thermal conductivity, instead of metal having good thermal conductivity. Further, by making the transparent heat-resistant glass, the operator can see the state of the reflow state of the printed circuit board P from above from the lead components 101 to 104 side, which are non-heat-resistant components.

The shielding plates 40 and 42 in FIG. 3 can be adjusted in the direction of the arrow S by driving means 40A and 42A such as motors to adjust the opening area 36A of the opening 36. The shielding plates 40 and 42 can be guided by the guides 44 and 46 by linear movement in the S direction. The operation of the driving units 40A and 42A such as these motors is controlled by the control unit 400.

In FIG. 2, the inflow portion of the outside air (cool air) in the casing 30 has a rectangular shape, for example, as viewed in a longitudinal section, and has both sides, that is, both sides with respect to the moving feed direction T of the printed circuit board P. An exhaust pipe 30B is provided at the position. Therefore, the outside air (cool air) sucked from the opening 36 is discharged along the exhaust pipe 3 along the R1 and R2 directions.
After passing through 0B, it is sent to the exhaust blower 32 side. The intake cylinder 36H guides outside air to the opening 36.

The conveyor rail 16A of the conveyor 16 shown in FIG. 4 has a function of transporting the printed circuit board P in the T direction. By adjusting the opening area 36A of the opening 36, the cooling capability of the lead components can be adjusted according to the number of lead components mounted on the printed circuit board P moved by the conveyor 16. it can.
If the opening area 36A of the opening 36 is large, the lead components 101 to 104 can be efficiently cooled while responding to the heating state of the hot air HW by the heating means 20 and the number of lead components. In any case, the size of the opening area 36A of the opening 36 is adjusted in consideration of the temperature condition in the casing 30 and the like, and the lead components 101 to 104 are cooled in an optimal state.

Next, the structure of the heating means 20 shown in FIG. 1 will be described. The structure of the heating means 20 is shown in FIG. 2, FIG. 4, FIG. 5, and FIG. The heating means 20 shown in FIG. 1 includes a lower heater 66 as a first heater, an upper heater 67 as a second heater, and a sirocco fan 6 as a fan device.
Eight. The lower heater 66 and the upper heater 67
The heater 69 is configured. The sirocco fan 68 takes in external air in the direction of arrow V in FIGS. 5 and 7 and supplies it from below the lower heater 66. Therefore, outside air passes through the lower heater 66, further passes through the upper heater 67, passes through the reflow panel hole 74 of the reflow panel (panel) 72 in FIG. The reflow soldering surface can be sprayed uniformly and entirely. The blown hot air HW escapes downward along the direction of arrow E as shown in FIG. The lower heater 66 and the upper heater 67 have holes 66A and 67A, respectively, and air from the sirocco fan 68
By passing through A and 67A sequentially, the air is heated from room temperature air to hot air HW at a predetermined temperature.

As shown in FIG. 2, on the upper heater 67, the above-described reflow panel 72 is disposed. In the reflow panel 72, as shown in FIG. 10, reflow panel holes 74 are uniformly arranged, for example, in a lattice shape. These reflow panel holes 74 are provided with the upper heater 67.
The hot air HW that has passed through is turned into a shower state, and is blown over the entire first surface (reflow soldering surface) 310 of the printed circuit board P uniformly. Hot air H
By spraying W on the first surface 310 side of the printed circuit board P in a shower shape, as shown in FIG. 9D, the cream solder 300 positioned at the connection terminals 150 of the lead components 101 to 104 is also provided. Is uniformly heated, and the connection terminals 150 are connected to the printed circuit board P using cream solder.
Can be electrically connected to the wiring conductor.

Next, the cooling section 14 shown in FIGS. 1 and 8 will be described. The cooling unit 14 has cooling fans 14A and 14B. For example, two cooling fans 14A are provided along the width direction of the conveyor 16, and similarly, two cooling fans 14B on the lower side are also arranged along the width direction of the conveyor 16. These cooling fans 14A, 1
By operating the 4B, the printed circuit board P on the conveyor 16 after the reflow processing can be cooled. The cooling fans 14A and 14B are respectively shown in FIG.
Can be rotated in the direction of arrow J, and the direction of the wind can be adjusted.

Next, using the above-described soldering apparatus,
A method of performing a soldering process on the printed circuit board P as shown in FIGS. 9 and 2 will be described. A printed circuit board P as shown in FIG. 9C is placed on the conveyor 16 of FIG. 1 such that the lead components 101 to 104 face up. The printed circuit board P moves from the introduction section 11 of the conveyor 16 in FIG. 1 in the T direction, so that the first preheating section 10A, the second preheating section 10B, and the third preheating section 10C of the preheating section 10 allow the printed circuit board P to reach a predetermined temperature from room temperature. It is gradually raised until. This alleviates the stress on the printed circuit board P and the various electronic components mounted thereon, and activates the cream solder 300 which is a reflow solder.

When the conveyor 16 moves the printed circuit board P from the preheating section 10 to the reflow section 12, the heating means 20 of the reflow section 12 uniformly and entirely heats the hot air HW as shown in FIGS. To the printed circuit board P
Of the first surface (reflow soldering surface) 310 of the printed circuit board P and the cooling means 2
Cool with 2.

The sirocco fan 16 of the heating means 20 shown in FIGS. 2 and 7 takes in air in the direction of arrow V and sends it to the lower heater 66 side. Thus, the air is heated to a predetermined temperature by the lower heater 66 and the upper heater 67, and the hot air HW is blown from the hole 74 of the reflow panel 72 to the cream solder 300 on the first surface 310 side of the printed circuit board P. Thereby, the cream solder 300 is melted, and the connection terminal 150 of the lead component 101 can be electrically connected to the wiring conductor of the printed circuit board P.

At the same time, the cooling means 22 shown in FIGS.
Cooling is performed by taking in outside air to 2, 103 and 104. That is, the outside air flows from the opening 36 to the arrow R
It is taken in the direction of 1, R2. When sending out the air, the exhaust blower 32 is operated. As a result, the cool air flows in the directions of R1 and R2 from the opening 36, and this flow of air cools the lead components 101 to 104, which are non-heat-resistant components. At this time, the cooling temperature in the casing 30 can be adjusted by appropriately adjusting the opening area 36A of the opening 36 by the air amount adjusting mechanism 34. The temperature is adjusted by factors such as the number of components of the lead components 101 to 104, which are non-heat-resistant components, and a predetermined temperature. In this way,
The first surface 310 side of the printed circuit board P is heated by the hot air HW, and the second surface 320 side is cooled by the air flowing from the opening 36.

At this time, the shielding plate 4 forming the opening 36 is formed.
Since 0 and 42 are made of a heat-resistant material, preferably a heat-resistant glass, radiant heat is less likely to be generated as compared with the case where a metallic shielding plate is used. In other words, by using heat-resistant glass or the like having low heat conductivity as compared with using a metal shield plate having good heat conductivity, the shield plate 40 can be heated by the hot air HW.
The shielding plates 40 and 42 prevent generation of radiant heat to the lead components 101 to 104 because the shielding plates 40 and 42 are hardly heated by the heat of the lead components and are cooled by the air from the openings 36. This makes it easier to adjust the temperature inside the casing 30.

The printed circuit board P subjected to the reflow processing in the reflow unit 12 as described above moves to the cooling unit 14 in FIG. 1, and the cooling fans 14A and 14B of the cooling unit 14 cool the printed circuit board P. The work ends. At this time, if the angles of the cooling fans 14A and 14B are changed as shown in FIG. 8, the cooling effect can be further enhanced. As described above, in the reflow zone, only the first surface (soldering surface) 310 is heated, and the second surface 320 of the printed circuit board including the lead component, which is a non-heat-resistant component, is cooled, so that the reflow process can be performed efficiently. Further, it is possible to eliminate a phenomenon that the lead component, which is a heat-resistant component, is damaged by heat.

Since the reflow panel 72 shown in FIG. 2 has many reflow panel holes 74, the printed circuit board P
Can be uniformly heated, and even if the solder falls to the reflow panel 72 side, the function of uniformly supplying the hot air is not much affected. Moreover, since the reflow panel 72 can uniformly supply hot air for any type of printed circuit board P reflow processing regardless of the type of the printed circuit board P, that is, the mounting form of the components, the replacement of the reflow panel is not required. It is unnecessary and the work efficiency is improved. In addition, the heater heating capability can be increased by configuring the heater with an upper heater and a lower heater. This heater is not limited to the upper heater and the lower heater, but may have three or more heater portions.

First surface (reflow soldering surface) 3 in FIG.
10 shows an IC package 201, a transistor 202, and the like, which are heat-resistant electronic components, as shown in FIG. In the embodiment of the present invention, the heat-resistant component is the above-described IC package, transistor, or the like. For example, as the IC package, SOP (Smal
l Outline Package), QFP (Q
uad Flap Package). On the other hand, non-heat-resistant lead components mounted on the second surface 320 side of the printed circuit board P in FIG. 2 include components such as a semi-fixed volume, an air-core coil, a chemical capacitor, and a transformer.

The present invention is not limited to the above embodiment. In the above-described embodiment, the conveyor 16 of FIG. 1 performs processing between the cooling unit 22 and the heating unit 20 of the reflow unit 12 while moving the printed circuit board P. However, the invention is not limited thereto, and the printed circuit board P may be stopped once between the cooling unit 22 and the heating unit 20 to perform the heating and cooling processing. The hole of the reflow panel 72 in FIG. 2 is not limited to a circular hole, and may be a long hole or a long hole, or a long hole type nozzle or a circular nozzle may be provided instead of the hole. . The preheating unit 10 of FIG.
A three-stage heating portion of A to third preheating portion 10C is provided, but the number of heating portions is not limited to this, and one, two, or four or more preheating portions may be provided.

[0042]

As described above, according to the present invention,
The soldered portion of the board can be efficiently heated while the non-heat-resistant parts mounted on the board are efficiently cooled.

[Brief description of the drawings]

FIG. 1 is a view showing a preferred embodiment of a soldering apparatus of the present invention.

FIG. 2 is a sectional view showing a structure of a reflow portion of the soldering apparatus of FIG. 1;

FIG. 3 is a perspective view showing an example of an air amount adjusting mechanism of a reflow unit.

FIG. 4 is a sectional view showing a reflow unit.

FIG. 5 is a cross-sectional view showing a reflow section, taken along a flow direction of a printed circuit board.

FIG. 6 is a diagram showing an exhaust unit and the like of a reflow unit.

FIG. 7 is a diagram showing a heating unit of a reflow unit.

FIG. 8 is a diagram showing a cooling unit.

FIG. 9 is a view showing an example of a printed circuit board mounted on the conveyor of FIG. 1;

FIG. 10 is a plan view showing an example of a reflow panel.

FIG. 11 is a view showing a conventional reflow furnace.

FIG. 12 is a diagram showing an example of a conventional reflow process.

[Explanation of symbols]

10 ... preheating part, 12 ... reflow part, 14
... Cooling section, 20 ... Reflow section heating means, 22
... Cooling means for the reflow section, 30 ... Casing,
32 ... exhaust blower (exhaust means), 34 ... air amount adjusting mechanism, 36 ... opening, 40, 42 ... shielding plate, 66 ... lower heater (first heater), 67 ...
Upper heater (second heater), 72: reflow panel, 74: reflow panel hole, 101 to 104 ...
・ Lead components (non-heat-resistant components), 310: 1st surface of printed circuit board, 320: 2nd surface of printed circuit board, P
..Printed circuit boards (boards)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takenori Jinguji, 2420 Nippa-cho, Kohoku-ku, Yokohama, Kanagawa

Claims (8)

[Claims] 1. A soldering apparatus for heating a soldering portion of a non-heat-resistant component to electrically connect the non-heat-resistant component of the board, wherein the soldering portion of the non-heat-resistant component of the board is heated. Heating means for supplying hot air to the entire surface of the substrate and heating the same, and cooling means for cooling the second surface of the substrate on which the non-heat-resistant component is mounted. A soldering device having an air amount adjusting mechanism for adjusting the amount of air for cooling a non-heat-resistant component to be taken in from the outside with an opening area. 2. The solder according to claim 1, wherein the cooling means includes a casing and an exhaust means for exhausting the inside of the casing to supply external cooling air to the second surface side of the substrate. Mounting device. 3. A heating means includes: a panel having a large number of holes; a heater for supplying hot air to the first surface side of the substrate entirely through the holes of the panel to heat the substrate; and sending air to the heater. The soldering device according to claim 1, further comprising: a fan device for feeding air. 4. The soldering apparatus according to claim 3, wherein the heater has a first heater for heating the air and a second heater for further heating the air heated by the first heater. 5. The air amount adjusting mechanism of the cooling means adjusts the opening area by moving a heat-resistant shield plate, and adjusts the amount of air taken in from outside by operating the exhaust means. 3. The soldering device according to claim 2, wherein the device is made of glass. 6. The soldering apparatus according to claim 1, wherein the heating means and the cooling means are used for reflow soldering, and are arranged at a subsequent stage of a preheating section for preheating the substrate. 7. When the soldering portion of the non-heat-resistant component is heated to electrically connect the non-heat-resistant component of the substrate, the first surface of the board at the soldering portion side is entirely When supplying hot air to heat and cooling the second side of the board on which the non-heat-resistant components are mounted, the amount of air for cooling the non-heat-resistant components to be taken in from the outside is opened. A soldering method characterized by adjusting the area. 8. The soldering method according to claim 7, wherein reflow soldering is performed in a stage subsequent to the preheating section for preheating the substrate.