JPH11183923A - Method of manufacturing liquid crystal display device and liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid crystal display device permitting to reduce a positional deviation when press-fixing a liquid crystal panel having a long longitudinal dimension of a terminal area wired on a substrate and a semiconductor element to each other at their terminals, and permitting to accurately and surely connect corresponding terminals with each other. SOLUTION: A press-fixing head 13 is used, which has a press-fixing surface formed to a predetermined length of a dimension L2 smaller than a length L1 of a terminal area wired on a glass substrate 21A. The terminals wired on the glass substrate 21A and the IC side terminals 22C are successively press- fixed to each other. This method makes it possible to reduce a positional deviation between the terminals and the IC side terminals 22C and prevent defective connection from occurring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display device and a liquid crystal display device, and more particularly, to connecting a liquid crystal panel to a substrate on which a semiconductor element (IC) for driving the liquid crystal panel is mounted. The present invention relates to a method for manufacturing a liquid crystal display device and a liquid crystal display device.

[0002]

2. Description of the Related Art A liquid crystal display device comprises a liquid crystal panel and a substrate on which a semiconductor element (IC) for driving the liquid crystal panel is mounted. For example, a terminal provided on a liquid crystal panel is connected to a TAB (Tape Automated Bonn).
Ding) TC with semiconductor element (IC) mounted on substrate
A terminal provided with a P (Tape Carrier Package) or a terminal provided with a COB (Chip On Board) having an IC directly attached to a terminal on a printed circuit board is electrically connected to manufacture a liquid crystal display device. Have been.

[0003] Here, like the connection between an input terminal provided on a glass substrate of a liquid crystal panel and a terminal (bump) of a substrate such as TCP or COB, connection between terminals at a fine pitch is made by the terminal. This is performed by crimping each other with a crimping head.

That is, terminals of a substrate on which a semiconductor element is mounted are arranged on input terminals provided on a glass substrate via an anisotropic conductive adhesive, and the terminals of the substrate are placed on the glass substrate by a pressure bonding head. Each terminal was connected by thermocompression bonding.

In recent years, as the size of a liquid crystal panel has increased, the number of terminals provided on a glass substrate has increased, and as a result, the area of the terminal of the substrate or the glass substrate (portion where the terminals are provided) has been increased. The length dimension is also getting longer.

At this time, conventionally, in order to complete the crimping process once, a crimping head formed to have a size equal to or larger than the length of the terminal area of the glass substrate is used. A liquid crystal display device is manufactured by crimping the terminals at one time.

[0007]

However, when a large number of terminals are simultaneously crimped by a large crimping head, the substrate is extended in the longitudinal direction by the heat of the crimping head.
In particular, the positions of the terminals at both ends of the substrate and the terminals arranged on the glass substrate are displaced, and the corresponding terminals cannot be crimped accurately and reliably, resulting in poor connection. Was.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the amount of positional deviation when terminals of a liquid crystal panel having a long length of a region of a terminal disposed on a substrate and a substrate on which a semiconductor element is mounted are crimped together. It is an object of the present invention to provide a method of manufacturing a liquid crystal display device and a liquid crystal display device that can accurately and reliably connect terminals to be connected.

[0009]

A method of manufacturing a liquid crystal display device according to the present invention comprises a liquid crystal panel and a substrate on which a semiconductor element is mounted, and a terminal provided on the liquid crystal panel;
A method of manufacturing a liquid crystal display device, comprising connecting a semiconductor element side terminal provided on the substrate, wherein the crimping surface has a predetermined length smaller than a length of a region of the terminal and the semiconductor element side terminal. The terminal and the semiconductor element side terminal are sequentially crimped using a crimping head having:

In this manner, a region to which the heat of the crimping head is applied in the terminal region (the portion where the terminal is provided) during one crimping operation (hereinafter referred to as a heat region).
Can be made smaller than in the prior art, so that the length of both ends of the semiconductor element side terminal region on the substrate or the like where the semiconductor element side terminals are arranged extends outward becomes smaller. For this reason,
For example, compared to a case where a large number of terminals are crimped at the same time with a large crimping head, the amount of displacement between the terminals is reduced,
Corresponding terminals are accurately and surely connected to each other, and occurrence of poor connection can be prevented.

[0011] Further, by using the crimping head, a terminal disposed on the liquid crystal panel and a terminal region connected to a semiconductor element side terminal disposed on the substrate are sequentially inwardly directed from both ends in a terminal area. Crimping is preferred.

By crimping the terminals sequentially from both ends in the terminal area to be connected to the inside using a crimping head, when crimping the inside of the terminal area to be connected, the terminals already connected are crimped. Because both ends of the area are fixed,
The amount of displacement due to thermal elongation is reduced. As a result, the amount of misalignment between the terminals in each part becomes smaller,
Corresponding terminals can be connected more accurately and reliably.

Further, at least one of the terminal provided on the liquid crystal panel and the semiconductor device side terminal connected to the terminal is arranged in blocks each having a length within the length of the crimping head. It is desirable to provide a gap between each block and to crimp these terminals sequentially for each block using a crimping head.

In this way, when crimping each part, compared with a case where the terminals are uniformly arranged in the terminal area to be connected, for example, the area to be crimped at once by the crimping head is smaller. Since the separation can be clearly performed and the positioning operation of the crimping head with respect to the region to be crimped can be easily performed, the crimping of the terminals for each part is simple and reliable, and the efficiency of the crimping operation is improved.

At this time, a plurality of the semiconductor elements are mounted on the substrate, and at least one of the blocked terminal and the semiconductor element side terminal is blocked for each semiconductor element. Is desirable.

If at least one of the terminal and the semiconductor element side terminal is divided into blocks for each semiconductor element, inspection of the terminal and connection confirmation can be easily performed for each semiconductor element.

The length of each block is 40 mm.
The following is preferred.

If the length of each block is 40 mm or less, both ends of the terminal region of the semiconductor element side terminal connected by the heat of the crimping head hardly extend, so that there is almost no displacement between the terminals. As a result, the corresponding terminals are accurately and reliably crimped to each other, and the occurrence of poor connection can be prevented.

Further, it is preferable that after crimping the terminals at both ends in the terminal region to be connected and the semiconductor element side terminal using a crimping head, the terminals other than both ends of the terminal region are crimped simultaneously.

After crimping the terminals at both ends in the terminal region to be connected first and the semiconductor element side terminal using a crimping head, and simultaneously crimping the terminals other than both end portions of the terminal region, the terminal to be connected can be obtained. Even if the terminals other than both ends of the region are collectively crimped together, both ends are first crimped and fixed, so that the amount of positional displacement between the terminals due to thermal expansion is reduced.

After crimping the terminals at both ends,
By simultaneously crimping the terminals other than both ends,
For example, the number of times of crimping is smaller than in the case where terminals other than both ends are crimped in several steps, and the efficiency of the manufacturing process of the liquid crystal display device is improved.

In particular, the length of the crimping head provided between the crimping heads provided at both ends of the terminal area to be connected is the length of the terminal area excluding the both ends. Is desirable.

For example, as a method of crimping the terminals except for the both ends of the terminal area to be connected, there is a method of crimping by controlling a plurality of crimping heads to move simultaneously. If crimping is performed with a crimping head having the length of the area of the contacted terminal, the number of crimping heads to be controlled can be reduced, and the crimping process can be easily controlled since only one crimping head needs to be controlled.

A liquid crystal display device according to the present invention comprises: a liquid crystal panel;
A liquid crystal display device comprising a substrate on which a semiconductor element is mounted, wherein a terminal disposed on the liquid crystal panel and a semiconductor element side terminal disposed on the substrate include the terminal and the semiconductor. It is characterized by being sequentially crimped and connected by a crimping head having a crimping surface having a predetermined length smaller than the length of the region of the element side terminal.

In this case, it is preferable that the terminals and the semiconductor element side terminals are arranged in blocks, and a gap is provided between the blocks.

Such a liquid crystal display device has a smaller amount of misalignment between terminals than a conventional liquid crystal display device formed by crimping the terminals of a terminal region wired on a substrate at one time. The corresponding terminals are accurately and reliably connected to each other, and no connection failure occurs, so that the yield is improved.

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a crimping apparatus 10 to which a first embodiment of the present invention is applied.

The crimping device 10 is a device for manufacturing a liquid crystal display device 20 by connecting a substrate 22 to a liquid crystal panel 21 via an anisotropic conductive adhesive 23.
A table 11 on which the glass substrate 21A is disposed, a pedestal 12 disposed adjacent to the table 11, and an opposing upper part of the pedestal 12 configured to be vertically movable toward the pedestal 12. And a pressure bonding head 13.

Here, the table 11 is formed so as to be able to advance and retreat horizontally along the longitudinal direction of the receiving table 12.

Liquid crystal panel 2 arranged on table 11
Six semiconductor elements (hereinafter, referred to as ICs) 22B are arranged on the substrate 22 at an end of one glass substrate 21A, that is, a portion located on the receiving table 12.

More specifically, as shown in FIG. 2, the terminal 21B wired to the glass substrate 21A is
IC side terminal 22C disposed on the substrate 22 connected to
(The wiring on the substrate other than the terminal area connected to the liquid crystal panel is omitted), but is temporarily fixed via a continuous tape-shaped anisotropic conductive adhesive 23.

The crimping head 13 is formed to have a predetermined length L2 smaller than the length L1 of the portion where the terminals 21B provided on the glass substrate 21A are provided, that is, the terminal region 121 to be connected in this embodiment. It has a crimped surface.

Further, the pressure bonding head 13 has a built-in heater (not shown) for heating the pressure bonding head 13 to a predetermined temperature.

The terminal 21B and the IC side terminal 22C
Are arranged in blocks corresponding to the lengths that fit within the length L2 of the pressure bonding head 13, and a gap 22D (length L4) is provided between the blocks.

The length L2 of the crimping head 13 is larger than the length L3 of each block, and the crimping head 13 is designed to prevent both ends of the substrate 22 from extending outward due to the heat of the crimping head 13 during crimping. Is considered in consideration of the heat region, and is 40 mm in the present embodiment. The dimension L2
Is preferably larger than the dimension L3 by about 0.5 to 4.0 mm.

At this time, the dimension L4 of the gap 22D is larger than the distance L5 between the terminals (generally, about 0.15 to 0.3 mm), specifically, about 1 to 2 mm.

In this embodiment, both the terminal 21B and the IC terminal 22C are divided into blocks for each IC 22B. That is, each block to be crimped has an IC connected to an IC 22B adjacent to the corresponding IC 22B.
The side terminal 22C is not included.

Next, a method of manufacturing the liquid crystal display device 20 using such a pressure bonding device 10 will be described.

First, the glass substrate 21A is placed on the table 11, and the glass substrate 21A is placed thereon via the anisotropic conductive adhesive 23.
Is temporarily fixed, and then brought to the pressure bonding head 13 side.

Then, as shown in FIG. 3, the terminal 21B and the IC-side terminal 22C are successively crimped inward from both ends in a terminal area 121 (length L1) for each block.

More specifically, the table 11 is horizontally advanced and retracted along the longitudinal direction of the receiving table 12, and the crimping head 13 is moved up and down to crimp the terminal 21B and the IC side terminal 22C in the order of ~ for each block. I will do it.

After the crimping, the table 11 is connected to the crimping device 10.
, And the next table 11 is arranged in the crimping device 10.

The steps described above are repeated, and the steps of manufacturing the liquid crystal display device 20 are sequentially performed.

In this manner, the terminal 21B wired to the glass substrate 21A of the liquid crystal panel 21 arranged in a block, and the IC side terminal 2 connected to the terminal 21B
2C are sequentially pressed by a pressure bonding head 13 having a pressure bonding surface formed to have a predetermined length L2, and a liquid crystal display device 20 having a gap 22D provided between blocks is manufactured.

According to this embodiment, the following effects can be obtained.

The glass substrate 21A is formed by using a crimping head 13 having a crimping surface formed to have a predetermined length L2 smaller than the length L1 of the terminal region 121 disposed and connected to the glass substrate 21A and the substrate 22. And an IC-side terminal 22 connected to the terminal 21B.
C, the heat area of the crimping head 13 in the terminal area 121 can be made smaller in the terminal area 121 compared to the conventional one at the time of one crimping, so that the IC side of the substrate 22 on which the IC side terminals 22C are arranged is correspondingly reduced. The length that both ends of the terminal region extend outward can be reduced.

For this reason, for example, the terminals 21B, 21B,
22C can be reduced in the amount of displacement, and the corresponding terminal 2
1B and 22C can be accurately and reliably connected to each other, and occurrence of a connection failure can be prevented.

Using the crimping head 13, the terminals 21B,
22C are sequentially crimped inward from both ends in the terminal area 121 to which they are connected, so that when crimping the inside of the terminal area 121 to be connected, both ends of the terminal area 121 already connected are crimped. Are fixed, and the amount of displacement due to thermal extension can be reduced. This makes it possible to further reduce the amount of displacement between the terminals 21B and 22C in each portion, and to connect the corresponding terminals 21B and 22C more accurately and reliably.

The terminal 21B and the IC side terminal 22C are
The crimping head 13 is block-arranged for each length within the length L2 of the crimping head 13, and is provided with a gap 22D between the blocks to be sequentially crimped for each block. Compared to the case where the terminals 21B are uniformly arranged at equal intervals in the terminal region 121,
The area to be crimped at a time by the crimping head 13 can be clearly divided, and the work of positioning the crimping head 13 with respect to the area to be crimped can be easily performed, so that the crimping of the terminals 21B and 22C of each block is performed. Can be simplified, and the efficiency of the crimping operation can be improved.

Since both the terminal 21B and the IC terminal 22C are blocked for each IC 22B, the IC 2
Inspection and connection confirmation of the terminals 21B and 22C can be easily performed every 2B.

Since the length L3 of each block is 40 mm or less, the heat of the crimping head 13 causes the IC side terminals 2
Since both ends of the IC-side terminal area on the substrate 22 on which the 2C is disposed hardly extend, there is almost no positional deviation between the terminals 21B and 22C, and the corresponding terminals 21B and 22C correspond accordingly.
C can be accurately and reliably press-bonded to each other, and occurrence of connection failure can be prevented.

The liquid crystal display device 20 has a smaller displacement amount between the terminals 21B and 22C than a conventional liquid crystal display device formed by crimping the terminals of the terminal area wired on the substrate at one time. The corresponding terminals 21B and 22C can be accurately and reliably connected to each other, and there is no connection failure, so that the yield can be improved.

FIG. 4 is a schematic configuration diagram of a crimping apparatus 10 to which the second embodiment of the present invention is applied.

The same or corresponding components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted or simplified.

In this embodiment, the crimping heads 13 of the first embodiment are provided corresponding to both ends of the terminal region 121, and both ends are removed between the crimping heads 13 provided at both ends. The difference from the first embodiment is that a crimping head 131 corresponding to the terminal area 121A is provided. That is, three types of the crimping head 13 having the dimension L2 corresponding to the dimension L3 of the terminals 21B and 22C in the blocks at both ends of the terminal area 121 and the crimping head 131 having the dimension L7 corresponding to the dimension L6 of the terminal area 121A. It has a crimping head.

More specifically, the length L2 of the pressure bonding head 13
Is larger than the size L3 of the blocks at both ends, and the length L7 of the crimp head 131 is larger than the size L6 of the terminal area 121A.

Here, the dimension L2 is larger than the dimension L3 by 0.5.
大 き い 4.0 mm is preferable, and the dimension L
7 is preferably larger than the dimension L6 by about 0.5 to 4.0 mm.

Next, a method of manufacturing the liquid crystal display device 20 using such a pressure bonding device 10 will be described.

First, the glass substrate 21 A is placed on the table 11, and the substrate 22 is placed on the glass substrate 21 A via the anisotropic conductive adhesive 23.
Is temporarily fixed, and then brought to the crimping heads 13 and 131 side. Then, as shown in FIG.
After crimping the terminal 21B and the IC-side terminal 22C at both ends in the crimp head 21 with the crimping head 13, the terminal area 121 to be connected is connected.
The terminals 21B and 22C other than both ends of the crimping head 1
Crimping with 31. That is, pressure bonding is performed in the order shown in FIG.

After crimping, the table 11 is attached to the crimping device 10
, And the next table 11 is arranged in the crimping device 10.

The steps described above are repeated, and the steps of manufacturing the liquid crystal display device 20 are sequentially performed.

According to this embodiment, the same effects as those of the above-described embodiments can be obtained, and the following effects can be obtained.

After crimping the terminals 21B and the IC-side terminals 22C at both ends 121 in the terminal region L1 to be connected first by using the crimping head 13, the terminal region 121A left in the terminal region L1 to be connected. Terminal 2 other than both ends
1B and 22C are simultaneously crimped together by the crimping head 131, so that even if the terminals 21B and 22C other than both ends, which are the terminal regions 121A left in the connected terminal region L1, are crimped together, Since both ends are crimped and fixed, the amount of displacement between the terminals 21B and 22C due to thermal expansion can be reduced.

Furthermore, after the terminals 21B and 22C at both ends are crimped together, the terminals 21B and 22C other than both ends are simultaneously crimped together with the crimping head 131 so that the crimping can be performed twice. Terminal 21 other than both ends
B, 22C are divided into several times and compared with the case of crimping,
The number of times of pressure bonding is reduced, and the efficiency of the manufacturing process of the liquid crystal display device 20 can be improved.

The terminals 21B and 22 in the portions excluding both ends
As a method of crimping C together, there is a method of crimping by controlling a plurality of crimping heads to move simultaneously, but in the present embodiment, in the present embodiment, the terminal region 121A of the terminal region 121A excluding both ends in the terminal region L1 to be connected is connected. Dimension L7 corresponding to length dimension L6
Since the crimping is performed by the crimping head 131 having the pressure bonding, the number of crimping heads to be controlled can be reduced, and the control of the crimping process can be easily performed since only one crimping head 131 needs to be controlled.

The crimping heads 13 are provided in the terminal regions 121 at both ends in the terminal region L1 to be connected.
By providing the crimping heads 131 between the crimping heads 13 provided at both ends, the crimping can be performed only by moving the crimping heads 13 and 131 up and down without moving the table 11 horizontally. The time for the pressure bonding step can be shortened by the amount that the table 11 is not moved.

It should be noted that the present invention is not limited to the above-described embodiment, but includes other configurations that can achieve the object of the present invention, and the following modifications are also included in the present invention.

For example, in the second embodiment, the terminals 21B and 22C in the portion excluding the terminal region 121 which is both ends in the terminal region L1 to be connected have the length of the terminal region 121A excluding the both ends. The crimping is performed by the crimping head 131 having the dimension L7 corresponding to the dimension L6, and in the first embodiment, the table 11 is moved and the crimping is performed by the single crimping head 13. However, the present invention is not limited thereto. As shown in FIG. 5, a plurality of crimping heads 13A to 13F having the same length dimension L2 as the crimping head 13 may be provided for each block to be crimped and crimped.

At this time, as a method of pressure bonding, the first method is used.
As in the embodiment, the crimping may be performed from one end of both ends alternately left and right in a front view. Alternatively, the crimping may be performed by, for example, crimping heads 13A and 13F, and then crimping heads 13B and 13B. Crimping with 13E, and further crimping head 13C,
Left and right crimping may be performed at the same time so as to perform crimping at 13D, or a plurality of crimping heads 13B other than the crimping heads 13A and 13F for crimping both ends as in the second embodiment.
13E may be controlled so as to be simultaneously moved and then crimped.

In the second embodiment, the crimping heads 13 are provided and crimped on the terminal regions 121 at both ends in the terminal region L1 to be connected. However, the present invention is not limited to this. May be provided only at one end.
That is, the crimping head 13 and the crimping head 131 are provided one by one, and first, one end of both ends is crimped by the crimping head 13, and the table 11 is horizontally moved along the longitudinal direction of the receiving table 12. The terminal 21B and 22C of the terminal area 121A excluding both ends may be crimped by the crimping head 131 by moving the table 11 and moving the table 11 back and forth.

The length L3 of each block is not limited to 40 mm or less, but may be 40 mm or more. That is, both ends of the substrate 22 on which the IC-side terminals 22C are disposed extend due to the heat of the crimping head 13, so that the terminals 21B and the terminals 21B and 22C of the IC-side terminals 22C have little displacement between the terminals 21B and 22C. The length may be appropriately determined in consideration of the length L1 of the terminal region 121 and the heat of the crimping head 13, and may be, for example, approximately 50 mm or less.

Further, in the above embodiment, the terminal 21B and the IC terminal 22C are divided into blocks for each IC 22B. However, the present invention is not limited to this. The terminals 21B and 22C wired from one IC 22B may be divided into a plurality of blocks. However, when the terminal 21B and the IC side terminal 22C which are blocked are blocked for each IC 22B,
This is preferable in that inspection and connection confirmation of the terminals 21B and 22C can be easily performed for each IC 22B.

In the first embodiment, the terminal 21B
The IC-side terminals 22C are arranged in blocks corresponding to the length L2 of the crimping head 13, and the gaps 22D are provided between the blocks. However, the present invention is not limited to this. Terminal area 121 to be connected
The terminals 21 </ b> B may be uniformly arranged at equal intervals and may not be blocked. Further, terminals (for example, dummy terminals and GND terminals) provided from other than the IC 22B may exist while being blocked for each semiconductor element, and are provided on the substrate 22 or the liquid crystal panel 21. Only one of the terminals may be blocked. However, in this case, the terminal arrangement is visually (different in arrangement pitch, terminal width, terminal length) and is recognized for each semiconductor element by a recognition mark or the like. Any condition can be used as long as it can be classified or confirmed, and it is possible to clearly divide the area that is crimped at once by the crimping head 13 when the block is formed and the gap 22D is provided between the blocks. Since the positioning operation of the crimping head 13 with respect to the region to be crimped can be easily performed, the crimping between the terminals 21B and 22C of each block can be easily performed, and the crimping can be performed. It preferred in that it can improve the efficiency of work. In particular, as shown in the second embodiment and FIG. 5, the plurality of pressure bonding heads 13, 131, 13A to
When 13F is used, each of the crimping heads 13, 131, 13A-
13F can be arranged apart from each other by a predetermined dimension, so that the pressure bonding heads 13, 131, 13A to 13F
The area to be crimped at one time can be clearly divided, and the crimping heads 13, 13 for the area to be crimped
1, 13A to 13F can also be easily positioned, which is preferable in that the crimping between the terminals 21B and 22C of each block can be easily performed and the efficiency of the crimping operation can be improved.

As described above, the dimension L4 of the gap 22D including the case where the gap 22D is provided and the case where the gap 22D is not provided may be about 0 to 5 mm.
Preferably, it is about 1 to 2 mm.

Further, in the above embodiment, the terminal 21B
And the IC side terminal 22C are sequentially crimped inward from both ends in the terminal region 121 to be connected. However, the present invention is not limited to this. For example, crimping may be performed sequentially from inside to both ends. . However, when the terminals 21B and 22C are sequentially crimped inward from both ends in the terminal region 121, both ends of the already connected terminal region 121 are fixed when the inside of the terminal region 121 is crimped. Since the amount of misalignment due to thermal elongation can be reduced, the amount of misalignment between the terminals 21B and 22C in each portion can be reduced, and the corresponding terminals 21B and 22C can be more accurately and reliably connected. preferable.

Further, in the above-described embodiment, the terminal regions provided on the liquid crystal panel and the substrate and the terminal regions to which the terminals are connected are equally set to facilitate the description of the present invention. The present invention is not limited thereto, and the arrangement of the terminals of the liquid crystal panel and the substrate may be such that terminals used for other purposes such as connection of other substrates are arranged in addition to the terminal area to which the terminals according to the present invention are connected. It is sufficient that the terminal region connected to the terminal is included in the terminal region provided on the liquid crystal panel and the substrate.

In the above embodiment, the liquid crystal panel 21
The substrate 22 is connected to the substrate 22. Examples of the substrate include a printed substrate, a glass epoxy substrate, an FPC (flexible substrate), a TCP, and a COP (Chip On Pla).
sticks) may be connected.

Further, in the first embodiment, the table 11 is horizontally moved along the longitudinal direction of the receiving table 12 and pressed, but the present invention is not limited to this.
May be fixed, and the pressure bonding head 13 may be moved up, down, left and right to perform pressure bonding.

In the above embodiment, the pressure bonding head 13
Is longer than the length L3 of each block, but the length L2 of the pressure bonding head 13 may be substantially the same as the length L3 of each block. .

Similarly, in the second embodiment, the length L7 of the crimping head 131 is equal to the length L of the terminal region 121A.
However, the length L7 of the crimping head 131 may be substantially the same as the length L6 of the terminal area 121A.

Further, in the above-described embodiment, the continuous tape-shaped anisotropic conductive adhesive 23 is used. However, the present invention is not limited to this. Alternatively, an anisotropic conductive adhesive divided for each block may be used.

[0083]

As described above, according to the method of manufacturing a liquid crystal display device and the liquid crystal display device of the present invention, the liquid crystal display device is formed to have a predetermined length smaller than the length of the region of the terminal wired on the substrate. Using a crimping head having a crimped surface, the terminal wired to the substrate and the semiconductor element side terminal connected to the terminal are sequentially crimped, so that the length of the area of the terminal wired to the substrate It is possible to reduce the amount of displacement when crimping the terminals of the liquid crystal panel and the semiconductor element with long dimensions,
There is an effect that the corresponding terminals can be connected accurately and reliably.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a crimping device to which a first embodiment of the present invention is applied.

FIG. 2 is a schematic cross-sectional view showing a crimped portion between a terminal to which the first embodiment of the present invention is applied and a semiconductor element side terminal.

FIG. 3 is a schematic cross-sectional view illustrating a method of crimping a terminal and a semiconductor element side terminal to which the first embodiment of the present invention is applied.

FIG. 4 is a schematic cross-sectional view showing a crimped portion between a terminal to which a second embodiment of the present invention is applied and a semiconductor element side terminal.

FIG. 5 is a schematic cross-sectional view showing a modified example of the present invention and showing a crimping apparatus including a plurality of crimping heads.

[Explanation of symbols]

 13, 131, 13A to 13F Crimping head 20 Liquid crystal display device 21 Liquid crystal panel 21A Glass substrate 21B Terminal 22B Semiconductor element (IC) 22C Semiconductor element (IC) side terminal 22D Gap 121, 121A Terminal area

Claims (9)

[Claims] 1. A liquid crystal display device comprising a liquid crystal panel and a substrate on which a semiconductor element is mounted, wherein a terminal disposed on the liquid crystal panel is connected to a semiconductor element side terminal disposed on the substrate. The method of manufacturing, using a crimping head having a crimping surface of a predetermined length dimension smaller than the length dimension of the region of the terminal and the semiconductor element side terminal, sequentially the terminal and the semiconductor element side terminal A method for manufacturing a liquid crystal display device, comprising crimping. 2. The method for manufacturing a liquid crystal display device according to claim 1, wherein a terminal provided on the liquid crystal panel and a semiconductor element side terminal provided on the substrate are connected using the pressure bonding head. A method of manufacturing the liquid crystal display device, wherein pressure bonding is sequentially performed inward from both ends in the terminal region. 3. The method for manufacturing a liquid crystal display device according to claim 1, wherein at least one of the terminal and the semiconductor element side terminal is divided into blocks each having a length within the length of the crimping head. And a gap is provided between the blocks, and the terminal and the semiconductor element side terminal are sequentially crimped for each of the blocks using the crimping head. Device manufacturing method. 4. The method for manufacturing a liquid crystal display device according to claim 3, wherein a plurality of the semiconductor elements are mounted on the substrate, and the plurality of the terminals and the semiconductor element side terminals are divided. A method for manufacturing a liquid crystal display device, wherein at least one of the semiconductor devices is blocked for each semiconductor element. 5. The method for manufacturing a liquid crystal display device according to claim 3, wherein the length dimension of each block is 4
A method for manufacturing a liquid crystal display device, which is not more than 0 mm. 6. The method for manufacturing a liquid crystal display device according to claim 1, wherein a terminal provided on the liquid crystal panel and a semiconductor element side terminal provided on the substrate are connected using the pressure bonding head. After crimping both ends in the terminal area to be
A method for manufacturing a liquid crystal display device, comprising simultaneously crimping terminals other than both ends in the terminal region to be connected. 7. The method for manufacturing a liquid crystal display device according to claim 6, wherein a length dimension of the crimping head provided between the crimping heads provided at the both end portions is equal to or smaller than the length of the crimping head in the connected terminal region. A method for manufacturing a liquid crystal display device, characterized in that the terminal region has a length dimension excluding both end portions. 8. A liquid crystal display device comprising a liquid crystal panel and a substrate on which a semiconductor element is mounted, wherein a terminal provided on the liquid crystal panel, and a semiconductor element side terminal provided on the substrate. The liquid crystal display device, wherein the terminals are sequentially crimped and connected by a crimping head having a crimping surface having a predetermined length dimension smaller than the length dimension of the region of the terminal and the semiconductor element side terminal. 9. The liquid crystal display device according to claim 8, wherein the terminal and the semiconductor element side terminal are arranged in a block, and a gap is provided between the blocks. Liquid crystal display device.