JP2003069178A - Apparatus and method for connection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an edge of a plate-like component and a stage from interfering each other in an apparatus for connecting to connect a film-like component to the plate-like component. SOLUTION: The apparatus for connection comprises a plurality of upper side heads 11A to 11C each having a tool 11a at a lower end, and lower side heads 12A to 12C each having a stage 12a at an upper end. When the plurality of the heads 12A to 12C are simultaneously raised by a lower side driver 17B, only the stage 12a of each of the heads 12A to 12C provided at a protruding position by a lower side head selecting unit 55B is brought into contact with a lower surface of the plate-like component 9. When the plurality of the heads 11A to 11C are simultaneously lowered by an upper side driver 17A, only a tool 11a of each of the heads 11A to 11C provided at a protruding position of an upper side head selecting unit 55A is brought into contact with a film-like component 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention sequentially presses a plurality of film-shaped components such as flexible printed circuit boards, which are arranged in advance along side portions of a plate-shaped component such as a plasma display panel, against the plate-shaped component. TECHNICAL FIELD The present invention relates to a joining device and a method for joining by joining.

[0002]

2. Description of the Related Art A flexible printed circuit board (FPC board) having a driving circuit and the like is joined to an electrode portion provided along a side portion of a plasma display panel (PDP panel) as follows. To be done.

First, an anisotropic conductive tape (ACF tape) is attached to the electrode portion of the PDP panel. Then F
The electrode portion of the PC substrate is positioned with respect to the electrode portion of the PDP panel, and the FPC substrate is pressure-bonded to the PDP substrate with a predetermined pressing force (temporary pressure bonding). Multiple FPC boards are PD
Temporarily pressure-bonded to the electrode portion of the P panel, and when the temporary pressure bonding is completed, a plurality of FPCs are arranged along the electrode portion of the PDP panel.
The boards are lined up. Finally, the FPC board is pressure bonded to the PDP board with a larger pressing force than in the temporary pressure bonding (main pressure bonding).

FIG. 6 shows an example of a joining device for performing the above-mentioned main pressure bonding. This joining device includes an upper head 2 having a tool 1 at its lower end and a lower head 4 having a stage 3 at its upper end. The upper head 2 and the lower head 4 are moved up and down by drive mechanisms 5 and 6 each including a servo motor or the like. When the PDP panel 9 to which the plurality of FPC boards 8 have been preliminarily pressure-bonded is supplied to the joining device by a transport mechanism (not shown), first, the lower head 4 is raised and the lower surface side of the PDP panel 9 is supported by the stage 3. Next, the upper head 2 descends and the tool 1 presses the FPC board 8 against the PDP panel 9, and the electrode portion of the FPC board 8 is bonded (mainly pressure bonded) to the electrode portion of the PDP panel 9.

In the joining apparatus of FIG. 6, the widths W1 and W2 of the tool 1 and the stage 3 (dimensions in the direction in which the electrode portions of the FPC board 8 and the PDP panel 9 extend) are two FPCs.
It is set so that the substrates 8 can be bonded simultaneously. Therefore, as shown by the arrow A in FIG. 7, the tool 1 and the stage 3 are arranged such that every two electrode portions 8 of the FPC board 8 are arranged from one end side (the left end side in this example) of the electrode portion 9a of the PDP panel 9.
Join a.

[0006]

However, the above-mentioned conventional joining device has the following problems. First, PDP panel 9
If the number of FPC boards 8 bonded to one of the electrode portions 9a is odd, as shown in FIGS. 7 and 8, the other end side (the right end side in this example) of the electrode portion 9a of the PDP panel 9 is In the vicinity, one FPC board 8 is bonded to the electrode portion 9a by the tool 1 and the stage 3. Stage 3 at this time
Extends beyond the right end in the figure of the PDP panel 9, the edge 9b on the right end side of the PDP panel 9 interferes with the stage 3. If there is this interference, the edge 9b may be damaged or broken due to stress concentration during pressurization.

In addition, as described above, when the widths W1 and W2 of the tool 1 and the stage 3 correspond to the two FPC boards 8, that is, the pair of tools 1 and the stage 3 has two FPC boards.
When the PC boards 8 are pressed together at the same time, it is necessary to adjust the parallelism between the tool 1 and the stage 3 with high accuracy, which makes adjustment and management difficult.

Further, the PDP to be joined by the joining device
When changing the types, dimensions, etc. of the panel 9 and the FPC board 8, it is necessary to replace the tool 1 and the stage 3, and the work is very complicated.

Therefore, the present invention is to prevent interference between the edge of the plate-shaped component and the stage in the bonding apparatus for bonding the film-shaped component such as the FPC board to the plate-shaped component such as the PDP panel, and the tool and the stage. It is an object to facilitate adjustment and management of parallelism and to eliminate or reduce the frequency of exchanging tools and stages when changing types and dimensions of plate-shaped parts and film-shaped parts.

[0010]

SUMMARY OF THE INVENTION A first aspect of the present invention is to join a plurality of film-like components arranged in advance along one side of the plate-like component by sequentially pressing and joining them to the plate-like component. An apparatus, comprising a plurality of upper heads each having a tool for pressing the film-shaped component against the plate-shaped component at a lower end thereof, an upper drive unit that simultaneously elevates and lowers the plurality of upper heads, and the upper head unit. An upper head selecting portion provided for each upper head portion, which is movable to a projecting position and a retracted position, and a stage for supporting the lower surface side of the plate-like component at the upper end, and each of the upper side A plurality of lower heads provided to face the heads, a lower drive section for simultaneously raising and lowering the plurality of lower heads, and a plurality of lower heads that can move the lower heads to a projecting position and a retracted position. For each lower head A lower head selector provided, and when the lower drive unit raises the plurality of lower heads, only the stage of the lower head set to the projecting position by the lower head selector is a plate. When the upper drive unit lowers the plurality of upper heads, only the tool of the upper head set to the projecting position by the upper head selection unit contacts the film-shaped component. Provide a joining device.

A plurality of upper heads each provided with a tool are simultaneously moved up and down by an upper drive unit, and a plurality of lower heads each provided with a stage are simultaneously moved up and down by a lower drive unit. Therefore, a plurality of film-shaped components can be simultaneously pressed and joined to the plate-shaped component by a plurality of pairs of tools and stages. Further, only the stage of the lower head set to the projecting position by the lower head selecting unit abuts the lower surface side of the plate-like component when the lower head is raised, and the upper head set to the projecting position by the upper head selecting unit. Only the tool on the head abuts the film-like part. Therefore, it is possible to select, from a plurality of pairs of tools and stages, one that presses the film-shaped component against the plate-shaped component. Therefore, when joining the film-shaped component to the plate-shaped component near the end of one side of the plate-shaped component, set the upper head and the lower head at positions corresponding to the ends of the plate-shaped component to the retracted position. As a result, it is possible to prevent the edge of the plate-shaped component from interfering with the stage.

The width of the tool and the width of the stage are 1
It is preferable to set so as to correspond to the width of each film-shaped component. In this case, since the parallelism between the tool and the stage can be adjusted and managed for each one film-shaped component, the widths of the tool and the stage are set to correspond to two or more film-shaped components. It is easier to adjust and manage the parallelism between the tool and the stage as compared with the case.

There are at least two widths of the above tools,
In addition, it is preferable that the stage has at least two widths. In this case, it is preferable to set the widths of the tool and the stage according to the dimensions and types of various plate-shaped components and film-shaped components. As a result, it is not necessary to replace the tool or the stage when changing the plate-shaped component or the film-shaped component to be joined, or the frequency thereof is reduced.

The plate-shaped component and the film-shaped component in the present invention are not particularly limited. For example, the plate-shaped component is a plasma display panel and the film-shaped component is a flexible printed circuit board.

A second aspect of the present invention is a joining method for joining a plurality of film-like components arranged in advance along one side of the plate-like component by sequentially pressing them against the plate-like component. With a plurality of pairs of tools and stages corresponding to one film-like component, the film-like components are pressed against and joined to the plate-like component for each plurality, and the film-like components are joined near one end of one side of the plate-like component. Provided is a joining method for holding a tool and a stage corresponding to an end of one side of the plate-shaped component in a state of being separated from each other when the film-shaped component is pressed against the plate-shaped component.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail based on the embodiments shown in the drawings. 1 and 2 show a joining device according to an embodiment of the present invention. This joining device includes a plurality of (three) upper heads 11A, 11B and 11C arranged in a horizontal direction, and a plurality (three) lower heads 12A and 12B also arranged in a horizontal direction. , 12
It has C and. The lower heads 12A to 12C are provided to face the upper heads 11A to 11C in the vertical direction. That is, this joining device includes a plurality of pairs (three pairs) of the upper heads 11A to 11C and the lower heads 12A to 12C.

The frame 13 of the joining device has an upper drive mechanism (upper drive unit) 15A for driving the upper heads 11A to 11C and a lower drive mechanism (lower side) for driving the lower heads 12A to 12C. And a drive unit) 15B. First, the upper drive mechanism 15A will be described. A motor 17A is fixed to an upper portion of a frame 13 extending in the horizontal direction, and a rotation shaft of the motor 17A is connected to a ball screw 19A extending in the horizontal direction.
In this embodiment, a servo motor is used as the motor 17A in order to enable highly accurate rotation control and high load. Ball nut portion 21 that engages with the ball screw 19A
A is a wedge block 23A that is triangular when viewed from the side.
Are connected. The sliders 25A and 26A fixed to the ball nut portion 21A and the wedge block 23A are
It is movably mounted on a common guide rail 27A extending in the horizontal direction. This slider 25A, 26A
As the guide rail 27A, for example, a cross roller guide can be adopted.

The front surface of the wedge block 23A is an inclined surface inclined at a predetermined angle (about 20 degrees in this embodiment) with respect to the horizontal direction. A guide rail 29A is fixed to this inclined surface. The upper side of the common block 33A is fixed to the slider 31A which is movable on the guide rail 29A.

On the other hand, on the lower surface side of the common block 33A,
Three lifting units 35A, 35B, 35C are provided corresponding to the upper heads 11A to 11C, respectively. Each elevating part 35A to 35C includes a first block 39A and a first block 39A.
The second block 41A fixed to the block 39A is provided. The upper end of the first block 39A is the common block 3
It is fixed to the lower surface of 3A. In addition, the second block 41
The sliders 43A and 45A fixed to the back side of A are movable on a guide rail 47A extending in the vertical direction.

When the ball screw 19A is rotationally driven by the motor 17A, the wedge block 23A moves in the front-rear direction together with the ball nut portion 21A as indicated by an arrow B in FIG. 1 depending on the rotational direction. Further, when the wedge block 23A moves back and forth, as shown by an arrow C in FIG. 1, the three elevating portions 35A to 35C integrally move up and down together with the common block 33A.

The first block 3 of each elevating part 35A to 35C
A bracket 49A is attached to 9A so as to be able to move up and down. Specifically, a guide rail 51A extending in the vertical direction is fixed to the front surface of the first block 39A, and a slider 52A movable on the guide rail 51A.
A bracket 49A is fixed to 53A. Further, the tube 55a of the cylinder 55A is attached to the first block 39A of each of the elevating units 35A to 35C via the pedestal 54.
Is fixed. Cylinder 5 extending vertically downward
The tip of the rod 55b of 5A is connected to the bracket 49A. Therefore, when the rod 55b moves back and forth, the bracket 49A accordingly moves up and down the corresponding lifting portions 35A to 35A.
Move up and down with respect to C. A stopper 57A for restricting the lowering of the bracket 49A is provided at the lower end of the second block 41A.
Is provided. Cylinder 55A and bracket 49
A constitutes the upper head selecting section in the present invention.

Upper heads 11A to 11C are mounted on the lower surface side of the bracket 49A via a spherical bearing 59 having a vacuum and air lock mechanism. The upper heads 11A to 11C include a tool 11a for pressing the FPC board 8 against the PDP panel 9, and the tool 11a.
and a tool holder 11b for holding a. A heater 61 for heating the tool 11a is attached to the tool holder 11b.

The lower drive mechanism 15B has a structure in which the upper drive mechanism 15A is turned upside down. That is, the motor 1
When the ball screw 19B is rotationally driven by 7B, the wedge block 23B moves in the front-rear direction together with the ball nut portion 21B as indicated by an arrow B according to the rotational direction. Further, when the wedge block 23B moves back and forth, it becomes integral with the common block 33B as indicated by an arrow C.
The individual lifting units 37A, 37B, 37C simultaneously move up and down.
Further, when the rod 55b of the cylinder 55B advances and retracts,
Along with that, the lifting portion 35A corresponding to the bracket 49B
Go up and down with respect to ~ 35C. The cylinder 55B is directly fixed to the bracket 49B without a pedestal.

The lower heads 12A to 12C provided on the upper end of the bracket 49B are provided with a stage 12a for supporting the lower surface side of the PDP panel 8 and a stage holder 12b for holding the stage 12a. Also,
The cylinder 55A and the bracket 49A constitute the lower head selecting section in the present invention. Lower drive mechanism 15B
Since the other structures are similar to those of the upper drive mechanism 15A, the same reference numerals are given to the same elements and the description thereof will be omitted.

The controller 67 schematically shown in FIG.
Based on inputs from various sensors (not shown) and commands from the operation panel, the motors 17A, 17B, the cylinders 55A, 5
5B, the heater 61, and the operation of elements such as the pump 63 are controlled.

As shown in FIG. 2, three upper heads 11 are provided.
The width W1 of the tool 11a provided at the lower end of A to 11B
(FPC board 8 to be joined and electrode portion 8 of PDP panel 9
a) and 9a are the same in the two upper heads 11B and 11C on the right side in the figure, but one upper head 11A on the left side in the figure is longer than the upper heads 11B and 11C. It is set. In particular,
The width W1 of the tool 11a of the upper heads 11B and 11C is
The width is set to correspond to the width of one FPC board having a relatively narrow width attached to the 42-inch size PDP board. On the other hand, the width W1 of the tool 11a of the upper head 11A is set to correspond to the width of one FPC board having a relatively wide width, which is attached to the 50-inch size PDP board. The width W2 of the stage 12a of the lower heads 12A to 12C is set corresponding to the setting of the width W1 of each of the upper heads 11A to 11B. That is, FIG.
The width W2 of the stage 12a of the two lower heads 12B and 12C on the right side is set in correspondence with the width of one FPC board having a relatively narrow width which is attached to the 42-inch size PDP board. The width W2 of the stage 12a of one lower head 12A is set to correspond to the width of one FPC board having a relatively wide width, which is attached to a 50-inch size PDP board.

Next, a method for permanently press-bonding the FPC board 8 to the PDP panel 9 using the above-mentioned joining device will be described. Electrode portion 9 provided along the side portion of PDP panel 9
The PDP panel 9 and the FPC board 8 are supplied to the bonding apparatus in a state in which the plurality of FPC boards 8 have been temporarily pressure-bonded along the line a (see FIG. 4). Explaining the steps up to this temporary pressure bonding, first, an anisotropic conductive tape (ACF tape) is attached to the electrode portion 9a of the PDP panel 9. Instead of this ACF tape, an anisotropic conductive paste (ACP) may be applied to the electrode portion 9a. Next, PD
The electrode portion 8a of the FPC board 8 is positioned with respect to the electrode portion 9a of the P panel 9 and pressure-bonded with a predetermined pressing force. The PDP substrate 9 in which the plurality of FPC substrates 8 are temporarily pressure-bonded to the electrode portion 9a is transported by a transport device (not shown). For example, as shown in FIG. It is held by a holding device 65 that holds by suction.

The case where the PDP panel 9 has a size of 42 inches will be described. As shown in FIG. 3A, the tool 11a of the upper head 11A having a large width W1 has the rod 55a of the corresponding cylinder 55A at the retracted position. The tool 1 of the remaining upper heads 11B and 11C
It is arranged above 1a. That is, the tool 11a of the upper head 11A is set to the retracted position, and the tool 11a of the upper heads 11B and 11C is set to the protruding position. Correspondingly, the stage 12a of the lower head 12A having a large width W1 has a corresponding air cylinder 55.
By setting the rod 55a of B to the retracted position, it is arranged below the stage 12a of the remaining lower heads 12B and 12C. That is, the stage 12a of the lower head 12A is set to the retracted position, and the lower heads 12B, 1
The 2C stage 12a is set to the protruding position.

Next, as shown by the arrow A in FIG.
Two upper heads 11B and 11C tools 11a and 2
Two FPC boards 8 are bonded by the lower heads 12B and 12C of the respective heads 12B. Specifically, first, the motor 17B of the lower drive mechanism 12B rotates. This rotation is converted into the upward movement of the common block 33B through the rotation of the ball screw 19B and the horizontal movement of the wedge block 23B. By raising the common block 33b,
The lower heads 12A to 12C move up. As a result, the stage 12a of the lower heads 12B and 12C at the protruding position
Touches the lower surface side of the electrode portion 9a of the PDP panel 9. The lower surface side of the PDP panel 9 is supported by the stage 12a of the lower heads 12B and 12C. On the other hand, since the stage 12a of the lower head 12A is in the retracted position, the common block 33 moves up and the lower head 12A moves as described above.
Even if the stages 12a of B and 12C come into contact with the PDP panel 9, the state of being separated from the PDP panel 9 is maintained.

Next, the motor 17A of the upper drive mechanism 12A
Rotates. This rotation is converted into the descending motion of the common block 33A via the ball screw 19A and the wedge block 23A. The upper heads 11A to 11C descend due to the lowering of the common block 33A. As a result, the tool 11a of the upper heads 11B and 11C at the protruding position is
The electrode portion 8a of the C substrate 8 is pressed against the electrode portion 9a of the PDP panel 9. As schematically shown in FIG. 4, this pressing causes the electrode parts 8a and 9a of the FPC board 8 and the PDP panel 9 to be sandwiched between the tool 11a of the upper heads 11B and 11C and the tool 12a of the lower heads 12B and 12C. As a result, the electrode portions 8a and 9a are permanently pressure-bonded. On the other hand, since the tool 11a of the upper head 11A is in the retracted position, even if the common block 33A descends as described above,
The state of being separated from the PDP panel 9 is maintained.

As described above, in the joining apparatus of this embodiment, the upper heads 11A to 11C each including the tool 11a are provided.
Simultaneously move up and down, and the lower heads 12A to 12C each including the stage 12a also move up and down at the same time.
In addition, the upper heads 11A to 11C and the lower head 12A
12C can be set to the protruding position and the retracted position. Therefore, the desired upper heads 11A to 11C and the corresponding lower heads 12A to 12C are selected, and a plurality of pairs of tools 11a and stages 12a provided therein simultaneously press the plurality of FPC boards 8 against the PDP panel 9. Can be joined together.

If the number of FPC boards 8 bonded to the electrode portions 9a is odd, only one FPC board 8 is not P at the end (the right end in FIG. 4) of the PDP panel 9.
It will be joined to the DP panel 9. In this case, as shown in FIG. 3B, only one upper head 11B is set to the projecting position, and the remaining two upper heads 11A and 11C.
To the retracted position. Also, one lower head 12B
Only the protruding position and the remaining two lower heads 11A,
11C is set to the retracted position. Under this setting, when the common block 33B is raised and then the common block 33A is lowered, as shown schematically in FIG.
One FPC board 8 and one PDP panel 9 are sandwiched between the tool 11a and the stage 12a of the lower head 12B and bonded to each other. At this time, the end portion of the PDP panel 9 extends so as to project from the right end portion of the stage 12a of the lower head 12B in the drawing, and does not contact the stage 12a of the lower head 12C at the retracted position. Therefore, the end of the PDP panel 9 may have any lower head 12A.
~ 12C stage 12a also in the state that does not interfere, FP
The C substrate 8 can be joined.

As described above, in the bonding apparatus of this embodiment, P
When joining the FPC board 8 near the end of the DP panel 9, by setting the upper heads 11A to 11C and the lower heads 12A to 12C at positions corresponding to the end of the PDP panel 9 to the retracted position, Interference between the edge of the PDP panel 9 and the stage 12a can be prevented.

The widths W1 and W2 of the upper heads 11A to 11C and the lower heads 12A to 12C are respectively one FP.
Since the width is set corresponding to the width of the C substrate 8, the above-mentioned FIG.
The tool 1 and the stage 3 as in the conventional joining apparatus shown in FIG.
It is easier to adjust and manage the parallelism between the tool 11a and the stage 12a, as compared with the case where the width is set to correspond to the width of two or more FPC boards 8.

FP on the PDP panel 9 of 50 inch size
When the C substrate 8 is bonded, as shown in FIG. 5, only the upper head 11A provided with the tool 11a having a relatively wide width is set to the projecting position, and the remaining two upper heads 11B, 11B,
11C is set to the retracted position. Corresponding to this, the lower head 12A provided with a relatively wide stage 12a
Set only the protruding position and the remaining two lower heads 12
Set B and 12C to the retracted position. Then, the tool 11a of the upper head 11A and the stage 1 of the lower head 12A
The FPC board 8 may be pressed against the PDP panel 9 once by 2a.

Thus, in this embodiment, the upper head 1
Width W1 of tool 11a of 1A to 11C and lower head 1
Since the widths W2 of the stages 12a of 2A to 12C are two types, it is not necessary to replace the tools and stages even if the types and widths of the PDP panel 9 and the FPC board 8 are different.

The present invention is not limited to the above embodiment, but various modifications can be made. For example, the number of upper heads with tools and the number of lower heads with stages is
It may be two or four or more. Further, the types of the widths of the tools and the stages and the arrangement of the tools and the stages having different widths are not limited to those in the above embodiment. Furthermore, the present invention is not limited to bonding FPC substrates to PDP panels. Specifically, the plate-shaped component may be a liquid crystal display substrate (LCD substrate), an electroluminescence element (EL element), a normal printed board, or the like. Further, the film component may be, for example, a tape carrier package (TCP) or the like.

[0038]

As is apparent from the above description, the joining apparatus of the present invention is provided with the upper head selecting section together with the upper driving section for simultaneously moving the plural upper heads (tools), and the plural lower heads ( Since a lower drive unit for simultaneously moving the stage) and a lower head selection unit are provided, a plurality of film-shaped components (for example, flexible printed circuit boards) can be simultaneously converted into plate-shaped components (for example, plasma display panel) by a plurality of pairs of tools and stages. It is possible to select the one that can be bonded to the plate-shaped component and that presses the film-shaped component against the plate-shaped component from a plurality of pairs of tools and stages. Therefore, it is possible to prevent interference between the edge of the plate-shaped component and the stage when the film-shaped component is bonded to the plate-shaped component near the end of one side of the plate-shaped component.

Further, by setting the width of the tool and the stage so as to correspond to the width of one film-shaped part, it becomes easy to adjust and manage the parallelism between the tool and the stage.

Further, by setting the widths of the tool and the stage in correspondence with the dimensions and types of various plate-like parts and film-like parts, the types and sizes of the plate-like parts and film-like parts to be joined can be changed. It is not necessary to replace the tool or the stage (when changing models), or the frequency can be reduced.

[Brief description of drawings]

FIG. 1 is a right side view showing a joining device according to an embodiment of the present invention.

FIG. 2 is a front view showing the joining device according to the embodiment of the present invention.

FIG. 3A and FIG. 3B are partial front views for explaining the operation of the welding device according to the embodiment of the present invention.

FIG. 4 is a schematic plan view showing a relationship between a plasma display panel and a flexible printed circuit board, and a tool and a stage in the apparatus according to the embodiment of the present invention.

FIG. 5 is a partial front view for explaining the operation of the welding device according to the embodiment of the present invention.

FIG. 6 is a front view showing a conventional joining device.

FIG. 7 is a schematic plan view showing a relationship between a plasma display panel and a flexible printed circuit board, a tool and a stage in a conventional bonding apparatus.

FIG. 8 is a partially enlarged front view showing a relationship between a plasma display panel and a flexible printed circuit board at an end portion of the plasma display panel, and a tool and a stage.

[Explanation of symbols]

11A, 11B, 11C Upper head 11a tool 11b Tool holder 12A, 12B, 12C Lower head 12a stage 12b stage holder 13 frames 15A Upper drive mechanism (upper drive unit) 15B Lower drive mechanism (lower drive unit) 17A, 17B motor 19A, 19B Ball screw 21A, 21B Ball nut part 23A, 23B wedge block 33A, 33B common block 35A, 35B, 35C lifting part 37A, 37B, 37C Elevating part 39A, 39B 1st block 41A, 41B second block 49A, 49B bracket 55A, 55B cylinder 55a tube 55b rod 57A, 57B stopper 59 Spherical bearing 61 heater 63 suction pump 65 holding device 67 Controller

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Claims (5)

[Claims] 1. A joining device for joining a plurality of film-shaped parts arranged in advance along one side of the plate-shaped part by sequentially pressing the film-shaped parts against the plate-shaped part. A plurality of upper heads having a tool for pressing against the plate-shaped component at the lower end, an upper drive unit that simultaneously elevates and lowers the plurality of upper heads, and the upper head unit can be moved to a projecting position and a retracted position. That is, an upper head selection unit provided for each individual upper head unit and a stage for supporting the lower surface side of the plate-shaped component are provided at the upper end, and a plurality of upper head selection units are provided to face the upper head, respectively. A lower head, a lower drive unit that simultaneously raises and lowers a plurality of lower heads, and a lower drive unit that can move the lower head between a protruding position and a retracted position and that is provided for each lower head unit. Side head selection When the lower drive section raises the plurality of lower heads, only the stage of the lower head set to the projecting position by the lower head selection section contacts the lower surface side of the plate-shaped component. A joining device in which only the tool of the upper head set to the projecting position by the upper head selection unit comes into contact with the film-shaped component when the upper heads are brought into contact with each other and the plurality of upper heads are lowered. 2. The bonding apparatus according to claim 1, wherein the width of the tool and the width of the stage are set so as to correspond to the width of one film-shaped component. 3. The bonding apparatus according to claim 1, wherein the tool has at least two types of widths, and the stage has at least two types of widths. 4. The plate-shaped component is a plasma display panel, and the film-shaped component is a flexible printed circuit board.
The joining apparatus according to item. 5. A joining method for joining a plurality of film-like components arranged in advance along one side of the plate-like component by sequentially pressing them against the plate-like component, one film each. A plurality of pairs of tools and stages corresponding to the plate-like parts are used to press and join the film-like parts to the plate-like parts in units of a plurality, and the film-like parts are formed near one end of the plate-like part. A bonding method, in which a tool and a stage corresponding to an end of one side of the plate-shaped component are held in a state of being separated from each other when pressing against the plate-shaped component.