JPH0992971A - Method and apparatus for connecting multikind conformable circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for connecting a multikind conformable circuit board capable of performing connection and fixing, without lowering a production efficiency. SOLUTION: On a pedestal 8, a mounting table 6 for holding a liquid crystal panel 5 is fitted by a mounting stage 7, and in addition to that a first heat head stage part 1 having four thermocompression bonded heads arranged at intervals P1, a second heat head stage part 2 having four thermocompression bonded heads arranged at intervals P2, a third heat head stage part 3 having three thermocompression bonded heads arranged at intervals P3, and a fourth heat head stage part 4 having three thermocompression bonded heads arranged at intervals P4 are arranged linearly. Besides, the mounting stage 7 is a moving mechanism for moving the mounting table 6 on which a liquid crystal panel 5 has been mounted under a specified heat head stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-product circuit board connecting method and apparatus for connecting multi-product glass substrate connecting electrodes and hard substrate connecting electrodes via a flexible film substrate. In particular, the connection between the connection electrode of the glass substrate of the liquid crystal display element and the output electrode of TCP in which the driving semiconductor chip is mounted on the flexible film by the TAB method, and the input electrode of TCP and the drive power supply and control signal to TCP. The present invention relates to a method and a device for connecting to a connection electrode of a hard circuit board for inputting.

[0002]

2. Description of the Related Art FIG. 17 is a front view showing a conventional structure of a device for connecting a TCP to a liquid crystal panel, and FIG. 18 is a conventional structure of a device for connecting a PCB substrate to the TCP connected to a liquid crystal panel. FIG.

Conventionally, in a production process for connecting a circuit of a flat display in which display electrodes are formed in a matrix, such as an EL display panel, a simple matrix type or an active matrix type liquid crystal display panel, a panel of a glass substrate or a plastic substrate is used. Connection electrode and TAB method (Tape A
Multiple TCPs created by utomated bonding)
When the output electrode of the (Tape Carrier Package) is connected via an ACF (anisotropic conductive adhesive film), as shown in FIG. 17, a mounting for mounting a liquid crystal panel 105 mounted on a movable mounting stage 107. Using a device having a table 106 and a dedicated thermal head stage 101 composed of a plurality of thermal heads created in accordance with the connection arrangement of the TCPs connected to the panel 105 on a pedestal 108, a plurality of connection points are connected. At the same time, they are thermocompression bonded.

When connecting an input electrode of a TCP and a connecting electrode of a hard circuit board such as a glass epoxy circuit board or a glass circuit board, as shown in FIG.
A mounting stage 133 for independently moving and driving a panel mounting table 132 for mounting a liquid crystal panel 131 connected thereto and a mounting table (not shown) for mounting a hard circuit board, and soldering for holding the mounting stage 133. Mounting table 134 and the soldering mounting table 13
4 and a soldering stage 135 for moving and driving
Using a device having a pedestal 136 and a dedicated soldering thermal head stage 127 composed of a plurality of thermal heads created according to the connection arrangement of the CP and the hard circuit board, a plurality of connection points are simultaneously soldered. I was connected.

[0005]

According to the above-mentioned conventional method, in the case of circuit connection of a wide variety of flat displays designed by using a plurality of types of products, thermocompression bonding of the panel and TCP is performed every time the types are switched. It is necessary to replace the thermal head or thermal head stage in the connection step and the solder connection step of TCP and the hard circuit board with a dedicated thermal head or thermal head stage corresponding to the product type. By this replacement, it is necessary to adjust the parallelism of the head pressure bonding surface to the reference surface and to confirm the temperature rise of the heater. These setup changes significantly reduce production efficiency.

In view of the problems of the above conventional example, it is an object of the present invention to provide a multi-product circuit board connecting method and device capable of connecting and fixing without lowering production efficiency.

[0007]

In order to achieve the above object, the present invention provides a plurality of connection electrode portions vertically arranged along a side in the vicinity of an end portion of at least one side on a square glass substrate. An electrode pattern for external circuit connection formed,
In a circuit board connecting method for a multi-product, which electrically connects a first electrode pattern formed on each of a plurality of flexible film circuit boards by a first connecting member, an arrangement interval of connection electrode parts of the glass substrate According to the above, one thermal head stage is selected from a plurality of types of thermal head stages, each of which is equipped with a plurality of thermal heads at predetermined intervals, and the plurality of thermal heads of the selected stage select a predetermined thermal head stage on the glass substrate. It is characterized in that the first electrode pattern of the flexible substrate is simultaneously pressure-bonded to the connection electrode portions at some locations.

The flexible film circuit board is connected to the second electrode patterns respectively formed on the plurality of flexible film circuit boards connected to the electrode patterns for external circuit connection on the glass substrate by the above method. For a multi-product type in which a second connection member electrically connects an electrode pattern formed by forming a plurality of connection electrode portions on a hard circuit board arranged in parallel with one end face of the glass substrate on the open side. In the circuit board connection method, one thermal head stage is selected from a plurality of types of thermal head stages each mounting a plurality of thermal heads at predetermined intervals according to the arrangement interval of the connection electrode portions of the hard circuit board, By the plurality of thermal heads of the selected stage, the second electrode of the flexible board is connected to the connection electrode portion at a predetermined position on the hard circuit board. Characterized by crimp connection patterns simultaneously.

As a circuit board connecting device for a wide variety of products,
On the edge of at least one side on the square glass substrate,
A plurality of thermal heads arranged at intervals equal to the position intervals of a plurality of flexible film circuit boards to be connected to an electrode pattern for external circuit connection formed by forming a plurality of connection electrode portions vertically arranged along a side A plurality of types of thermal head stages in which the thermal head arrangement intervals are changed in accordance with the arrangement intervals of the connecting electrode portions on the glass substrate for each product type; a mounting stage for holding the glass substrate; A moving mechanism for moving the stage to each of the thermal head stages, according to the arrangement interval of the connection electrode portion of the glass substrate, select one thermal head stage from the plurality of types of thermal head stage, The plurality of thermal heads of the selected stage are used to form the connection electrode portions at predetermined locations on the glass substrate and the first electrode pattern formed on the flexible substrate. Characterized by crimp connections and down simultaneously.

In addition, a plurality of flexible film circuit boards that are connected to an electrode pattern formed by forming a plurality of connection electrode portions on a hard circuit board arranged in parallel with at least one end surface of a square glass substrate. Each is equipped with a plurality of thermal heads arranged at intervals equal to the position interval,
A plurality of types of thermal head stages in which the arrangement intervals of the thermal heads are changed according to the arrangement intervals of the connection electrode portions on the hard circuit board for each type, a mounting stage that holds the hard circuit board and the glass substrate, and the mounting. A moving mechanism for moving the stage to each of the thermal head stages, and selects one thermal head stage from the plurality of types of thermal head stages according to the arrangement interval of the connection electrode portions of the hard circuit board. The plurality of thermal heads of the selected stage simultaneously press-connect the connection electrode portion at a predetermined location on the hard circuit board and the second electrode pattern formed on the flexible board.

In any one of the above apparatuses, the mounting stage is provided with a suction plate designed in accordance with a glass substrate having a minimum dimension among a plurality of glass substrates having different outer dimensions.

Also, a mechanism for simultaneously crimping the connection electrode portion at a predetermined location on the glass substrate and the first electrode pattern formed on the flexible substrate, and the connection electrode portion at a predetermined location on the hard circuit board. Also, a mechanism for circulating a base pallet equipped with a replaceable glass substrate holding tray is provided between the flexible substrate and a mechanism for simultaneously crimping the second electrode pattern formed on the flexible substrate. It is suitable.

In the circuit board connecting method or device for a variety of products, the square glass substrate is a glass substrate of a liquid crystal display element, and the flexible film circuit board mounts a driving semiconductor element by a TAB method. Characterized in that the hard circuit substrate is a glass epoxy substrate or a glass substrate, at least one of the first and second connection members is an anisotropic conductive adhesive film, the second connection It is preferable that the member is solder.

(Operation) In the method or apparatus of the present invention configured as described above, an electrode pattern for external circuit connection formed by forming a plurality of connection electrode portions on a glass substrate, and a plurality of flexible film circuit boards. When the first electrode pattern formed on each of the first and second electrode patterns of the flexible substrate is simultaneously pressure-bonded to the connection electrode portion at a predetermined location on the glass substrate using the first connection member,
Alternatively, a second electrode pattern formed on each of a plurality of flexible film circuit boards connected to an electrode pattern for connecting an external circuit on the glass substrate and a glass substrate on the side to which the flexible film circuit board is connected. An electrode pattern formed by forming a plurality of connection electrode portions on a hard circuit board arranged parallel to the end face of one side on a connection electrode portion at a predetermined location on the hard circuit board using a second connection member. On the other hand, when simultaneously pressing the second electrode patterns of the flexible substrate, one thermal head stage is mounted from a plurality of types of thermal head stages, each mounting a plurality of thermal heads at predetermined intervals according to the arrangement interval of the connecting electrode portions. By selecting the head stage, you can replace the thermal head or the thermal head stage and adjust the parallelism of the head compression surface to the reference surface,
Since it is not necessary to perform a setup change operation such as confirmation of a temperature rise of the heater, it is possible to prevent a decrease in production efficiency.

Further, in the apparatus of the present invention, the suction plate designed according to the minimum size glass substrate among the plurality of glass substrates having different outer dimensions is provided on the mounting stage, so that the connection can be performed without lowering the production efficiency. It is possible to improve the reliability of the part.

Further, in the apparatus of the present invention, a mechanism for simultaneously crimping a connection electrode portion at a predetermined location on the glass substrate and a first electrode pattern formed on the flexible substrate, and a mechanism on the hard circuit substrate. A mechanism for circulating a base pallet equipped with a replaceable glass substrate holding tray is provided between a connection electrode portion at a predetermined location and a mechanism for simultaneously crimping a second electrode pattern formed on the flexible substrate. This makes it possible to handle complex production plans.

In the method and apparatus of the present invention, the tetragonal glass substrate is a glass substrate for liquid crystal display, and the flexible film substrate is a TAB (T
TCP (Tap installed by apeAutomated Bonding) method
In the case of an e Carrier Package), similarly, it is possible to connect and fix without lowering the production efficiency.

When the hard circuit substrate is a glass epoxy substrate or a glass substrate, at least one of the first and second connecting members is an anisotropic conductive adhesive film, or the liquid crystal of the liquid crystal display element is a ferroelectric liquid crystal. Similarly, when the liquid crystal is a liquid crystal, it can be connected and fixed without lowering the production efficiency.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) Here, a glass substrate of a liquid crystal display element according to the present invention (hereinafter referred to as "liquid crystal panel") and a flexible film substrate on which a liquid crystal driving semiconductor chip is mounted by a TAB method ( Below, "TCP (T
ape carrier package)) and its device.

FIG. 1 shows a TC on a liquid crystal panel as a first embodiment of a circuit board connecting method for a variety of products according to the present invention.
FIG. 2 is a front view showing the configuration of an apparatus for connecting P, and FIG. 2 is a perspective view showing the detailed configuration of the first thermal head stage section shown in FIG. FIG. 3 is a diagram showing two types of liquid crystal panels in which TCP is connected, and FIG. 4 is A of FIG.
The enlarged view of the part shows the details of the connection state. In FIG.
Although several tens of output electrodes of TCP are not shown, in an actual product, several hundreds of output leads are formed. FIG. 5 is a detailed cross-sectional view taken along line BB ′ of FIG.
Shows the details of the pressure bonding state by the thermal head at the time of connection.

The TCP connection device of this embodiment has a pedestal 8 as shown in FIG. A mounting table 6 for holding the liquid crystal panel 5 is mounted on the pedestal 8 by a mounting stage 7, and a first thermal head stage unit 1 having four thermocompression bonding heads having a disposition interval P1 is disposed. A second thermal head stage unit 2 having four thermocompression bonding heads P2, a third thermal head stage unit 3 having three thermocompression bonding heads having an arrangement interval P3, and three thermocompression bondings having an arrangement interval P4. The fourth thermal head stage unit 4 having a head is linearly arranged. Also, the mounting stage 7
Is a moving mechanism for moving the mounting table 6 on which the liquid crystal panel 5 is mounted below a predetermined thermal head stage.

In the first thermal head stage 1, as shown in FIG. 2, four thermal heads 10a to 10d are mounted so as to penetrate therethrough at an arrangement interval P1, and thermal heads 10a to 10d. And the lower stage 11 located below the tip that is the pressure bonding surface of the. Further, on the front surface of the upper stage 9, a crimping sheet feeding mechanism 12 into which a crimping sheet roll 13 shown by a dotted line is inserted is attached.
The pressure-bonding sheet passes from the front-side feed mechanism 12 between the tip of the thermal head and the lower stage 11 and is delivered to a rear-side winding mechanism portion (not shown). Also, the other 2-4
The thermal head stages 2 to 4 have the same structure, such as the lower stage and the pressure-feeding sheet feeding mechanism, except for the number of thermal heads, dimensions, and arrangement intervals.

As shown in FIGS. 3A and 3B, the liquid crystal panel 15 includes glass substrates 15a and 15b and a liquid crystal panel 1.
Reference numeral 6 is composed of two glass substrates 16a and 16b, and a TCP 14 is connected to the connection electrode portions of the glass substrates 15a and 16a.

TCP 14 connected to the liquid crystal panel 15
Is divided into two blocks of four, the arrangement interval within the block is P1, and the block interval is P1 ′. Where P
1 and P1 'have different dimensions. Eight TCPs 14 connected to the liquid crystal panel 16 are connected at an arrangement interval of half P2. These arrangement intervals P1 and P2 match the arrangement intervals P1 and P2 of the thermal heads in each of the first thermal head stage unit 1 and the second thermal head stage unit 2 described above.

In part A of FIG. 3A, as shown in FIG. 4, the output electrode part 17 of the TCP 14 has the glass substrate 15 with the film base material opened and only metal leads.
It is aligned and connected to the connection electrode part 22 of a. In the TCP 14, the liquid crystal driving semiconductor chip 21 is mounted on the flexible film substrate 20, and the semiconductor chip 2
1 is a structure protected by the coat resin 19.

In the line BB 'of FIG. 4, as shown in FIG. 5, the ACF is formed on the connection electrode portion 22 of the glass substrate 15a.
The (anisotropic conductive adhesive film) 23 is placed in advance, and the TCP 14 is attached by the ACF (anisotropic conductive adhesive film) 23.
Output electrode section 17 and connection electrode section 22 of glass substrate 15a
The connection is fixed. Between the glass substrates 15a and 15b, there is a sealing material 24 that adheres the glass substrates to each other and encloses the liquid crystal.

4 and 5 are detailed views of the A portion of FIG. 3A, the output electrode portions of the other TCPs of FIGS. 3A and 3B have the same structure. There is.

Next, the operation of this embodiment will be described with reference to FIGS.

In producing the two types of liquid crystal panels shown in FIGS. 3A and 3B, first, the liquid crystal panel 15 shown in FIG. 3A is produced, and then, FIG. 3B is produced. The procedure for manufacturing the liquid crystal panel 16 will be described.

First, the liquid crystal panel 15 before the thermocompression bonding connection as shown in FIG. 3A is mounted on the mounting table 6 of FIG.
To be mounted on. The liquid crystal panel before this thermocompression connection is
In the previous step, the ACF was formed on the connection electrode portion 22 of the glass substrate 15a.
(Anisotropic conductive adhesive film) 23 is placed, the output electrode portion 17 of the TCP 14 is aligned with the connection electrode portion 22 of the glass substrate 15a, and the TCP 14 is arranged at an interval P1 in the block.
It is placed at the block interval P1 '.

The mounting stage 7 selects a thermal head stage according to a program installed in advance, and moves to the thermocompression bonding work section of the first thermal head stage 1.

Next, using the thermal heads 10a to 10d of the first thermal head stage 1, four output electrode portions 17 on the right side of the central portion of the eight TCPs 14 of the liquid crystal panel 15 before thermocompression bonding are used. And the corresponding connection electrode portion 22 of the glass substrate 15a are fixed by thermocompression at the same time. The positional relationship of the components at this time is shown in FIG.

As shown in FIG. 6, the above-mentioned four TCPs 1
4 output electrode section 17 and ACF (anisotropic conductive adhesive film)
In a state where the mounting stage 7 aligns the lower electrode 11 with the tip portion 25 which is the pressure bonding surface of the four thermal heads 10a to 10d, and the connection electrode portion 22 of the glass substrate 15a on which 23 is placed. , The tip portion 2 serving as the crimping surface of each of 10a to 10d heated to 150 to 300 ° C
In step 5, thermocompression bonding is performed via the pressure bonding sheet 26 to simultaneously connect and fix the above-mentioned four output electrode parts 17 and connection electrode parts 22.

The pressure-bonding sheet 26 is a teflon film (Nitoflon _R No. 90, Nitto Denko) having a thickness of 0.05 mm.
0 UL) is used, and the tip portion 2 that serves as the crimping surface of the thermocompression bonding head is formed by ACF (anisotropic conductive adhesive film) for thermocompression bonding.
5 can be prevented from being contaminated, and at the time of pressure bonding, a slight tilt of the head and minute unevenness of the connection electrode portion can be alleviated and absorbed to improve reliability.

Next, the eight TCPs 14 of the liquid crystal panel 15
Among the remaining four output electrode parts 17 of the TCP 14 on the left side of the central part and the connection electrode part 22 of the glass substrate 15a on which the ACF (anisotropic conductive adhesive film) 23 is placed, the thermal head 10a is provided. Positioning is performed by the mounting stage 7 so that the lower stage 11 and the front end portion 25 serving as the crimping surface of 10d correspond to each other. In the aligned state, thermocompression bonding is performed through the crimping sheet 26 at the tip end portion 25 which becomes the crimping surface of each of 10a to 10d heated to 150 to 300 ° C., and the above-mentioned remaining four output electrode portions 17 are provided. Then, the connection electrode portion 22 is simultaneously connected and fixed, and the TCP 14 is connected to the liquid crystal panel 15a.

Further, the liquid crystal panel 16 shown in FIG.
The following shows a procedure for continuously manufacturing the product without setup work for model switching.

After the manufacture of the liquid crystal panel 15 is completed, the liquid crystal panel 15 after the thermocompression bonding connection is removed from the mounting table 6 in FIG.

Next, the liquid crystal panel 16 in the state before the thermocompression bonding connection of FIG. 3B is mounted on the mounting table 6 of FIG. In the liquid crystal panel 16 in the state before the thermocompression bonding, the ACF (anisotropic conductive adhesive film) 23 is placed on the connection electrode portion 22 of the glass substrate 16a in the previous step, and the output electrode portion 17 of the TCP 14 is attached to the glass. It is aligned with the connection electrode portion 22 of the substrate 16a and placed at an arrangement interval of half of P2.

The mounting stage 7 selects a thermal head stage according to a program installed in advance, and moves to the thermocompression bonding operation section of the second thermal head stage 2.

Next, using the four thermal heads of the second thermal head stage 2, 8 of the liquid crystal panel 15 before thermocompression bonding is connected.
4 of 1,3,5,7 from the right of the TCP14
Output electrode parts 17 and a glass substrate 15 corresponding thereto
The connection electrode portion 22 of a is thermocompression-bonded and fixed at the same time.

As shown in FIG. 6, the above-mentioned 1, 3, 5, 7
The output electrodes 17 of the 4th TCP 14 and the ACF
Glass substrate 1 on which (anisotropic conductive adhesive film) 23 is placed
When the mounting stage 7 aligns the connection electrode 22 of 5a with the tip 25 of the four thermal heads of the second thermal head stage 2 and the lower stage 11. 10a-1 heated to 300 ° C
The crimping sheet 2 at the tip portion 25 which becomes each crimping surface of 0d.
Thermocompression bonding is performed via 6 to simultaneously connect and fix the above-mentioned four output electrode portions 17 and connection electrode portions 22.

Next, the eight TCPs 14 of the liquid crystal panel 16
Of the remaining four TCs from the right side, the second, fourth, sixth and eighth
The output electrode portion 17 of P14 and the connection electrode portion 2 of the glass substrate 16a on which the ACF (anisotropic conductive adhesive film) 23 is placed.
Positioning is performed by the mounting stage 7 so that the lower stage 11 corresponds to the front end portion 25 serving as the pressure bonding surface of the four thermal heads of the second thermal head stage 2 to the second stage. 10a to 10 heated to 150 to 300 ° C in the aligned state
The crimping sheet 26 at the tip portion 25 which is the crimping surface of each d.
Thermocompression bonding is performed via the
7 and the connecting electrode portion 22 are simultaneously connected and fixed, and the liquid crystal panel 1
6 completes manufacturing.

By repeating the above procedure, when the two types of liquid crystal panels shown in FIGS. 3A and 3B are produced, a dedicated thermal head or thermal head stage corresponding to the product type is replaced. However, it is possible to manufacture without adjusting the parallelism of the thermal head crimping surface to the reference surface and changing the model such as checking the temperature rise of the heater.

In this embodiment, an example in which the first thermal head stage unit 1 and the second thermal head stage unit 2 are used is shown, but in the present apparatus, the third thermal head stage unit 3,
By using the fourth thermal head stage unit 4, it is possible to manufacture four or more types of liquid crystal panels without setup work for model switching.

Further, by unifying the outer dimensions of the upper stages of the first to fourth thermal head stages, the thermal head stage corresponding to a new product can be easily manufactured and replaced. Further, by making the crimping sheet common, the consumable member can be made common, and replacement work and cost can be reduced.

Further, the hard circuit board for inputting the driving power source and the control signal of the input electrode of the TCP requires electronic parts such as a capacitor due to the electric circuit configuration, and these electronic parts and the input electrode part of the TCP and the hardware are required. The circuit board may be connected and fixed in a reflow soldering process or the like. However, in this device, as shown in FIG.
Similar effects can be obtained even when the connection electrode portion of the hard circuit board 40a such as the glass epoxy circuit board or the glass circuit board is previously bonded to the input electrode portions 18a and 18b of the CP.

(Second Embodiment) Here, an input electrode of a TCP connected to a liquid crystal panel, a glass epoxy circuit board for inputting a driving power source and a control signal to the TCP, and a hard circuit board such as a glass board ( Hereinafter, a method of connecting a “PCB board” and a connecting electrode and an apparatus therefor will be described.

FIG. 7 shows a second embodiment of the present invention.
7 is a front view showing the configuration of an apparatus for connecting a PCB substrate to a TCP connected to a liquid crystal panel, FIG. 8 is a perspective view showing the detailed configuration of the first soldering thermal head stage section of FIG. 7, and FIG. 9 is FIG. It is a perspective view which shows the detailed structure of the soldering mounting table shown in FIG. FIG. 10 is a diagram showing two types of states in which the TCP and the PCB boards are connected to the liquid crystal panel. FIG.
1 is an enlarged view of the C portion of FIG. 10A, showing the details of the connection state. In FIG. 11, the output electrode of TCP is the number 1
Although not shown, the actual product has several hundred output leads. FIG. 12 shows D of FIG.
13 is a detailed cross-sectional view of the line section D- ', and FIG. 13 shows the details of the crimping state by the thermal head during connection.

The soldering apparatus of this embodiment has a pedestal 36 as shown in FIG. On this pedestal 36, a first soldering thermal head stage section 27 having four thermocompression bonding heads with an arrangement interval P1 and a second soldering thermal head stage section having four thermocompression bonding heads with an arrangement interval P2. 28, a third soldering thermal head stage unit 29 having three thermocompression bonding heads with an arrangement interval P3, and a fourth soldering thermal head stage unit 4 having three thermocompression bonding heads with an arrangement interval P4 are linear. Are arranged in a shape. Further, the pedestal 36 is provided with a soldering mounting stage 35 as a moving mechanism for moving the soldering mounting table 35 below a predetermined soldering thermal head stage.

The first soldering thermal head stage 27 has four soldering thermal heads 3 as shown in FIG.
7a to 37d are attached by penetrating at an arrangement interval P1. In addition, other second to fourth soldering thermal head stages 2
Regarding 8 to 30, the structure is the same except for the number of thermal heads, dimensions, and arrangement intervals.

As shown in FIG. 9, the solder mounting stage section 35 has a panel mounting table 32 for holding the liquid crystal panel 31 to which the TCP is connected and a panel mounting table 32 for aligning the PCB substrate. The panel mounting stage 33 that rotates and the P that holds the PCB substrate
CB mounting table 38 and TC connected to the liquid crystal panel
A PCB mounting stage 39 that moves the PCB mounting table 38 in the three-axis orthogonal directions (XYZ directions) for alignment with P and a soldering mounting table 34 that mounts these tables and the stage are provided.

As shown in FIGS. 10A and 10B, the liquid crystal panel 15 is composed of two glass substrates 15a and 15b, and the liquid crystal panel 16 is composed of two glass substrates 16a and 16b. Substrates 15a, 15b, 16a,
The TCP 14 is connected to the connection electrode part of 16b, and the PCB substrate 40 is connected to the input electrodes of these TCPs 14.
The connection electrodes of a, 40b, 41a, and 41b are connected.

The TCP 14 on the glass substrate 15a is divided into two blocks of four, and the arrangement interval within the block is P.
1, the block interval is P1 '. Where P1 and P
1'is a different size. TCP of glass substrate 16a
Eight 14 are connected at an arrangement interval of half of P2. These arrangement intervals P1 and P2 coincide with the arrangement intervals P1 and P2 of the soldering thermal heads in each of the first soldering thermal head stage 27 and the second soldering thermal head stage 28 described above.

FIG. 11 shows the portion C of FIG.
As shown in, the input electrode portions 18a and 18b of the TCP 14 are
Is P when the film substrate is open and only metal leads are used.
The connection electrode part 42 shown in FIG. 12 of the CB board 40a is aligned and connected. On the other hand, the output electrode portion 17 of the TCP 14 is aligned and connected to the connection electrode portion 22 of the glass substrate 15a in the state where the film base material is opened and only the metal leads are provided. The TCP 14 has a structure in which a liquid crystal driving semiconductor chip 21 is mounted on a flexible film substrate 20, and the semiconductor chip 21 is protected by a coat resin 19.

The line DD 'in FIG. 11 is shown in FIG.
As shown in, the solder 43 is pre-plated on the connection electrode portion 42 of the PCB substrate 40a.
The input electrode portion 18a of the TCP 14 and the PCB substrate 40
The connection electrode part 42 of a is connected and fixed. In this embodiment, an example in which solder is used as the connecting member has been shown, but the same effect can be obtained by using ACF (anisotropic conductive adhesive) as the connecting member.

11 and 12 are detailed views of the C portion of FIG. 10A, other T of FIGS. 10A and 10B.
The output electrode portion of the CP has a similar structure.

Next, the operation of this embodiment will be described with reference to FIGS.

In producing the two types of liquid crystal panels shown in FIGS. 10A and 10B, first, the TCP 4 connected to the liquid crystal panel 15a shown in FIG.
0a is connected to the TCP14 connected to the liquid crystal panel 16a shown in FIG.
A procedure for manufacturing for connecting 1a will be described.

The PCB substrate 40a is the PCB shown in FIG.
It is mounted on the mounting table 38. A flux, which is an activator at the time of soldering, is previously applied around the solder 43 of the connection electrode portion 42 of the PCB substrate 40a shown in FIG.

Next, TC is formed on the connection electrode portion 22 of the glass substrates 15a and 15b shown in FIG. 11 described in the first embodiment.
The liquid crystal panel in which the output electrode portion 17 of P14 is thermocompression bonded is mounted on the panel mounting table 32.

Next, the panel mounting stage 33 and the PCB are installed in accordance with the preinstalled program.
The mounting stage 39 is the glass substrate 15 of the liquid crystal panel 15.
Input electrode portions 18a, 18b of the TCP 14 connected to a
And the connection electrode part 42 of the PCB substrate 40a are aligned, the soldering mounting stage 35 selects the soldering thermal head stage, and moves to the thermocompression bonding working part of the first soldering thermal head stage 27. .

Next, the first soldering thermal head stage 2
10A using the thermal heads 37a to 37d of FIG.
As shown in FIG. 4, among the eight TCPs 14 connected to the glass substrate 15a, the four input electrodes 18 on the right side of the central portion
a and the corresponding connection electrode portion 4 of the PCB substrate 40a
2 and 2 are fixed by thermocompression at the same time. The positional relationship of the constituents at this time is shown in FIG.

As shown in FIG. 13, the above-mentioned four TCPs
14 of the input electrode portions 18a and the connection electrodes 42 of the PCB substrate 40a on which the solder 43 is pre-plated, and the tip end portion 4 serving as the crimping surface of the soldering thermal heads 37a to 37d.
4 is aligned by the soldering mounting stage 35 so as to correspond to each other, the front end portion 44 serving as a pressure bonding surface of each of the thermal heads 37a to 37d heated to 150 to 300 ° C.
Then, the above-mentioned four input electrode portions 18a and the connecting electrode portions 42 are simultaneously connected and fixed by thermocompression bonding. During thermocompression bonding, the PCB mounting stage 39 functions as a lower stage that receives a load.

The input electrode portion 18a is connected to the 4
The input electrode portion 18b of each TCP 1 is aligned with the soldering mounting stage 35 so that the tip end portion 44 serving as the pressure bonding surface of the soldering thermal heads 37a to 37d correspond to each other,
Thermal heads 37a to 37d heated to 150 to 300 ° C
Thermocompression bonding is performed at the tip end 44 which becomes the crimping surface of each of
The input electrode portion 18b and the connection electrode portion 42 at some places are simultaneously connected and fixed.

Next, among the remaining eight TCPs 14 connected to the glass substrate 15a, the four input electrode portions 18a of the TCPs 14 on the left side of the central portion and the crimping surfaces of the soldering thermal heads 37a to 37d are formed. The soldering mounting stage 35 so as to correspond to
The thermal heads 37a to 37d heated to 0 to 300 [deg.] C. are thermocompression-bonded at the tip portions 44 serving as pressure-bonding surfaces, and the above-mentioned four input electrode portions 18a and the connection electrode portions 42 are simultaneously connected and fixed.

The input electrode portion 18a is connected to the 4
The input electrode portions 18b of the individual TCPs 14 are aligned with the soldering mounting stage 35 so that the tip portions 44, which are the pressure bonding surfaces of the soldering thermal heads 37a to 37d, correspond to each other, and the heat heated to 150 to 300 ° C. Heads 37a-3
The TCP 14 connected to the glass substrate 15a by thermocompression bonding at the tip end portions 44 serving as the respective pressure bonding surfaces of 7d to simultaneously connect and fix the above-mentioned four input electrode portions 18b and the connection electrode portions 42.
The manufacturing of connecting the PCB substrate 40a to the is completed.

Furthermore, the liquid crystal panel 16 of FIG.
The following shows a procedure for continuously manufacturing the product without setup work for model switching.

The TCP 14 connected to the glass substrate 15a of the liquid crystal panel 15 is connected to the TCP 14 connected to the glass substrate 15a, and then the PCB 1 40a connected to the glass substrate 15a is completed.
4, the liquid crystal panel 15 with the PCB 40a connected,
It is removed from the panel mounting table 32 and the PCB mounting table 38 shown in FIG.

Next, the PCB board 41a is mounted on the PCB mounting table 38 shown in FIG. PC shown in FIG.
Around the solder 43 of the connection electrode portion 42 of the B board 41a, a flux serving as an activator at the time of soldering is applied in advance.

Next, TC is formed on the connection electrode portion 22 of the glass substrates 16a and 16b shown in FIG. 11 described in the first embodiment.
The liquid crystal panel in which the output electrode portion 17 of P14 is thermocompression bonded is mounted on the panel mounting table 32.

Next, the panel mounting stage 33 and the PCB are installed in accordance with the preinstalled program.
The mounting stage 39 includes a glass substrate 16 on the liquid crystal panel 16.
Input electrode portions 18a, 18b of the TCP 14 connected to a
And the connection electrode part 42 of the PCB board 41a are aligned, and the soldering mounting stage 35 selects the soldering thermal head stage, and the second soldering thermal head stage 28
Move to the thermocompression bonding work part.

Next, the second soldering thermal head stage 2
Eight TCP1s connected to the glass substrate 16a as shown in FIG. 10B by using four thermal heads 8
4, first, third, fifth, and seventh TCP input electrode portions 18a from the right side, and a PCB board 41a corresponding thereto
And the connection electrode part 42 are simultaneously thermocompression-bonded and fixed.

As shown in FIG. 13, the above-mentioned four TCPs
The input electrode portions 18a of 14 and the connection electrodes 42 of the PCB substrate 41a, which are pre-plated with the solder 43, are provided with the tip end portions 44 serving as the crimping surfaces of the four thermal heads of the second soldering thermal head stage 28. 150 to 3 in a state of being aligned by the soldering mounting stage 35 so as to correspond.
Second soldering thermal head stage 2 heated to 00 ° C
The four thermal heads No. 8 are thermocompression-bonded at the tip end portions 44 serving as the pressure-bonding surfaces, and the above-mentioned four input electrode portions 18a and the connection electrode portions 42 are simultaneously connected and fixed.

The input electrode portion 18a is connected to the 4
The soldering and mounting stage 35 such that the input electrode portions 18b of the individual TCP1 and the tip portions 44 which are the pressure bonding surfaces of the four thermal heads of the second soldering thermal head stage 28 correspond to each other.
And the four soldering heads of the second soldering thermal head stage 28, which are heated to 150 to 300 ° C., are thermocompression-bonded to each other at the tip portions 44 serving as the pressure-bonding surfaces of the four thermal heads. The portion 18b and the connection electrode portion 42 are simultaneously connected and fixed.

Next, of the remaining eight TCPs 14 connected to the glass substrate 16a, 2, 4, 6, from the right side.
The eight input electrodes 18a of the four TCPs 14 and the tip portion 44 serving as a pressure bonding surface of the soldering thermal heads 37a to 37d.
And the thermal head 3 which is heated to 150 to 300 ° C.
7a to 37d are thermocompression-bonded at the tip portions 44 serving as pressure-bonding surfaces, and the input electrode portion 18a and the connection electrode portion 42 at the above-mentioned four locations
Connect and fix at the same time.

The input electrode portion 18a is connected to the 4
The soldering mounting stage 3 such that the input electrode portions 18b of the individual TCPs 14 and the tip portions 44 that are the pressure bonding surfaces of the four thermal heads of the second soldering thermal head stage 28 correspond to each other.
5. The position is adjusted by 5 and thermocompression bonding is performed at the tip end portions 44 which are the pressure bonding surfaces of the four thermal heads of the second soldering thermal head stage 28 heated to 150 to 300 ° C.
The input electrode portion 18b and the connection electrode portion 42 of the location are connected and fixed at the same time, and P is attached to the TCP 14 connected to the glass substrate 16a.
The manufacturing for connecting the CB board 41a is completed.

By repeating the above procedure, FIG.
When producing the two types of liquid crystal panels shown in (A) and (B), replace with a dedicated thermal head or thermal head stage corresponding to the product type, and set the parallelism of the thermal head crimping surface to the reference plane. It is possible to manufacture in the setup work such as adjustment and model changeover such as confirmation of heater temperature rise.

In this embodiment, the first thermal soldering thermal head stage unit 27 and the second thermal soldering thermal head stage unit 28 are used.
In the present apparatus, when three or more types of liquid crystal panels are produced by using the third soldering thermal head stage unit 29 and the fourth soldering thermal head stage unit 30. In addition, it is possible to manufacture without setup work for model switching.

Further, by unifying the outer dimensions of the upper stages of the first to fourth thermal head stages, the thermal head stage corresponding to a new product can be easily manufactured and replaced.

(Third Embodiment) In a device for connecting a TCP and a PCB substrate to a liquid crystal panel, a suction fixing method is generally adopted as a method of holding the liquid crystal panel on a mounting table.

However, when connecting the TCP and PCB boards to the liquid crystal panel designed with a plurality of product specifications as shown in the first and second embodiments, each time the product type is switched, It is necessary to replace the suction plate that fixes the liquid crystal panel by suction. Further, when the liquid crystal of the liquid crystal display element is a ferroelectric liquid crystal, the orientation of the glass may be disturbed by the deformation of the glass substrate at the time of adsorption and the display quality may be deteriorated.

Therefore, here, a mounting table in the device for connecting the TCP and PCB substrates to the ferroelectric liquid crystal panel designed to have a plurality of product specifications in consideration of the above problems will be described.

FIG. 14 is a diagram showing a configuration of a mounting table of an apparatus for connecting a PCB board, as a fourth embodiment of the present invention. FIG. 15 shows a state in which the ferroelectric liquid crystal panel is mounted on the mounting table of FIG. 14, (A) is an example of mounting a liquid crystal panel of the largest shape of the product type to be produced, and (B) is a minimum shape of the product type to be produced. This is an example of mounting the liquid crystal panel of.

As shown in FIG. 14, the suction surface of the suction plate 45 for sucking the glass substrate has a thickness of 0.3 to 1.0.
There is a rubber sheet 46 of mm, and both ends of the rubber sheet 46 are attached to the upper surface of the panel mounting table 32.
It can be replaced when it is worn out. In an actual device, the number of holes is several tens to several hundreds, but in FIG.
The rubber sheet 46 has 15 round holes formed in a grid pattern of 3 rows and 5 columns. The suction plate 45 is provided with 15 suction holes at the same positions as the holes of the rubber sheet 46 and 15 suction positions at positions different from the holes of the sheet 46 in a lattice of 6 rows and 5 columns. Of these suction holes of the suction plate 45, 15 positions at the same positions as the holes of the sheet 46 are for fixing the glass substrate by suction, and 15 positions different from the holes of the sheet 46 are for fixing the rubber sheet 46 by suction.

As shown in FIGS. 15A and 15B, the TCP 14 is connected to the glass substrates 15a and 15b, and the PCB is connected.
The liquid crystal panel in the state where the substrate 40b is connected and the liquid crystal panel in which the TCP 14 is connected to the other small-sized glass substrates 16a and 16b and the PCB substrate 41b is connected are
This embodiment is suction-fixed via a rubber sheet 46 to the same mounting table as that shown in FIG.

The size and shape of the suction plate 45 are designed so that the glass substrates 16a, 16b of the smallest type of product to be manufactured can be sucked and fixed without leakage of suction air, and the number and number of suction holes of the suction plate 45 are set. Designed for multiple product specifications with the same suction plate by processing the diameter so that the largest shape glass substrates 15a and 15b of the type to be produced can be fixed by suction without shifting during the process of connecting with the PCB substrate. It is possible to connect the TPC and PCB boards to the formed liquid crystal panel.

Further, by relaxing the deformation of the glass substrate at the time of adsorption by the rubber sheet 46, it is possible to prevent the orientation from being disturbed and the display quality being deteriorated due to the deformation of the glass substrate at the time of adsorption of the ferroelectric liquid crystal panel.

The structure of this embodiment uses a mounting stage in which the size of the vacuum plate is 200 mm, the number of holes is 100, the hole diameter is 2 mm, the thickness of the rubber sheet 46 is 0.5 mm, and the number of holes is 50. And the diagonal dimension is 14-24
When the TCP and PCB substrates were connected to the inch ferroelectric liquid crystal panel, the reliability and display quality of the connection portion were good.

(Fourth Embodiment) In a device for connecting a TCP and a PCB substrate to a liquid crystal panel, an in-line system for connecting the devices is generally adopted in order to increase the production efficiency as the production amount increases. .

However, as shown in the first and second embodiments having the mounting stage of the above-described third embodiment, the TCP and PCB boards are attached to the liquid crystal panel designed with a plurality of product specifications. When connecting, the production plan tends to be complicated, and the TCP and PCB boards are continuously connected to the liquid crystal panel, only the TCP is connected to the liquid crystal panel, or the TCP is previously connected to the liquid crystal panel. Three production plans occur for connecting the PCB boards.

Therefore, here, the base pallet equipped with the replaceable glass substrate holding tray provided between the TCP connection device shown in the first embodiment and the soldering device shown in the second embodiment is circulated. A connection conveyor device having a mechanism will be described.

FIG. 16 is a front view showing the structure of a connecting conveyor device as a fourth embodiment of the present invention.

As shown in FIG. 16, the connection conveyor device 47 of the present embodiment is located between the base 8 of the TCP connection device and the base 36 of the soldering device, and is mounted on the mounting table 6 of the TCP connection device.
Entry panel transfer robot 48 for transferring the liquid crystal panel of
And an inlet-side entrance elevator 49 that vertically moves the base pallet 55, an outlet-side exit elevator 51 that vertically moves the base pallet 55, and a panel that circulates from the inlet-side elevator 49 side to the outlet-side elevator 51 side. The circulating conveyor 50 and the exit panel transfer robot 52 that transfers the liquid crystal panel on the base pallet 55 of the exit elevator 51 are configured.

The liquid crystal panel 53 to which the TCP is connected is mounted on the liquid crystal panel holding tray 54, and the liquid crystal panel holding tray 54 is detachably provided on the base pallet 55. There are a total of three base pallets 55, which are circulated by a drive roller 57 provided in a cover 56 of a partially connected conveyor device 47.

Next, the operation of the connecting conveyor device in the case of the above-mentioned three production plans will be described.

When continuously connecting the TCP and PCB boards to the liquid crystal panel, first, the TC connection device is used to set the TC.
The liquid crystal panel 53 to which P is connected is received from the mounting table 6 by the entrance panel transfer robot 48, and is transferred to the liquid crystal panel holding tray 54 on the base pallet 55 above the entrance elevator 49.

The base pallet 55 is composed of the drive roller 5
7 moves from the upper part of the entrance elevator 49 to the upper part of the exit elevator 51 through the upper part of the circulation conveyor 50. In the meantime, the other two base pallets 55 pass from the lower part of the exit part elevator 51 to the lower part of the inlet part elevator 49 via the lower part of the circulation conveyor 50 and to the lower part of the exit part elevator 51 to the lower part of the circulation conveyor 50. It is moving to the bottom.

Next, the liquid crystal panel 53 to which the TCP is connected is received from the liquid crystal panel holding tray 54 on the base pallet 55 on the upper part of the exit part elevator 51 by the exit part panel transfer robot 52, and the soldering device is mounted. It is transferred to the table 32 and the PCB board is connected by a predetermined soldering thermal head stage section.

The base pallet 55 on which the liquid crystal panel 53 to which the TCP is connected is transferred moves from the upper part of the exit elevator 51 to the lower part of the circulation conveyor 50 through the lower part of the exit elevator 51. In the meantime, repeat the same procedure for other base pallets, and continue TCP on the liquid crystal panel.
And connect the PCB board.

When only TCP is connected to the liquid crystal panel, first, the liquid crystal panel 53 to which the TCP is connected by the TCP connection device is received from the mounting table 6 by the entrance panel transfer robot 48, and the entrance elevator is installed. It is transferred to the liquid crystal panel holding tray 54 on the base pallet 55 above the data 49.

The base pallet 55 is formed by the drive roller 5
7 moves from the upper part of the entrance elevator 49 to the upper part of the circulation conveyor 50. During this time, the other two base pallets 55 are moving from the exit elevator 51 to the lower part of the circulation conveyor 50 and from the upper part of the circulation conveyor 50 to the upper part of the exit elevator 51.

Next, the liquid crystal panel 53 to which the TCP is connected is removed together with the liquid crystal panel holding tray 54 from the base pallet 55 above the circulation conveyor 50, and a new liquid crystal panel holding tray 54 is attached to the base pallet 55.

Next, the base pallet 55 to which the new liquid crystal panel holding tray 54 is attached moves from the upper part of the circulation conveyor 50 to the lower part of the circulation conveyor 50 through the upper part of the exit elevator 51 and the lower part of the exit elevator 51. . Meanwhile, the same procedure is repeated for other base pallets to connect only TCP to the liquid crystal panel.

When connecting the PCB substrate from the state where the TCP is connected to the liquid crystal panel in advance, first, the liquid crystal panel 53 to which the TCP is connected is mounted on the base pallet 55 above the circulation conveyor 50. The panel holding tray 54 is attached.

This base pallet 55 is used for the drive roller 5
7 moves from the upper part of the circulation conveyor 50 to the upper part of the exit elevator 51. During this time, the other two base pallets 55 are moving to the lower part of the entrance elevator 49 and the lower part of the circulation conveyor 50.

Next, the liquid crystal panel 53 to which the TCP is connected is received from the liquid crystal panel holding tray 54 on the base pallet 55 above the outlet elevator 51 by the outlet panel transfer robot 52, and the soldering device is mounted. It is transferred to the table 32 and the PCB board is connected by a predetermined soldering thermal head stage section.

The base pallet 55 after the liquid crystal panel 53 to which the TCP is connected is transferred to the mounting table 32 of the soldering device is moved to the lower part of the circulation conveyor 50. In the meantime, repeat the same procedure for other base pallets, and from the state that TCP is connected to the liquid crystal panel in advance,
Connect the board.

As described above, by using the device shown in FIG. 16, the TCP and PCB substrates can be continuously connected to the liquid crystal panel, or only the TCP can be connected to the liquid crystal panel.
PC from the state that TCP was connected to the liquid crystal panel in advance
It becomes possible to produce by connecting the B board, and it is possible to flexibly cope with a complicated production plan that is likely to occur when the TCP and PCB boards are connected to the liquid crystal panel designed with a plurality of product specifications.

[0110]

As described above, according to the circuit board connecting method of the present invention for a wide variety of products, the glass substrates and the flexible film circuit boards having various connection arrangements are connected, or the flexible film circuit boards having various connection arrangements are connected. Upon connection of the hard circuit boards, one thermal head stage is selected from a plurality of types of thermal head stages each mounting a plurality of thermal heads at predetermined intervals according to the arrangement interval of the connection electrode portions,
Simultaneous crimping connection by a plurality of thermal heads of the selected stage has an effect of reducing the setup change work at the time of changing the product type and preventing a decrease in production efficiency.

In the circuit board connecting device of the present invention for a wide variety of products, there are many connections such as connecting glass substrates and flexible film circuit boards with various connection arrangements and connecting flexible film circuit boards and glass epoxy circuit boards with various connection arrangements. In the case of product type production, one thermal head stage is selected from a plurality of types of thermal head stages composed of a plurality of thermal heads corresponding to the arrangement intervals of the connection electrode parts of the production type, and the thermal heads are simultaneously operated by a plurality of thermal heads. By crimping,
The effect of preventing a decrease in equipment operating rate due to setup work such as replacement of a dedicated thermal head or thermal head stage corresponding to the product type, adjustment of the parallelism of the thermal head pressure bonding surface to the reference surface, and confirmation of heater temperature rise is performed. is there.

Also, in the mounting stage of the liquid crystal panel in the multi-product compatible device in which the TCP and PCB substrates are connected to the liquid crystal panel, the size and shape of the suction plate is set to the smallest shape of the glass substrate to be manufactured so that the suction air leaks. It is designed so that it can be sucked and fixed without suction, and the number and diameter of suction holes of the suction plate can be sucked and fixed without shifting during the connection process of TCP and PCB substrates to the glass substrate of the largest shape of the product type to be produced. By processing, TCP and PCB can be applied to liquid crystal panels designed with multiple types of product specifications.
The liquid crystal panel can be suction-held by the same suction plate when connecting the substrates, and the reduction of the device operation rate due to the work of exchanging it with a dedicated suction plate can be prevented and the reliability of the connection part can be improved. effective.

Further, TCP and P are used for the ferroelectric liquid crystal panel.
By providing a rubber sheet on the suction surface of the suction plate of the mounting stage in a multi-product compatible device that connects a CB substrate, it is possible to prevent the orientation from being disturbed due to the deformation of the glass substrate at the time of suction, and display quality of the ferroelectric liquid crystal panel. Has the effect of improving.

Further, by providing a connecting conveyer device having a mechanism for circulating a base pallet having a replaceable glass substrate holding tray between a multi-product TCP connection device and a multi-product soldering device, continuous operation is possible. Connect the TCP and PCB board to the liquid crystal panel, connect only the TCP to the liquid crystal panel, or connect the TCP to the liquid crystal panel in advance.
It is possible to perform the production by connecting the PCB substrate from the state where the are connected, and when connecting the TCP and PCB substrates to various kinds of liquid crystal panels, there is an effect of flexibly responding to a complicated production plan that is likely to occur.

[Brief description of drawings]

FIG. 1 is a front view showing a configuration of an apparatus for connecting a TCP to a liquid crystal panel, which is a first embodiment of a circuit board connecting method for a variety of products of the present invention.

FIG. 2 is a perspective view showing a detailed configuration of a first thermal head stage unit shown in FIG.

FIG. 3 is a diagram showing two types of liquid crystal panels to which a TCP is connected.

FIG. 4 is an enlarged view of part A of FIG. 3A, showing details of the connection state.

5 is a detailed cross-sectional view taken along the line B-B ′ of FIG.

FIG. 6 is a detailed cross-sectional view showing a crimped state by the thermal head at the time of connection.

FIG. 7 is a front view showing a configuration of an apparatus for connecting a PCB substrate to a TCP connected to a liquid crystal panel, as a second embodiment of the present invention.

8 is a perspective view showing a detailed configuration of a first soldering thermal head stage unit of FIG. 7. FIG.

9 is a perspective view showing a detailed configuration of the soldering mounting table shown in FIG. 7. FIG.

FIG. 10 is a diagram showing two types of states in which a TCP and a PCB substrate are connected to a liquid crystal panel.

FIG. 11 is an enlarged view of portion C of FIG. 10A, showing details of the connection state.

FIG. 12 is a detailed cross-sectional view taken along the line D-D ′ of FIG. 11.

FIG. 13 is a detailed cross-sectional view showing a crimped state by the thermal head at the time of connection.

FIG. 14 is a diagram showing a configuration of a mounting table of an apparatus for connecting a PCB board according to a fourth embodiment of the present invention.

15 is a diagram showing an example of mounting a ferroelectric liquid crystal panel on the mounting table of FIG.

FIG. 16 is a front view showing the configuration of a connection conveyor device according to a fourth embodiment of the present invention.

FIG. 17 is a front view showing a configuration of an apparatus for connecting a TCP to a liquid crystal panel in a conventional example.

FIG. 18: TC connected to a liquid crystal panel in a conventional example
It is a front view which shows the structure of the apparatus which connects a PCB board to P.

[Explanation of symbols]

1 1st thermal head stage 2 2nd thermal head stage 3 3rd thermal head stage 4 4th thermal head stage 5 Liquid crystal panel 6 Mounting table 7 Mounting stage 8 Pedestal 9 Upper stage 10a-10d Thermal head 11 Lower stage 12 Sheet Feed Mechanism for Crimping 13 Sheet Roll for Crimping 14 TCP 15,16 Liquid Crystal Panel 15a, 15b, 16a, 16b Glass Substrate 17 TCP Output Electrode 18a, 18b TCP Input Electrode 19 Coat Resin 20 Flexible Film Substrate 20 ' Film base material 21 Liquid crystal driving semiconductor chip 22 Glass substrate connection electrode portion 23 ACF (anisotropic conductive adhesive film) 24 Sealing material 25 Thermal head tip portion 26 Crimping sheet 27 First soldering thermal head stage portion 28 Second Soldering Thermal Head Stage Section 29 3 soldering thermal head stage section 30 4th soldering thermal head stage section 31 liquid crystal panel to which TCP is connected 32 panel mounting table 33 panel mounting stage 34 soldering mounting table 35 soldering mounting stage 36 of soldering device Base 37a to 37d Soldering thermal head 38 PCB mounting table 39 PCB mounting stage 40a, 40b, 41a, 41b PCB substrate connected to TCP 42 Connection electrode portion of PCB substrate 43 Solder 44 Tip of soldering thermal head 45 Adsorption Plate 46 Rubber Sheet 47 Connection Conveyor Device 48 Inlet Panel Transfer Robot 49 Inlet Elevator 50 Circulation Conveyor 51 Exit Elevator 52 Exit Panel Transfer Robot 53 Liquid Crystal Panel 54 Connected with TCP 54 Liquid Crystal Panel Holding Tray 5 Cover 57 driving roller of the base pallet 56 connecting conveyor

Claims (16)

[Claims] 1. An electrode pattern for connecting an external circuit, comprising: a plurality of connection electrode portions vertically arranged along a side in the vicinity of an end portion of at least one side on a square glass substrate; In a circuit board connecting method for a variety of products, in which a first electrode pattern formed on a flexible film circuit board is electrically connected to a first electrode pattern by a first connecting member, according to an arrangement interval of connection electrode portions of the glass substrate. Then, one thermal head stage is selected from a plurality of types of thermal head stages, each of which mounts a plurality of thermal heads at a predetermined interval, and the plurality of thermal heads of the selected stage are used to select a predetermined location on the glass substrate. A circuit board connecting method for a wide variety of products, characterized in that the first electrode pattern of the flexible board is simultaneously pressure-bonded to the connecting electrode portion. 2. A second electrode pattern formed on each of a plurality of flexible film circuit boards connected to an electrode pattern for connecting an external circuit on a glass substrate by the method according to claim 1, and the flexible film circuit. A second connection member electrically connects an electrode pattern formed by forming a plurality of connection electrode portions on a hard circuit substrate arranged in parallel with one end surface of the glass substrate on the side to which the substrate is connected. In a circuit board connection method for a wide variety of products, according to the arrangement interval of the connection electrode portions of the hard circuit board,
One thermal head stage is selected from a plurality of types of thermal head stages, each mounting a plurality of thermal heads at predetermined intervals, and the plurality of thermal heads of the selected stage connect the predetermined locations on the hard circuit board. A circuit board connection method for a wide variety of products, characterized in that the second electrode pattern of the flexible board is simultaneously pressure-bonded to the electrode portion. 3. The tetragonal glass substrate is a glass substrate of a liquid crystal display device, and the flexible film circuit substrate is a TCP in which a driving semiconductor device is mounted by a TAB method. Alternatively, the circuit board connection method according to claim 2, which is compatible with various types. 4. The circuit board connecting method according to claim 3, wherein the liquid crystal of the liquid crystal display element provided on the glass substrate is a ferroelectric liquid crystal. 5. The circuit board connecting method according to claim 2, wherein the hard circuit board is a glass epoxy board. 6. The circuit board connection method according to claim 2, wherein the hard circuit board is a glass board. 7. The circuit board connecting method according to claim 2, wherein at least one of the first and second connecting members is an anisotropic conductive adhesive film. 8. The circuit board connection method according to claim 2, wherein the second connection member is solder. 9. A connection is made to an electrode pattern for external circuit connection, which is formed by forming a plurality of connection electrode portions vertically arranged along a side in the vicinity of an end of at least one side on a tetragonal glass substrate. Each has a plurality of thermal heads arranged at intervals equal to the positions of the flexible film circuit boards, and the arrangement intervals of the thermal heads are changed according to the arrangement intervals of the connection electrode parts on the glass substrate for each product type. A plurality of types of thermal head stages, a mounting stage for holding a glass substrate, and a moving mechanism for moving the mounting stage to each of the thermal head stages. Accordingly, one thermal head stage is selected from the plurality of types of thermal head stages, and the plurality of thermal heads of the selected stages are used to determine a predetermined temperature on the glass substrate. A circuit board connecting device for a wide variety of products, characterized in that the connecting electrode portions at some locations and the first electrode patterns formed on the flexible substrate are simultaneously pressure-bonded and connected. 10. A plurality of flexible film circuit boards which are connected to an electrode pattern formed by forming a plurality of connection electrode portions on a hard circuit board arranged in parallel with at least one end surface of a tetragonal glass substrate. Plural types of thermal head stages, each mounting a plurality of thermal heads arranged at intervals equal to the positional intervals, and changing the arrangement intervals of the thermal heads according to the arrangement intervals of connection electrode parts on the hard circuit board for each product type. A mounting stage for holding the hard circuit board and the glass substrate, and a moving mechanism for moving the mounting stage to each of the thermal head stages, depending on the arrangement interval of the connection electrode portions of the hard circuit board. hand,
One thermal head stage is selected from the plurality of types of thermal head stages, and a plurality of thermal heads of the selected stages are used to form a connection electrode portion at a predetermined location on the hard circuit board and a second portion formed on the flexible substrate. A circuit board connecting device for a wide variety of products, characterized in that the electrode patterns of the above are connected at the same time by pressure bonding. 11. The adsorption plate designed according to the smallest glass substrate among a plurality of glass substrates having different outer dimensions is provided on the mounting stage. The circuit board connection device for multiple types described in. 12. A mechanism for simultaneously crimping a connection electrode portion at a predetermined location on the glass substrate and a first electrode pattern formed on the flexible substrate, and a connection electrode portion at a predetermined location on the hard circuit board. A mechanism for circulating a base pallet having an exchangeable glass substrate holding tray is provided between the flexible substrate and a mechanism for simultaneously crimping the second electrode pattern formed on the flexible substrate. 12. The circuit board connecting device according to any one of 9 to 11, which is compatible with various kinds. 13. The tetragonal glass substrate is a glass substrate of a liquid crystal display device, and the flexible film circuit substrate is a TCP in which a driving semiconductor device is mounted by a TAB method. 13. A circuit board connecting device according to any one of items 1 to 12, which is compatible with various types. 14. The liquid crystal of a liquid crystal display device provided on the glass substrate is a ferroelectric liquid crystal.
The circuit board connecting device according to item 3, which is compatible with various types. 15. The circuit board connecting device according to claim 10, wherein the hard circuit board is a glass epoxy board. 16. The circuit board connecting device according to claim 10, wherein the hard circuit board is a glass board.