JP3861415B2 - Electronic component mounting equipment - Google Patents

Description

BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus capable of mounting a plurality of electronic components collectively at a predetermined position on an electronic circuit board.
[0002]
[Prior art]
First, a conventional electronic component mounting apparatus will be described with reference to FIGS.
8 is an external perspective view of a conventional high-speed electronic component mounting apparatus, FIG. 9 is a conceptual configuration diagram of the component transfer means shown in FIG. 8, and FIG. 10 is a part of the electronic component supply means shown in FIG. FIG. 11 is an operation explanatory diagram of the electronic component supply means, the component transfer means, and the electronic circuit board positioning means shown in FIG. FIG. 12 is a conceptual perspective view showing the configuration of the electronic component supply means, the component transfer means, and the electronic circuit board positioning means in the conventional general-purpose electronic component mounting apparatus.
[0003]
In FIG. 8, reference numeral 100A generally indicates a conventional high-speed electronic component mounting apparatus (hereinafter simply referred to as “electronic component mounting apparatus”). This electronic component mounting apparatus 100A is an example of a high-speed type, and is roughly divided into nine means, that is, main operation means 1, main drive means 2, component transfer means 3, electronic circuit board positioning means 4, and loader means 5. , Unloader means 6, electronic component supply means 7, electrical equipment means 8, gantry means 9, and the like.
[0004]
The main operating means 1 performs operations of the electronic component mounting apparatus 100A, input / output and editing of NC data and electronic component data. The main drive means 2 drives the mechanism of each operation necessary from the rotation of the nozzle around the rotary head of the component transfer means 3 and the suction of the electronic components to the mounting on the electronic circuit board CB. The component transfer means 3 is supported by a rotary mechanism and is composed of a plurality of nozzles driven by the motor and cam of the main drive means 2. The positioning means 4 comprises an XY table and performs the positioning operation of the electronic circuit board CB. The loader means 5 is a conveyor for loading the electronic circuit board CB into the positioning means 4, and the unloader means 6 is a discharge portion for the electronic circuit board CB. The electrical means 8 is a means for controlling the electronic component mounting apparatus 100A and performing image processing. The gantry means 9 is constituted by a chassis or the like for holding the means.
[0005]
FIG. 9 conceptually shows the configuration of the conventional component transfer means 3. This component transfer means 3 includes a rotary mechanism 31 disposed in the center portion and a plurality of, in the illustrated example, five nozzles (numbers enclosed in small circles) that rotate on the outer periphery thereof. Is composed of twelve rotary heads 32 (large circles point to these) and twelve stations respectively.
[0006]
These 12 stations are a first station component supply unit (ST1), a second station mounting direction selection unit (ST2), a third station component thickness detection unit (ST3), and a fourth station component recognition unit (ST4). ), 5th station idle (ST5), 6th station rotation correction unit (ST6), 7th station component mounting unit (ST7), 8th station idle (ST8), 9th station defective product discharge unit (ST9), a suction nozzle selection unit (ST10) of the tenth station, a nozzle origin return unit (ST11) of the eleventh station, and a nozzle check unit (ST12) of the twelfth station.
[0007]
In the first station component supply unit (ST1), the electronic component is previously selected from five nozzles, for example, No. in the illustrated example. Adsorbs and rises with one nozzle. The mounting direction selection unit (ST2) of the second station rotates the sucked electronic component to the mounting angle, and the component thickness detection unit (ST3) of the third station measures the component thickness. The component recognition unit (ST4) of the fourth station recognizes an image of the attracted electronic component from directly below, and detects a positional deviation amount and an angular deviation amount. The idle (ST5) of the fifth station is idle, that is, a spare station, and the rotation correction unit (ST6) of the sixth station rotates the angle correction amount. The electronic component is mounted on the electronic circuit board CB at the component mounting portion (ST7) of the seventh station. The idle (ST8) of the eighth station is set to idle, and the defective product discharge unit (ST9) of the ninth station discharges electronic components that could not be mounted due to some malfunction (such as abnormal suction or recognition error). The suction nozzle selection unit (ST10) of the tenth station selects a nozzle suitable for the electronic component to be sucked next. In the nozzle origin return unit (ST11) of the eleventh station, the origin of the selected nozzle in the angular direction is obtained. Then, the nozzle check unit (ST12) of the twelfth station checks whether the nozzle is correctly selected.
[0008]
FIG. 10 shows a part of the electronic component supply means 7 shown in FIG. 8 and the component transfer means 3 comprising the rotary head 32 as the main part and the electronic circuit board positioning means 4 such as an XY table. It is the perspective view which showed arrangement | positioning relationship. The rotating rotary head 32 picks up a predetermined electronic component from the parts cassette 33 of the component supply unit (ST1) in the positional relationship as shown in the figure, and comes to the forefront station through the operation at each station. At that time, the electronic component is mounted on the electronic circuit board CB on the positioning means 4 such as an XY table.
[0009]
Next, operations of the conventional electronic component supply means 7, the component transfer means 3, and the positioning means 4 of the electronic circuit board CB shown in FIG. 10 will be described with reference to FIG.
First, the electronic component P is adsorbed from the parts cassette 33 of the component supply unit (ST1) by the nozzle 321 (for example, the No. 1 nozzle) (A in FIG. 1).
Next, the component transfer means 3 passes through the mounting direction selection section (ST2) of the second station and the component thickness detection section (ST3) of the third station, and then the component recognition section (ST4) of the fourth station. The component recognition camera 34, which is one of the elements, recognizes an image of the posture and position of the sucked electronic component P, and calculates a correction value of the position and angle (posture) (B in the figure).
The correction values ΔX, ΔY, Δθ obtained by the image recognition are corrected by the Y-axis motor 411, the X-axis motor 412 and the nozzle 321 of the XY table 41 of the positioning means 4 (C in the same figure), and the adsorbed electronic components P is mounted at a predetermined position on the electronic circuit board CB (FIG. 8).
[0010]
FIG. 12 conceptually shows the configuration of the electronic component supply means 7, the component transfer means 3, and the positioning means 4 of the electronic circuit board CB in the conventional general-purpose electronic component mounting apparatus 100B.
In this apparatus, a head 322 holding a nozzle 321 that sucks an electronic component P is moved by an XY table 41, and the electronic circuit board CB is fixed. The head 322 has an X axis, a Y axis, a Z axis, and a 0 axis.
Accordingly, the nozzle 321 picks up and picks up the electronic component P from the parts cassette 33 of the electronic component supply means 7 disposed on the back side of the apparatus, and the electronic component P is an element of the component transfer means 3. It is brought onto the fixed component recognition camera 34 and image recognition is performed. Reference numeral 35 denotes a board recognition camera. The board recognition camera 35 recognizes a predetermined position of the electronic circuit board CB, corrects the position and angle of the head 322 by this recognition, and removes the sucked electronic component P. Mount on the surface of the electronic circuit board CB. The mounting flow in this case is also the same as the process shown in FIG.
Although not specifically illustrated, the operation of the process shown in FIG. 11 is the same in the dedicated electronic component mounting apparatus that limits the electronic component P.
[0011]
[Problems to be solved by the invention]
By the way, in any of the conventional electronic component mounting apparatuses, as a factor affecting the mounting accuracy of the electronic component P,
1) Variation in shape and size of electronic component P
2) Position recognition error of electronic component P
3) Correction accuracy of correction values ΔX, ΔY, Δθ
4) Deviation when mounting electronic component P
And so on.
Therefore, when mounting components such as resistors and capacitors, such as 1005 (vertical 1 mm, horizontal 0.5 mm), 1608 (vertical 1.6 mm, horizontal 0.8 mm) without any gaps, Overlap and the like occur, and at present, a gap of 0.3 to 0.5 mm is required at the minimum. It can be seen that this gap is large from the size of the electronic component.
[0012]
It is an object of the present invention to obtain an electronic component mounting apparatus capable of ultimate ultra-high density mounting by eliminating the gap of 0.3 to 0.5 mm as described above and closely aligning the electronic components. Is.
[0013]
[Means for Solving the Problems]
In order to solve the above-described problem, an electronic component mounting apparatus according to an embodiment of the present invention includes:
An electronic component supply means for supplying a plurality of types of electronic components in which electrodes are derived only on one surface;
An electronic circuit board supply means for supplying an electronic circuit board on which the plurality of types of electronic components are surface-mounted;
Positioning means for positioning the electronic circuit board supplied from the electronic circuit board supply means at a predetermined position;
An intermediate stage disposed at a position near the electronic circuit board;
First component transfer means for transferring the plurality of types of electronic components from the electronic component supply means to the intermediate stage with a space therebetween;
A pressing means for pressing the side surfaces of a plurality of electronic components transferred at intervals to the intermediate stage to eliminate the intervals and to bring the electronic components into close contact with each other;
A second component transfer means for collectively holding the plurality of closely contacted electronic components and transferring them from the intermediate stage to a predetermined position of the electronic circuit board;
The above-mentioned problem is solved.
[0014]
Therefore, according to the electronic component mounting apparatus of the present invention, a plurality of electronic components are closely aligned on the intermediate stage, and then the plurality of closely aligned electronic components are collectively held by the dedicated nozzle on the electronic circuit board. Since it is mounted, ultra-high density mounting without gaps can be performed.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing the positional relationship among a part of electronic component supply means, component transfer means, and electronic circuit board positioning means in the high-speed electronic component mounting apparatus according to the first embodiment of the present invention, and FIG. FIG. 3 is a perspective view showing the structure of a dedicated nozzle according to an embodiment incorporated in the electronic component mounting apparatus shown in FIG. 1, and FIG. 3 shows the electronic component supply means and component transfer in the general-purpose electronic component mounting apparatus according to the second embodiment of the present invention. FIG. 4 is a conceptual perspective view showing the configuration of the mounting means and the positioning means of the electronic circuit board, and FIG. 4 is a dedicated nozzle station, a transfer nozzle, and an intermediate stage of one embodiment incorporated in the electronic component mounting apparatus shown in FIG. FIG. 5 is an operation explanatory diagram of the electronic component supply means, the component transfer means, and the electronic circuit board positioning means shown in FIGS. 1 and 3, and FIG. 6 is an intermediate view showing an embodiment. Perspective showing the structure of the stage And FIG. 7 is an explanatory diagram showing the operation of a plurality of electronic components and the intermediate stage in the intermediate stage shown in FIG.
In addition, the same code | symbol is attached | subjected and demonstrated to the component same as the component of the electronic component mounting apparatus of a prior art.
[0016]
First, a high-speed electronic component mounting apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
Since the overall configuration of the high-speed electronic component mounting apparatus is the same as that of the electronic component mounting apparatus 100A shown in FIG. 8, illustration and description of the configuration are omitted.
FIG. 1 shows main components of a high-speed electronic component mounting apparatus (hereinafter simply abbreviated as “electronic component mounting apparatus”) 10A according to the first embodiment of the present invention. As in the electronic component mounting apparatus 10 shown in FIG. 10, the electronic component mounting apparatus 10 </ b> A accommodates a plurality of types of electronic components that constitute the electronic component supply unit 7 and in which electrodes are led out only on one surface. It is composed of a plurality of parts cassettes 33, a rotary head 32 constituting the component transfer means 3, an XY table 41 constituting the electronic circuit board positioning means 4, and the like.
[0017]
In the electronic component mounting apparatus 10A shown in FIG. 1, an intermediate stage 50 is provided on the XY table 41, and the dedicated nozzle block 60 is provided from the same ceiling frame (not shown) to which the rotary head 32 is fixed. The component recognition camera 70 disposed in the vicinity thereof is provided in a fixed state.
The intermediate stage 50 has a function of closely aligning a plurality of electronic components before mounting them on the electronic circuit board CB, and the dedicated nozzle block 60 is composed of a plurality of dedicated nozzles. The electronic component group is collectively sucked and mounted on the electronic circuit board CB, and the component recognition camera 70 has a function of performing image processing on the batched electronic component group.
The structure and operation of the intermediate stage 50 and the dedicated nozzle block 60 will be described later. First, the main operation of the electronic component mounting apparatus 10A of the present invention will be described.
[0018]
The electronic component P is picked up and corrected by a predetermined transfer nozzle 321 of the rotary head 32 one by one from the parts cassette 33 arranged behind the electronic component mounting apparatus 10A, and the component transfer shown in FIG. 9 is performed. When coming to the component mounting part (ST7) of the seventh station of means 3, the XY table 41 on which the electronic circuit board CB is placed is moved and stopped so that the intermediate stage 50 comes directly under the transfer nozzle 321. Yes. In this electronic component mounting apparatus 10A, instead of mounting the electronic component P sucked by the transfer nozzle 321 on the electronic circuit board CB, the sucked electronic component P is transferred onto the intermediate stage 50. Align and install with a pre-programmed required number and a gap of 0.3-0.4mm or more in the required direction. Next, as will be described later with reference to FIGS. 6 and 7, the plurality of electronic components P mounted with a gap of 0.3 to 0.4 mm or more on the intermediate stage 50 are placed horizontally on the X and Y axes. Move to the direction to eliminate gaps and align closely. A plurality of these electronic parts groups in close contact are collectively sucked using a dedicated nozzle 61 selected from the dedicated nozzle block 60 according to the surface area size of the entire electronic parts group, and the part recognition camera is used as necessary. After performing image processing at 70 and correcting the position, it is mounted on the original electronic circuit board CB.
[0019]
Next, an example of the dedicated nozzle block 60 provided with the dedicated nozzle 61 for collectively sucking and picking up will be described with reference to FIG.
A plurality of dedicated nozzle blocks 60, in the embodiment, five dedicated nozzles 61 are held at predetermined angular intervals in a cylindrical nozzle block 62 that can rotate in the direction of arrow Ra. A suction plate 61A having a surface area of a size corresponding to the surface area of a plurality of closely arranged electronic component groups is attached to the tip of each dedicated nozzle 61.
Each dedicated nozzle 61 is mounted in such a structure that can independently move up and down in the direction of arrow Zb and rotate (360 degrees) in the direction of arrow Rb, and can be individually selected. Only a selected dedicated nozzle 61 opens a vacuum circuit (not shown), and the electronic component group can be sucked.
Each of the dedicated nozzles 61 has a structure in which only the tip is detachable and can be exchanged, and the dedicated nozzle 61 to be used can be freely combined.
[0020]
As an operation, first, the dedicated nozzle 61 to be used is selected, and then the angle θ of the dedicated nozzle 61 is adjusted. Then, the dedicated nozzle block 60 descends in the vertical direction indicated by the arrow Za, and the electronic component group that is in close contact with the intermediate stage 50 is collectively sucked. When high accuracy is required, image processing is performed to obtain position correction data of the electronic component group sucked by the selected dedicated nozzle 61. Then, the electronic component group attracted by determining the angle of the dedicated nozzle 61 and the position of the XY table 41 is collectively mounted on the electronic circuit board CB, and one cycle of component mounting is completed.
[0021]
Next, FIG. 3 shows a general-purpose electronic component mounting apparatus (hereinafter simply referred to as “electronic component mounting apparatus”) 10B according to a second embodiment of the present invention. The electronic component mounting apparatus 10B is different from the electronic component mounting apparatus 10A shown in FIG. 1 in that the electronic circuit board CB is fixed and a plurality of types of parts cassettes 33 are used, as in the prior art shown in FIG. The head 322 that holds the transfer nozzle 321 that sucks the electronic component moves in the X-axis, Y-axis, Z-axis, and θ-axis directions and can be positioned. The intermediate stage 50 is horizontally disposed in the vicinity of the electronic circuit board CB, and a component recognition camera 70 is disposed in the vicinity thereof. In addition, as will be described later, a dedicated nozzle station 80 in which a plurality of dedicated nozzles 61 for collectively sucking a plurality of electronic components P are placed on a horizontal cradle 81 is also arranged near the electronic circuit board CB. It is installed. These dedicated nozzles 61 are configured by a mechanism that is programmed in advance with the transfer nozzle 321 and can be automatically replaced. Reference numeral 35 denotes a substrate recognition camera 35 that performs the same function as that shown in FIG.
[0022]
Also in this electronic component mounting apparatus 10 </ b> B, first, a predetermined number of electronic components are transferred onto the intermediate stage 50 by a necessary number of transfer nozzles 321 from a plurality of types of parts cassettes 33 arranged at the rear. Next, as will be described later with reference to FIGS. 6 and 7, the plurality of electronic components P transferred with a gap on the intermediate stage 50 are placed on the X axis in the same manner as in the electronic component mounting apparatus 10 </ b> A. , Move to the horizontal direction of the Y-axis to eliminate gaps and align closely. The plurality of electronic parts P that are closely aligned are collectively sucked using a dedicated nozzle 61 selected from the dedicated nozzle station 80 according to the size of the entire electronic part group, and the part recognition camera 70 is used as necessary. After image processing is performed and position correction is performed, it is mounted on the original electronic circuit board CB.
[0023]
As shown in FIG. 4, the dedicated nozzle station 80 is arranged in the vicinity of the electronic circuit board CB and in alignment with the component recognition camera 70 with the intermediate stage 50 interposed therebetween. The dedicated nozzle station 80 holds a plurality of dedicated nozzles 61 on a cradle 81 placed in a horizontal state. The cradle 81 is provided with a station 82 on which the transfer nozzle 321 can be placed. A suction plate 61A having a different size according to the surface area of the electronic component group is attached to the tip of the dedicated nozzle 61, and a suction hole (not shown) is formed in the center of each suction plate 61A. Yes.
These dedicated nozzles 61 are selected in accordance with the surface areas of a plurality of electronic component groups closely attached to the intermediate stage 50 and are exchanged with the transfer nozzles 321 attached to the head 322. At the time of replacement, the transfer nozzle 321 is temporarily placed on the station 82 and the selected dedicated nozzle 61 is attached to the head 322. This replacement is automatically performed in accordance with a group of electronic components that are pre-programmed and are to be packaged together.
[0024]
Next, the mounting operation of the electronic component mounting apparatuses 10A and 10B according to the present invention will be described with reference to FIG.
The electronic components P are picked up and picked up by the transfer nozzle 321 from the parts cassette 33 of the parts supply unit (ST1) in the order programmed in advance (A in the figure).
The picked-up electronic component P is borrowed on the intermediate stage 50 (FIG. B).
These pickup and borrowing operations are repeated as many times as necessary.
Next, on the intermediate stage 50, a plurality of electronic components P are offset by the X-axis pressing plate 55 driven by the actuator 56 and by the Y-axis pressing plate 57 driven by the actuator 58, and the electronic components are moved together. Align closely (Fig. C).
Thereafter, a dedicated nozzle 61 that matches the surface area size of the entire electronic component group closely aligned is selected from the dedicated nozzle block 60 (FIG. 2), and the electronic component group on the intermediate stage 50 is collectively collected using the dedicated nozzle 61. Adsorb (D in the figure).
Then, the component position is recognized by the component recognition camera 70 for the entire group of electronic components sucked together, and the correction value of the suction position and angle (orientation) of the entire electronic component P is calculated by the electrical means 8 (FIG. 8). (Fig. E).
ΔX and ΔY are applied to the X-axis motor 412 and Y-axis motor 411 by the respective correction values obtained in this calculation to control the XY table 41, and Δθ is corrected by rotating the dedicated nozzle 61 (F in FIG. ).
Thereafter, a plurality of electronic components P are collectively mounted on the electronic circuit board CB (FIG. G).
[0025]
Next, an example of the structure of the intermediate stage 50 and its operation will be described with reference to FIGS.
This intermediate stage 50 is perpendicular to the X-axis direction reference plate 52 having a predetermined length on which a reference surface 52X is formed along one side of the substrate 51 having a smooth surface as a reference surface 51Z. A Y-axis direction reference plate 53 having a predetermined length on which the reference surface 53Y is formed is integrally formed in an L shape and fixed.
In the area corresponding to the reference surface 52X and the reference surface 53Y of the substrate 51, for example, a plurality of vacuum holes 54 are formed two-dimensionally at a pitch of 0.5 mm or less. These vacuum holes 54 are preferably provided with a valve (not shown) and can be selected so that only necessary holes can be used.
An X-axis pressing plate 55 that is slid and driven in the direction of the reference surface 52X by an actuator 56 (air drive, electric drive) in parallel to the X-axis direction reference plate 52 while maintaining a predetermined distance. A Y-axis pressing plate 57 is slid and driven in the direction of the reference surface 53Y by an actuator 58 (air drive, electric drive) in parallel to the Y-axis direction reference plate 53 while maintaining a predetermined distance. It is arranged. Both actuators 56 and 58 are fixed on the substrate 51.
[0026]
The intermediate stage 50 is configured as described above. Next, the operation of the intermediate stage 50 will be described with reference to FIG.
FIG. 3A shows a state in which a plurality of electronic components P are supplied onto the substrate 51 of the intermediate stage 50. All the electronic components P are vacuum-adsorbed via the vacuum holes 54 on the lower surface thereof, and the reference It is held on the surface 51Z.
Next, as shown in FIG. B, for example, the actuator 56 in the X-axis direction is driven to slide and move the X-axis pressing plate 55 toward the reference surface 52X, and is attracted to the reference surface 51Z. The electronic component P is pressed against the reference surface 52X of the X-axis direction reference plate 52 against the suction force, and the gap in the X-axis direction between the electronic components P is eliminated. After eliminating the gap as described above, the driving of the actuator 56 is released, and the X-axis pressing plate 55 is retracted to the original position.
Next, the actuator 58 in the Y-axis direction is driven to slide and move the Y-axis pressing plate 57 toward the reference surface 53Y, so that the electronic component P attracted to the reference surface 51Z is resisted by its attracting force. Then, it is pressed against the reference surface 53Y of the Y-axis direction reference plate 53 to eliminate the gap in the Y-axis direction between the electronic components P. After eliminating the gap as described above, the driving of the actuator 58 is released, and the Y-axis pressing plate 57 is retracted to the original position.
In this way, the operation on the intermediate stage 50 is completed, and there is no gap between all the electronic components temporarily placed on the substrate 51 with a gap between them, so that they are closely aligned.
[0027]
The intermediate stage 50 in each of the above embodiments is disposed on the XY table 41 or in the vicinity of the electronic circuit board CB. However, the intermediate stage 50 is not limited to such a configuration and is independent of the electronic component mounting apparatus. May be provided.
Further, in each of the above embodiments, the electronic component P is temporarily placed on the intermediate stage 50 from the parts cassette 33 using the transfer nozzle 321 by the one-by-one method. This is useful when you want to divert and minimize capital investment. However, if it is possible to invest in new equipment, the transfer nozzle that can pick up multiple types of electronic components collectively from multiple types of parts cassettes that store multiple types of electronic components will be specially tailored. It may be mounted on a component mounting apparatus. With such an electronic component mounting apparatus, mounting of the electronic component group can be shortened.
Furthermore, the dedicated nozzle 61 in the general-purpose electronic component mounting apparatus 10B shown in FIGS. 3 and 4 may adopt a configuration in which a dedicated nozzle is independently provided in addition to the configuration in which the dedicated nozzle 61 is replaced with the transfer nozzle 321. Let me add.
[0028]
【The invention's effect】
As is clear from the above description, according to the electronic component mounting apparatus of the present invention, the following effects can be obtained. That is,
1. Ultimate ultra-high density mounting is possible.
2. By using a dedicated nozzle, there is no risk of damage to adjacent parts and mounting defects (bending, missing parts, misalignment) found in the one-by-one method, and mounting efficiency is improved.
3. By providing an intermediate stage, close alignment according to variations in the dimensions of electronic components
Size and flexibility are high.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an arrangement relationship among a part of electronic component supply means, component transfer means, and electronic circuit board positioning means in a high-speed electronic component mounting apparatus according to a first embodiment of the present invention.
2 is a perspective view showing a structure of a dedicated nozzle according to an embodiment incorporated in the electronic component mounting apparatus shown in FIG. 1;
FIG. 3 is a conceptual perspective view showing a configuration of electronic component supply means, component transfer means, and electronic circuit board positioning means in a general-purpose electronic component mounting apparatus according to a second embodiment of the present invention.
4 is a perspective view showing an arrangement relationship between a dedicated nozzle station, a transfer nozzle, and an intermediate stage according to an embodiment incorporated in the electronic component mounting apparatus shown in FIG. 3;
5 is an operation explanatory diagram of the electronic component supply means, the component transfer means, and the electronic circuit board positioning means shown in FIGS. 1 and 3. FIG.
FIG. 6 is a perspective view showing a structure of an intermediate stage showing an embodiment.
7 is an explanatory diagram showing operations of a plurality of electronic components and the intermediate stage in the intermediate stage shown in FIG. 6. FIG.
FIG. 8 is an external perspective view of a conventional high-speed electronic component mounting apparatus.
9 is a conceptual block diagram of the component transfer means shown in FIG.
10 is a perspective view showing a positional relationship among a part of the electronic component supply means, the component transfer means, and the positioning means for the electronic circuit board shown in FIG. 8;
11 is an operation explanatory diagram of the electronic component supply means, the component transfer means, and the electronic circuit board positioning means shown in FIG.
FIG. 12 is a conceptual perspective view showing a configuration of an electronic component supply unit, a component transfer unit, and an electronic circuit board positioning unit in a general-purpose electronic component mounting apparatus according to the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10A ... Electronic component mounting apparatus of 1st Embodiment of this invention, 10B ... Electronic component mounting apparatus of 2nd Embodiment of this invention, 3 ... Component transfer means, 31 ... Rotary mechanism, 32 ... Rotary head, 321 ... Transfer Mounting nozzle, 33 ... part cassette, 41 ... XY table, 50 ... intermediate stage, 51 ... substrate, 52 ... X-axis direction reference plate, 52X ... reference plane (of X-axis direction reference plate 52), 53Y ... Y-axis direction reference Plate, 53Y ... reference plane (of Y-axis direction reference plate 53), 54 ... Vacuum hole, 56, 58 ... Actuator, 60 ... Dedicated nozzle block, 61 ... Dedicated nozzle, 61A ... Suction plate, 70 ... Component recognition camera, 80 ... Dedicated nozzle station, cradle, 82 ... (for transfer nozzle 321) station, CB ... Electronic circuit board, P ... Electronic component

Claims (6)

An electronic component supply means for supplying a plurality of types of electronic components in which electrodes are derived only on one surface;
An electronic circuit board supply means for supplying an electronic circuit board on which the plurality of types of electronic components are surface-mounted;
Positioning means for positioning the electronic circuit board supplied from the electronic circuit board supply means at a predetermined position;
An intermediate stage capable of temporarily placing the plurality of types of electronic components spaced from each other from the electronic component supply means;
First component transfer means for transferring the plurality of types of electronic components from the electronic component supply means to the intermediate stage with a space therebetween;
A pressing means for pressing the side surfaces of a plurality of electronic components transferred at intervals to the intermediate stage to eliminate the intervals and to bring the electronic components into close contact with each other;
An electronic component comprising: a second component transfer means that collectively holds the plurality of closely contacted electronic components and transfers them from the intermediate stage to a predetermined position of the electronic circuit board. Mounting device.   The electronic component mounting apparatus according to claim 1, wherein the intermediate stage is disposed in the vicinity of the electronic circuit board.   2. The electronic device according to claim 1, wherein the second component transfer means is configured by a plurality of dedicated nozzles each having a suction plate with a different suction area attached to the block by a selectable mechanism. Component mounting equipment.   The said 2nd component transfer means is equipped with the mechanism which can replace | exchange the some exclusive nozzle provided with the adsorption | suction board from which the adsorption | suction area with which the adsorption | suction area differs was mounted on the receiving stand in a horizontal state. The electronic component mounting apparatus described in 1.   3. The electronic component mounting apparatus according to claim 1, wherein a plurality of electronic components temporarily placed on the intermediate stage are held on the intermediate stage by air suction. A horizontal surface having a smooth surface is formed, and an L-shaped reference member having a smooth reference surface in the X-axis direction and the Y-axis direction perpendicular to each other is formed on the smooth surface. A pressing device comprising an X-axis pressing plate that can move only in the X-axis direction and a Y-axis pressing plate that can move only in the Y-axis direction to a position opposed to the reference plane in the X-axis and Y-axis directions with a predetermined interval. are disposed, the electronic components temporarily placed at a distance of more, by sequentially pressing the X-axis and Y-axis direction, the intermediate stage, characterized in Rukoto is adhered aligned so that no gap .
[0001]

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