JPH11177214A5 - - Google Patents

Info

Publication number
JPH11177214A5
JPH11177214A5 JP1998192270A JP19227098A JPH11177214A5 JP H11177214 A5 JPH11177214 A5 JP H11177214A5 JP 1998192270 A JP1998192270 A JP 1998192270A JP 19227098 A JP19227098 A JP 19227098A JP H11177214 A5 JPH11177214 A5 JP H11177214A5
Authority
JP
Japan
Prior art keywords
immerse
rinse
minutes
water
promoter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998192270A
Other languages
English (en)
Japanese (ja)
Other versions
JP4249291B2 (ja
JPH11177214A (ja
Filing date
Publication date
Priority claimed from US08/868,092 external-priority patent/US6565731B1/en
Application filed filed Critical
Publication of JPH11177214A publication Critical patent/JPH11177214A/ja
Publication of JPH11177214A5 publication Critical patent/JPH11177214A5/ja
Application granted granted Critical
Publication of JP4249291B2 publication Critical patent/JP4249291B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP19227098A 1997-06-03 1998-06-03 電解めっき方法 Expired - Fee Related JP4249291B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US868092 1997-06-03
US08/868,092 US6565731B1 (en) 1997-06-03 1997-06-03 Electroplating process

Publications (3)

Publication Number Publication Date
JPH11177214A JPH11177214A (ja) 1999-07-02
JPH11177214A5 true JPH11177214A5 (https=) 2008-11-06
JP4249291B2 JP4249291B2 (ja) 2009-04-02

Family

ID=25351058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19227098A Expired - Fee Related JP4249291B2 (ja) 1997-06-03 1998-06-03 電解めっき方法

Country Status (5)

Country Link
US (1) US6565731B1 (https=)
EP (1) EP0883331B1 (https=)
JP (1) JP4249291B2 (https=)
KR (1) KR100674116B1 (https=)
DE (1) DE69832845T2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
JP4055319B2 (ja) * 2000-02-18 2008-03-05 ソニー株式会社 半導体装置の製造方法
EP1202384A1 (de) * 2000-10-31 2002-05-02 Molekulare Energietechnik AG Funkantenne als Sendeantenne oder Empfangsantenne und Mobilfunksystem
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
JP4783954B2 (ja) * 2004-06-21 2011-09-28 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
US7214304B2 (en) * 2004-10-13 2007-05-08 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
JP4806808B2 (ja) * 2005-07-05 2011-11-02 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
WO2007112554A1 (en) * 2006-03-30 2007-10-11 Metafoam Technologies Inc. Method for partially coating open cell porous materials
JP4692363B2 (ja) * 2006-04-10 2011-06-01 日立電線株式会社 配線基板のめっき形成方法、及びめっき装置
JP5715748B2 (ja) * 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解めっき用コンディショナー
US8161637B2 (en) * 2009-07-24 2012-04-24 Ibiden Co., Ltd. Manufacturing method for printed wiring board
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법
US10986738B2 (en) 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674711A (en) * 1969-12-10 1972-07-04 Varian Associates Electrically conductive transparent plastic material
CA956850A (en) 1970-03-16 1974-10-29 Frederick W. Schneble (Jr.) Direct bonding of electroless metals to substrates
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4309247A (en) * 1976-03-15 1982-01-05 Amf Incorporated Filter and method of making same
US4701350B2 (en) 1980-11-06 1997-08-05 Surface Technology Corp Process for electroless metal deposition
US4515829A (en) 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
US4619741A (en) 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5110355A (en) * 1990-03-26 1992-05-05 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
US5683565A (en) * 1995-06-09 1997-11-04 Shipley Company, L.L.C. Electroplating process
US5611905A (en) 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process

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