JPH11147942A5 - - Google Patents

Info

Publication number
JPH11147942A5
JPH11147942A5 JP1998255966A JP25596698A JPH11147942A5 JP H11147942 A5 JPH11147942 A5 JP H11147942A5 JP 1998255966 A JP1998255966 A JP 1998255966A JP 25596698 A JP25596698 A JP 25596698A JP H11147942 A5 JPH11147942 A5 JP H11147942A5
Authority
JP
Japan
Prior art keywords
component
composition
formula
group
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998255966A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11147942A (ja
JP4196365B2 (ja
Filing date
Publication date
Application filed filed Critical
Publication of JPH11147942A publication Critical patent/JPH11147942A/ja
Publication of JPH11147942A5 publication Critical patent/JPH11147942A5/ja
Application granted granted Critical
Publication of JP4196365B2 publication Critical patent/JP4196365B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP25596698A 1997-08-27 1998-08-26 疎水性エポキシ樹脂系 Expired - Fee Related JP4196365B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH199797 1997-08-27
CH1997/97 1997-08-27

Publications (3)

Publication Number Publication Date
JPH11147942A JPH11147942A (ja) 1999-06-02
JPH11147942A5 true JPH11147942A5 (enExample) 2005-11-04
JP4196365B2 JP4196365B2 (ja) 2008-12-17

Family

ID=4223487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25596698A Expired - Fee Related JP4196365B2 (ja) 1997-08-27 1998-08-26 疎水性エポキシ樹脂系

Country Status (6)

Country Link
US (1) US6048946A (enExample)
EP (1) EP0899304B1 (enExample)
JP (1) JP4196365B2 (enExample)
CA (1) CA2245469A1 (enExample)
DE (1) DE59812650D1 (enExample)
ES (1) ES2237832T3 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2351333A1 (en) * 1998-12-09 2000-06-15 Vantico Ag Hydrophobic epoxide resin system
US6764616B1 (en) 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
DE10144871A1 (de) * 2001-09-12 2003-03-27 Bosch Gmbh Robert Vergußmasse mit hoher thermischer Stabilität
EP1354916A1 (de) * 2002-04-17 2003-10-22 Abb Research Ltd. Selbstheilende Epoxidharze für die Herstellung von elektrischen Isolierungen
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
EP1905046B1 (fr) * 2005-07-20 2013-04-24 ALSTOM Technology Ltd Isolateur electrique et procede de fabrication.
CN100462384C (zh) * 2006-06-22 2009-02-18 上海交通大学 一种环氧真空压力浸渍树脂的制备方法
US7879944B2 (en) * 2006-09-20 2011-02-01 E.I. Du Pont De Nemours And Company Paintable thermoplastic compositions
CN101440268B (zh) * 2008-12-30 2012-06-27 黑龙江省科学院石油化学研究院 低温固化耐高温无机/有机杂化环氧胶粘剂及其制备方法
WO2013029831A1 (en) 2011-08-31 2013-03-07 Huntsman Advanced Materials (Switzerland) Gmbh Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer
CN104144964B (zh) 2011-12-30 2016-11-09 陶氏环球技术有限责任公司 用于绝缘应用的与官能硅烷相容的环氧组合物
CN109415496A (zh) * 2016-07-12 2019-03-01 Abb瑞士股份有限公司 环氧树脂组合物和具有环氧树脂组合物的电力产品的用途
JP6897041B2 (ja) * 2016-09-23 2021-06-30 昭和電工マテリアルズ株式会社 配線板用樹脂組成物、プリプレグ、積層板及び配線板
ES2993018T3 (en) 2018-03-16 2024-12-20 Huntsman Adv Mat Switzerland Storage stable and curable resin compositions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926885A (en) * 1974-12-23 1975-12-16 Dow Corning Siloxane-modified epoxy resin compositions
US4332923A (en) * 1980-10-23 1982-06-01 Dow Corning Corporation Composition for coating heat sensitive substrates
JP2927817B2 (ja) * 1989-05-19 1999-07-28 日東電工株式会社 半導体装置
JPH03277654A (ja) * 1990-03-27 1991-12-09 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH0433914A (ja) * 1990-05-30 1992-02-05 Sunstar Eng Inc 液状エポキシ樹脂組成物
US5523374A (en) * 1992-12-03 1996-06-04 Hercules Incorporated Curable and cured organosilicon compositions
JP3923542B2 (ja) * 1994-04-08 2007-06-06 株式会社東芝 樹脂モールド品及びそれを用いた重電機器

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