JPH11145284A5 - - Google Patents

Info

Publication number
JPH11145284A5
JPH11145284A5 JP1997307641A JP30764197A JPH11145284A5 JP H11145284 A5 JPH11145284 A5 JP H11145284A5 JP 1997307641 A JP1997307641 A JP 1997307641A JP 30764197 A JP30764197 A JP 30764197A JP H11145284 A5 JPH11145284 A5 JP H11145284A5
Authority
JP
Japan
Prior art keywords
sccm
film
blanket cvd
processed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997307641A
Other languages
English (en)
Japanese (ja)
Other versions
JP3617283B2 (ja
JPH11145284A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP30764197A priority Critical patent/JP3617283B2/ja
Priority claimed from JP30764197A external-priority patent/JP3617283B2/ja
Publication of JPH11145284A publication Critical patent/JPH11145284A/ja
Publication of JPH11145284A5 publication Critical patent/JPH11145284A5/ja
Application granted granted Critical
Publication of JP3617283B2 publication Critical patent/JP3617283B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP30764197A 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置 Expired - Fee Related JP3617283B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30764197A JP3617283B2 (ja) 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30764197A JP3617283B2 (ja) 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置

Publications (3)

Publication Number Publication Date
JPH11145284A JPH11145284A (ja) 1999-05-28
JPH11145284A5 true JPH11145284A5 (enExample) 2004-12-02
JP3617283B2 JP3617283B2 (ja) 2005-02-02

Family

ID=17971493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30764197A Expired - Fee Related JP3617283B2 (ja) 1997-11-10 1997-11-10 半導体装置の製造方法およびこれを用いた半導体装置

Country Status (1)

Country Link
JP (1) JP3617283B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769426B2 (ja) 1999-09-22 2006-04-26 東京エレクトロン株式会社 絶縁膜形成装置
KR20010066380A (ko) * 1999-12-31 2001-07-11 박종섭 다층 배선을 갖는 반도체장치의 제조방법
JP3926588B2 (ja) * 2001-07-19 2007-06-06 キヤノンマーケティングジャパン株式会社 半導体装置の製造方法
US6919101B2 (en) * 2003-02-04 2005-07-19 Tegal Corporation Method to deposit an impermeable film on porous low-k dielectric film
JP2009170544A (ja) * 2008-01-11 2009-07-30 Rohm Co Ltd 半導体装置
JP4865829B2 (ja) * 2009-03-31 2012-02-01 シャープ株式会社 半導体装置およびその製造方法
JP2012530362A (ja) * 2009-06-19 2012-11-29 アイメック 金属／有機誘電体界面でのクラックの低減
JP2012213873A (ja) * 2011-03-31 2012-11-08 Fujifilm Corp 撥水膜の形成方法、ノズルプレート、インクジェットヘッド、および、インクジェット記録装置
GB201304611D0 (en) * 2013-03-14 2013-05-01 Univ Surrey A carbon fibre reinforced plastic

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